Power converter module with cooled busbar arrangement

• US 8,599,556 B2
• Filed: 09/29/2009
• Issued: 12/03/2013
• Est. Priority Date: 12/10/2008
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Hentschel, Stefan, Ponath, Harald
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US13/133,836
• Publication Number:
  US 20110235276A1
• Time in Patent Office: 1,526 Days
• Field of Search: 361/699
• US Class Current: 361/699
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/5387 in a bridge configuration
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A power converter module with a liquid-cooled heat sink, a busbar arrangement having at least two busbars, at least two power semiconductor modules, which are mechanically connected to the liquid-cooled heat sink for thermal conduction and are electrically connected to connections of the power converter module by the busbar arrangement has at least one coolant line forming a single structural unit with the busbar arrangement. The coolant line prevents additional power loss in the laminated busbar.

Claims

1. A power converter module, comprising:

a liquid-cooled heat sink;

a busbar arrangement having at least two busbars which are electrically isolated from one another;

at least two power semiconductor modules, which are mechanically connected to the liquid-cooled heat sink for thermal conduction and are electrically connected to connections of the power converter module by the busbar arrangement; and

at least one coolant line forming a single structural unit with the busbar arrangement,

wherein the busbar arrangement and the at least one coolant line are laminated with one another.

2. The power converter module of claim 1, wherein the at least one coolant line is connected to the liquid-cooled heat sink for fluid conduction.

3. The power converter module of claim 1, wherein the at least one coolant line is arranged in a meander pattern extending along a surface of the busbar arrangement.

4. The power converter module of claim 1, wherein the at least one coolant line is made of an electrically non-conductive plastic material.