Structures for preventing cross-talk between through-silicon vias and integrated circuits
First Claim
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1. A semiconductor chip comprising:
- one or more through vias (TVs) extending into a substrate;
a device region; and
a cross-talk prevention ring encircling one of either;
(a) the device region or (b) the one or more TVs, wherein the one or more TVs are isolated from device regions comprising active devices by the cross-talk prevention ring, the cross-talk prevention ring comprising a plurality of conductive lines vertically arranged above the substrate, adjacent ones of the plurality of conductive lines being electrically coupled.
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Abstract
A semiconductor chip includes a through-silicon via (TSV), a device region, and a cross-talk prevention ring encircling one of the device region and the TSV. The TSV is isolated from substantially all device regions comprising active devices by the cross-talk prevention ring.
50 Citations
19 Claims
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1. A semiconductor chip comprising:
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one or more through vias (TVs) extending into a substrate; a device region; and a cross-talk prevention ring encircling one of either;
(a) the device region or (b) the one or more TVs, wherein the one or more TVs are isolated from device regions comprising active devices by the cross-talk prevention ring, the cross-talk prevention ring comprising a plurality of conductive lines vertically arranged above the substrate, adjacent ones of the plurality of conductive lines being electrically coupled. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor chip comprising:
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a seal ring extending along a perimeter of the semiconductor chip; a cross-talk prevention ring encircled by the seal ring, the cross-talk prevention ring comprising at least one conductive line and a ring region in an underlying substrate; a through via (TV) in a region between the seal ring and the cross-talk prevention ring; and a device region encircled by the cross-talk prevention ring, wherein the device region comprises active devices. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A semiconductor chip comprising:
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a seal ring; a plurality of through vias (TVs); and a cross-talk prevention ring, the cross-talk prevention ring positioned between a first one or more of the plurality of TVs and a second one or more of the plurality of TVs, wherein the cross talk prevention ring comprises one or more conductive lines in dielectric layers overlying a semiconductor substrate. - View Dependent Claims (16, 17, 18, 19)
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Specification