Process of manufacturing a light

• US 8,601,682 B2
• Filed: 09/10/2009
• Issued: 12/10/2013
• Est. Priority Date: 09/11/2008
• Status: Expired due to Fees

• Current Assignee: Revolution Lighting Technologies, Inc.
• Original Assignee: Nexxus Lighting, Inc.
• Inventors: Grajcar, Zdenko
• Primary Examiner(s): Nguyen, Donghai D.
• Application Number:
  US12/557,222
• Publication Number:
  US 20100212149A1
• Time in Patent Office: 1,552 Days
• Field of Search: 29830-832, 298/40, 298/46, 298/52, 361/792, 361/803, 362/294, 362/373, 362/800
• US Class Current: 29/840
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10818 Flat leads
• CPC Class Codes: H05K 2203/0169 Using a temporary frame during processing
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/306 Lead-in-hole components, e.g. affixing or retention before soldering, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A light circuit manufacturing process includes forming a palletized driver PCB board having a plurality of driver PCBs, forming a plurality of power PCBs on a palletized surface, forming slots in the driver PCBs, forming holes in the power PCBs, aligning both the power PCB palletization and the driver PCB palletization using reference holes such that the edges of each extend further in one direction or the other, and inserting thermal tabs into both the power PCB and the driver PCB.

Claims

1. A light circuit manufacturing process comprising:

forming a palletized driver printed circuit board (PCB) having a plurality of driver PCBs;

forming a palletized power PCB having a plurality of power PCBs;

forming slots in the driver PCBs;

forming holes in the power PCBs;

aligning both the palletized power PCB and the palletized driver PCB using reference holes such that edges of each palletized PCB extend further in one direction or the other with respect to the other palletized PCB;

inserting at least one thermal tab into both the power PCB and the driver PCB;

arranging components on the driver PCB using an automated machine;

performing a first reflow process;

cooling the first reflow process;

positioning the power PCB and driver PCB arrangement;

placing light components on the power PCB board; and

performing a second reflow process on the power PCB board and the light components.

2. The light circuit manufacturing process according to claim 1 wherein the positioning the power PCB and driver PCB arrangement comprises flipping and turning the power PCB and driver PCB arrangement.

3. The light circuit manufacturing process of claim 1, wherein the at least one thermal tab comprises a plurality of thermal tabs, at least one of the plurality of thermal tabs being configured as a power conductor.

4. A LED light circuit manufacturing process comprising:

forming a palletized driver printed circuit board (PCB) having a plurality of driver PCBs;

forming a palletized power PCB having a plurality of power PCBs;

forming slots in the driver PCBs;

forming holes in the power PCBs;

aligning both the palletized power PCB and the palletized driver PCB using reference holes such that edges of each palletized PCB extend further in one direction or the other with respect to the other palletized PCB;

inserting at least one thermal tab into both the power PCB and the driver PCB

arranging components on the driver PCB using an automated machine;

performing a first reflow process;

cooling the first reflow process

positioning the power PCB and driver PCB arrangement;

placing LEDs on the power PCB board; and

performing a second reflow process on the power PCB board and LED.

5. The LED light circuit manufacturing process according to claim 4 wherein the positioning the power PCB and driver PCB arrangement comprises flipping and turning the power PCB and driver PCB arrangement.

6. The LED light circuit manufacturing process of claim 4, wherein the at least one thermal tab comprises a plurality of thermal tabs, at least one of the plurality of thermal tabs being configured as a power conductor.