Method for electrochemical fabrication

• US 8,603,316 B2
• Filed: 06/23/2011
• Issued: 12/10/2013
• Est. Priority Date: 04/04/1997
• Status: Expired due to Fees

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Cohen, Adam L.
• Primary Examiner(s): Hendricks, Keith D.
• Assistant Examiner(s): Sherrill, Stefanie
• Application Number:
  US13/167,451
• Publication Number:
  US 20110247941A1
• Time in Patent Office: 901 Days
• Field of Search: 205/118
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Claims

1. An electroplating method for fabricating a multi-layer three-dimensional structure, comprising:

(i) forming a first layer comprising depositing at least a first structural material and at least a first sacrificial material and planarizing the deposited first structural material and first sacrificial material to set a boundary level of the first layer;

(ii) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing at least one additional structural material and depositing at least one additional sacrificial material and planarizing the at least one deposited additional structural material and the at least one additional sacrificial material to set a boundary level for each additional layer;

wherein the depositing of a first and second selected material for a given one of the additional layers comprises;

a) depositing a first selected material for the given layer using a first patterned mask; and

b) depositing a second selected material for the given layer using a second patterned mask that results in at least a portion of the second selected material being deposited in a lateral region of the given layer that is different from the lateral region occupied by the first selected material; and

wherein the first and second selected materials are selected from the group consisting of the at least one additional sacrificial material and the at least one additional structural material; and

(iii) removing at least a portion of the at least one sacrificial material deposited on a plurality of layers after formation of the additional layers to at least partially release the three-dimensional structure from the sacrificial material, and

wherein at least a portion of the depositing steps are electroplating steps.

2. The method of claim 1 wherein the first selected material comprises at least one additional structural material and the second selected material comprises at least one additional structural material.

3. The method of claim 1 wherein the first selected material comprises at least one additional sacrificial material and the second selected material comprises at least one additional structural material.

4. An electroplating method for fabricating a multi-layer three-dimensional structure, comprising:

(i) forming a first layer comprising depositing at least a first structural material and at least a first sacrificial material and planarizing the deposited first structural material and first sacrificial material to set a boundary level of the first layer;

(ii) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing at least one additional structural material and depositing at least one additional sacrificial material and planarizing the at least one deposited additional structural material and the at least one additional sacrificial material to set a boundary level for each additional layer;

wherein the depositing of a first and second selected material for a given one of the additional layers comprises;

a) depositing a first selected material for the given layer using a first patterned mask; and

b) depositing a second selected material for the given layer that is different from the first selected material using a second patterned mask which is different from the first patterned mask that results in at least a portion of the second selected material being deposited in a lateral region of the given layer that is different from the lateral region occupied by the first selected material; and

wherein the first and second selected materials are selected from the group consisting of the at least one additional sacrificial material and the at least one additional structural material; and

(iii) removing at least a portion of the at least one sacrificial material deposited on a plurality of layers after formation of the additional layers to at least partially release the three-dimensional structure from the sacrificial material, and

wherein at least a portion of the depositing steps are electroplating steps.