Component package for maintaining safe operating temperature of components

• US 8,604,361 B2
• Filed: 01/20/2010
• Issued: 12/10/2013
• Est. Priority Date: 12/13/2005
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Sun, Mei, Champagne, Pascal
• Primary Examiner(s): NGO, HUNG V
• Application Number:
  US12/690,882
• Publication Number:
  US 20100155098A1
• Time in Patent Office: 1,420 Days
• Field of Search: 257/687, 174/559, 174/564, 361/737
• US Class Current: 174/564
• CPC Class Codes: G01D 11/24 Housings ; Casings for instruments
• CPC Class Codes: G01D 9/005 Solid-state data loggers
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring

Abstract

A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.

Claims

1. A thermally insulated electronic component package, comprising:

a thin electronic component;

a thermally insulating outer enclosure;

an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure, wherein the insert includes an inner cavity sized and shaped to receive the thin electronic component, and wherein the insert is made of alternating interdigitating layers of low thermal conductivity material and thermally absorbing material; and

one or more structures configured to mount the outer enclosure to a substrate.

2. The thermally insulated electronic component package of claim 1 wherein the thin electronic component comprises a battery.

3. The thermally insulated electronic component package of claim 1, wherein the thermally insulating outer enclosure is made of one or more high heat capacity materials.

4. The thermally insulated electronic component package of claim 3, wherein the high heat capacity materials include stainless steel, an austenitic nickel-chromium-based superalloy, a nickel-cobalt ferrous alloy or a ceramic material.

5. The thermally insulated electronic component package of claim 1 where in the outer enclosure is made of a low thermal conductivity material.

6. The thermally insulated electronic component package of claim 1 wherein the outer enclosure is made of a low emissivity and high heat capacity material.

7. The thermally insulated electronic component package of claim 1 wherein the enclosure is made of stainless steel, an austenitic nickel-chromium-based superalloy, a nickel-cobalt ferrous alloy, or a ceramic material.

8. The thermally insulated electronic component package of claim 7 wherein the thickness of a wall of the enclosure is about 10 to 15 mil.

9. The thermally insulated electronic component package of claim 1 wherein an inner and outer surface of the outer enclosure is coated with a thin film containing a low emissivity material.

10. The thermally insulated electronic component package of claim 9 wherein the low emissivity material is gold.

11. The thermally insulated electronic component package of claim 1 wherein one or more of the structures include one or more pins configured to fit into one or more corresponding holes in a side of the outer enclosure.

12. The thermally insulated electronic component package of claim 1 wherein a total thickness of the enclosure about 5 to 6 mm or less.

13. The thermally insulated electronic component package of claim 1 wherein the enclosure is evacuated and sealed.

14. The thermally insulated electronic component package of claim 1, further comprising a cover piece sized and shaped to cover the electronic component and close the inner cavity.

15. The thermally insulated electronic component package of claim 14 wherein the cover piece is made of the same material as the insert.

16. The thermally insulated electronic component package of claim 1, further comprising a lid that is bonded to a top of a wall of the outer enclosure or to a substrate to which the thermally insulated electronic component package is mounted.

17. The thermally insulated electronic component package of claim 16 wherein the lid is made of a material having similar thermal expansion characteristics to that of the enclosure.

18. The thermally insulated electronic component package of claim 1 wherein the insert is made of a thermally insulating ceramic material.

19. The thermally insulated electronic component package of claim 18 wherein the ceramic material is a machinable ceramic material.

20. An electronic instrument suitable for process conditions in a high temperature environment, comprising:

a substrate;

one or more thermally insulated electronic component package having a thermally insulating outer enclosure configured to mount to the substrate;

a plurality of stand-offs configured to provide support between the outer enclosure and the substrate, wherein a gap is present between a bottom surface of the enclosure and the substrate;

an insert made of a thermally insulating material that is sized an shaped to fit within the outer enclosure, wherein the insert includes an inner cavity sized and shaped to receive a thin electronic component; and

a thin electronic component disposed within the inner cavity.

21. The instrument of claim 20 wherein the outer enclosure is mounted on a top surface of the substrate.

22. The instrument of claim 20 wherein the substrate includes a substrate cavity and the outer enclosure is mounted in the substrate cavity.

23. The instrument of claim 22 further comprising a lid configured to cover the substrate and the electronic component.

24. The instrument of claim 23 wherein the lid piece is made of the same material as the substrate.

25. The instrument of claim 20, further comprising a lid that is bonded to a top of the insert or to a top of a wall of the outer enclosure or to the substrate.

26. The instrument of claim 25 wherein the lid is made of a material having similar thermal expansion characteristics to that of the outer enclosure or the substrate.

27. The instrument of claim 21, further comprising one or more structures configured to mount the outer enclosure to a substrate.

28. The instrument of claim 27 wherein one or more of the structures include one or more pins, each pin having a first end configured to fit into one or more corresponding holes in a side of the outer enclosure and one or more structures on the substrate, wherein each of the one or more structures is configured to receive a second end of a corresponding one of the pins.