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Structure and fabrication process of super junction MOSFET

  • US 8,604,541 B2
  • Filed: 04/06/2012
  • Issued: 12/10/2013
  • Est. Priority Date: 04/08/2011
  • Status: Expired due to Fees
First Claim
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1. A super junction metal-oxide-semiconductor field-effect transistor (MOSFET) comprising:

  • a drain;

    a first conductive substrate above the drain;

    a source area above the first conductive substrate, from bottom to top, the source area including a first conductive drift area, a first conductive source area above the first conductive drift area, and a second conductive body area between the first conductive source area and the first conductive drift area;

    a side-wall isolation structure being above the first conductive substrate and contacting with one side of the source area that is close to the first conductive source area, height of such isolation structure being lower than thickness of said source area such that the side-wall of the first conductive source and the second conductive body being not blocked by the side-wall isolation structure;

    a gate being above the second conductive body area of the source area;

    a surface isolation structure being above the gate and covering upper surfaces of the first conductive source area and the first conductive drift area;

    a source electrode covering the surface isolation structure and it extending downward from one side of the source area that is close to the first conductive source area to reach above the side-wall isolation structure, and conductive with the first conductive source area and the second conductive body area.

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