X-Y address type solid state image pickup device and method of producing the same

• US 8,604,575 B2
• Filed: 10/30/2007
• Issued: 12/10/2013
• Est. Priority Date: 07/11/2001
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Suzuki, Ryoji, Mabuchi, Keiji, Mori, Tomonori
• Primary Examiner(s): SMITH, BRADLEY
• Application Number:
  US11/981,389
• Publication Number:
  US 20080067556A1
• Time in Patent Office: 2,233 Days
• Field of Search: 257/291, 257/292, 257/293, 257/294, 257/290, 257/228, 257/447, 257/460, 257/187, 257/225, 257/432
• US Class Current: 257/432
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/14689 MOS based technologies
• CPC Class Codes: H01L 31/02164 for shielding light, e.g. light blocking layers, cold shields for infrared detectors
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H04N 25/79 Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Abstract

In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein, and visible light is taken in from the other side of the silicon layer, namely, from the side (back side) opposite to the wiring layer. Wiring can be made without taking a light-receiving surface into account, and the degree of freedom in wiring for the pixels is enhanced.

Claims

1. A solid state image pickup device comprising:

a device layer between a wiring layer and a light-shielding film, electrodes and wirings being within said wiring layer;

a photo-diode configured to convert incident light into an electrical signal, said photo-diode being within said device layer,

wherein said incident light is transmissible through an opening portion, said opening portion being a hole through said light-shielding film,

wherein said wiring layer is between a substrate support member and said device layer.

2. A solid state image pickup device as set forth in claim 1, wherein a color filter is between said opening portion and a micro-lens.

3. A solid state image pickup device as set forth in claim 1, wherein said light-shielding film is a metallic layer.

4. A solid state image pickup device as set forth in claim 1, wherein said substrate support member is between said wiring layer and an electrical conductor, a pad within the wiring layer being electrically connected to said electrical conductor.

5. A solid state image pickup device as set forth in claim 1, wherein said photo-diode includes a first conductivity region, said first conductivity region being within said device layer.

6. A solid state image pickup device as set forth in claim 5, wherein said first conductivity region is between second conductivity regions, said second conductivity regions having a conductivity type opposite to said first conductivity region.

7. A solid state image pickup device as set forth in claim 1, wherein said photo-diode is configured to convert a spectrum of the incident light into said electrical signal, the thickness of said device layer correlating to said spectrum.

8. A solid state image pickup device as set forth in claim 7, wherein ultraviolet light is within said spectrum when said thickness is in the range of 3 to 7 μ

m.

9. A solid state image pickup device as set forth in claim 7, wherein visible light is within said spectrum when said thickness is in the range of 5 to 15 μ

m.

10. A solid state image pickup device as set forth in claim 7, wherein infrared light is within said spectrum when said thickness is in the range of 15 to 50 μ

m.

19. An X-Y address type solid-state image pickup device comprising:

the solid state image pickup device as set forth in claim 1, vertical and horizontal selection circuits and said solid state image pickup device being on a substrate.

11. A solid state image pickup device comprising:

a device layer between a wiring layer and a light-shielding film, electrodes and wirings being within said wiring layer;

a photo-diode configured to convert incident light into an electrical signal, said photo-diode being within said device layer,

wherein said incident light is transmissible through an opening portion, said opening portion being a hole through said light-shielding film,

wherein said photo-diode includes a first conductivity region, said first conductivity region being within said device layer,

wherein a wiring layer side of the first conductivity region is closer to said wiring layer than to said light-shielding film, a light-receiving surface side of the first conductivity region being closer to said light-shielding film than to said wiring layer.

12. A solid state image pickup device as set forth in claim 11, wherein said first conductivity region is between a shallow layer and said wiring layer, the conductivity type of said shallow layer being opposite to the conductivity type of said first conductivity region.

13. A solid state image pickup device as set forth in claim 12, wherein said first conductivity region is in physical contact with said shallow layer.

14. A solid state image pickup device as set forth in claim 12, wherein a silicon nitride film is within said opening portion, a silicon oxide film being between said silicon nitride film and said device layer.

15. A solid state image pickup device as set forth in claim 14, wherein said shallow layer is in physical contact with said silicon oxide film, said silicon oxide film being in physical contact with said silicon nitride film and said light-shielding film.

16. A solid state image pickup device as set forth in claim 11, wherein said first conductivity region at said light-receiving surface side of is greater in surface area than at said wiring layer side.

17. A solid state image pickup device as set forth in claim 11, wherein an impurity concentration in said first conductivity region is greater at said wiring layer side than at said light-receiving surface side.

18. A solid state image pickup device comprising:

a device layer between a wiring layer and a light-shielding film, electrodes and wirings being within said wiring layer;

a photo-diode configured to convert incident light into an electrical signal, said photo-diode being within said device layer,

wherein said incident light is transmissible through an opening portion, said opening portion being a hole through said light-shielding film,

wherein said photo-diode includes a first conductivity region, said first conductivity region being within said device layer,

wherein said first conductivity region is between second conductivity regions, said second conductivity regions having a conductivity type opposite to said first conductivity region,

wherein one of the second conductivity regions is between said wiring layer and said first conductivity region, another of the second conductivity regions being between said first conductivity region and said light-shielding film.