×

Room temperature bonding using sputtering

  • US 8,602,289 B2
  • Filed: 09/06/2007
  • Issued: 12/10/2013
  • Est. Priority Date: 09/06/2006
  • Status: Active Grant
First Claim
Patent Images

1. A method for room-temperature bonding a plurality of substrates via intermediate members, comprising:

  • providing said plurality of substrates, only a single physical sputtering source, and a plurality of targets such that said plurality of substrates is arranged at a position away from an axis line of said only a single physical sputtering source and at least one of said plurality of targets is arranged at a position away from said axis line, said axis line starting at a center of said only a single physical sputtering source and being parallel to a direction in which said only a single physical sputtering source faces, said axis line extending beyond said only a single physical sputtering source past said plurality of substrates and at least one of said plurality of targets;

    forming said intermediate members on surfaces to be bonded of said plurality of substrates by physically sputtering said plurality of targets including the at least one said target arranged at a position away from said axis line using said only a single physical sputtering source;

    activating said surfaces to be bonded of said plurality of substrates by physical sputtering using said only a single physical sputtering source; and

    bonding said plurality of substrates.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×