Microelectronic assembly with multi-layer support structure

• US 8,604,605 B2
• Filed: 01/05/2007
• Issued: 12/10/2013
• Est. Priority Date: 01/05/2007
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Inventors: Nystrom, Michael J., Humpston, Giles
• Primary Examiner(s): Nguyen, Thinh T
• Application Number:
  US11/650,356
• Publication Number:
  US 20080165519A1
• Time in Patent Office: 2,531 Days
• Field of Search: 257/99, 257/433, 257/704, 438/25, 438/51, 438/55, 438/64
• US Class Current: 257/704
• CPC Class Codes: H01B 13/00 Apparatus or processes specially adapted for manufacturing conductors or cables
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Claims

1. A microelectronic assembly comprising:

a device wafer portion having a surface that includes an active region;

a support structure disposed on the surface of the device wafer portion and located adjacent to, but not extending onto, the active region; and

a lid in contact with the support structure and extending over the active region,

wherein the support structure is formed of a plurality of planar sheets, each planar sheet having a substantially uniform composition,

the plurality of planar sheets comprises;

first and second adhesive layers coupled to the device wafer portion and to the lid, respectively, and

the composition of the first adhesive layer differs from the composition of the second adhesive layer.

2. The microelectronic assembly of claim 1, wherein the plurality of planar sheets comprises:

a structural layer between the first and second adhesive layers, wherein the structural layer is resistive to deformation under environmental conditions that are suitable to bond the first adhesive layer to the device wafer portion and the second adhesive layer to the lid.

3. The microelectronic assembly of claim 2, wherein the environmental conditions comprise a pressure and a temperature suitable to bond the first adhesive layer to the device wafer portion and the second adhesive layer to the lid.

4. The microelectronic assembly of claim 2, wherein the first and second adhesive layers are specifically formulated to facilitate bonding to the device wafer portion and to the lid, respectively.

5. The microelectronic assembly of claim 2 wherein the structural layer is substantially opaque.

6. The microelectronic assembly of claim 1, wherein the plurality of planar sheets comprises:

first and second structural layers respectively coupled to the device wafer portion and to the lid;

an adhesive layer positioned between the first and second structural layers,

wherein the first and second structural layers are adapted to resist deformation under environmental conditions that are suitable for bonding the adhesive layer to the first and second structural layers.

7. The microelectronic assembly of claim 1 wherein the active region is populated with one or more microelectronic devices.

8. The microelectronic assembly of claim 7 wherein the one or more microelectronic devices comprise one or more optical devices, and wherein the lid is substantially transparent to electromagnetic radiation at a wavelength that is relevant to the one or more optical devices.

9. The microelectronic assembly of claim 8 wherein the lid is glass.

10. The microelectronic assembly of claim 8 wherein at least one of the planar sections is substantially opaque at a wavelength that is relevant to the one or more optical devices.

11. The microelectronic assembly of claim 1, wherein the active region of the device wafer portion, a portion of the lid extending over the active region, and a border of the support structure that adjoins the active region together define a substantially empty cavity.

12. The microelectronic assembly of claim 1, wherein the support structure extends onto one or more dicing lanes of the device wafer portion.

24. The microelectronic assembly of claim 2, wherein the first adhesive layer is of a material formulated to facilitate bonding to the device wafer portion.

25. The microelectronic assembly of claim 2, wherein the second adhesive layer is of a material formulated to facilitate bonding to the lid.

13. A microelectronic assembly, comprising:

a device wafer having a surface that includes one or more active regions;

a support structure disposed on the surface of the device wafer and located adjacent to each of the one or more active regions but not extending onto any of the active regions; and

a lid wafer in contact with the support structure and extending over each of the one or more active regions,

wherein the support structure is formed of a plurality of planar sheets, each planar sheet having a substantially uniform composition,

the plurality of planar sheets comprises;

first and second adhesive layers coupled to the device wafer and to the lid wafer, respectively, and

the composition of the first adhesive layer differs from the composition of the second adhesive layer.

14. The microelectronic assembly of claim 13, wherein the plurality of planar sheets comprises:

a structural layer between the first and second adhesive layers, wherein the structural layer is resistive to deformation under environmental conditions that are suitable to bond the first adhesive layer to the device wafer and the second adhesive layer to the lid wafer.

15. The microelectronic assembly of claim 14, wherein the environmental conditions comprise a pressure and a temperature suitable to bond the first adhesive layer to the device wafer and the second adhesive layer to the lid.

16. The microelectronic assembly of claim 14, wherein the first and second adhesive layers are specifically formulated to facilitate bonding to the device wafer and to the lid wafer, respectively.

17. The microelectronic assembly of claim 14, wherein the structural layer is substantially opaque.

18. The microelectronic assembly of claim 13, wherein each of the one or more active regions is populated with one or more associated microelectronic devices.

19. The microelectronic assembly of claim 18, wherein the one or more microelectronic devices associated with each of the one or more active regions comprise one or more optical devices, and the lid wafer is substantially transparent to electromagnetic radiation at a wavelength that is relevant to the one or more optical devices.

20. The microelectronic assembly of claim 19, wherein the lid wafer is glass.

21. The microelectronic assembly of claim 19, wherein at least one of the plurality of planar sheets is substantially opaque at a wavelength that is relevant to the one or more optical devices.

22. The microelectronic assembly of claim 13, wherein each of the one or more active regions of the device wafer, a portion of the lid extending over that active region, and a border of the support structure that adjoins that active region together define an associated substantially empty cavity.

23. The microelectronic assembly of claim 13, wherein the support structure extends onto one or more dicing lanes of the device wafer.

26. The microelectronic assembly of claim 13, wherein the first adhesive layer is of a material formulated to facilitate bonding to the device wafer.

27. The microelectronic assembly of claim 13, wherein the second adhesive layer is of a material formulated to facilitate bonding to the lid wafer.