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Structures for preventing cross-talk between through-silicon vias and integrated circuits

  • US 8,604,594 B2
  • Filed: 01/10/2012
  • Issued: 12/10/2013
  • Est. Priority Date: 11/26/2007
  • Status: Active Grant
First Claim
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1. A semiconductor chip comprising:

  • one or more through vias (TVs) extending into a substrate;

    a device region; and

    a cross-talk prevention ring encircling one of either;

    (a) the device region or (b) the one or more TVs, wherein the one or more TVs are isolated from device regions comprising active devices by the cross-talk prevention ring, the cross-talk prevention ring comprising a plurality of conductive lines vertically arranged above the substrate, adjacent ones of the plurality of conductive lines being electrically coupled.

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