×

Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination

  • US 8,603,288 B2
  • Filed: 01/18/2008
  • Issued: 12/10/2013
  • Est. Priority Date: 01/18/2008
  • Status: Active Grant
First Claim
Patent Images

1. A process for performing a planarization treatment of pressure-sensitive adhesive (PSA), comprising:

  • positioning a first substrate onto a support surface of a planarization tool;

    placing at least one layer of PSA onto the first substrate;

    positioning a second substrate onto the layer(s) of PSA;

    selecting a predetermined duration of time based on a desired level of flatness for a flattened PSA;

    applying a pressure to the second substrate via a flexible membrane for the predetermined duration of time to form the flattened PSA, said pressure being applied in a generally uniform, unidirectional and localized manner, wherein the applied pressure flattens the PSA between the first substrate and the second substrate to form the flattened PSA;

    removing the flattened PSA from the planarization tool and the second substrate; and

    removing the second substrate from the planarization tool; and

    adhering the flattened PSA to a display component in a subsequent rigid-to-rigid lamination process after removal of the flattened PSA from the planarization tool and the second substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×