Energy harvesting in integrated circuit packages

• US 8,604,867 B2
• Filed: 11/28/2011
• Issued: 12/10/2013
• Est. Priority Date: 11/28/2011
• Status: Expired due to Fees

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Sanchez, Henry L.
• Primary Examiner(s): MOORE, WHITNEY
• Application Number:
  US13/304,737
• Publication Number:
  US 20130134544A1
• Time in Patent Office: 743 Days
• Field of Search: 257/467, 257/470, 257/E21.002, 257/E31.055, 136/203, 136/205, 327/512, 438/54
• US Class Current: 327/512
• CPC Class Codes: H01L 2224/10126 Bump collar
• CPC Class Codes: H01L 2224/13014 being circular or elliptic
• CPC Class Codes: H01L 2224/13076 being mutually engaged together, e.g. through inserts
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13565 Only outside the bonding interface of the bump connector
• CPC Class Codes: H01L 2224/1357 Single coating layer
• CPC Class Codes: H01L 2224/13686 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0541 11th Group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device
• CPC Class Codes: H10N 10/854 comprising only metals H10N10/852, H10N10/853 take precedence

Abstract

An energy harvesting integrated circuit (IC) includes electrical connectors, each having a portion of a first material and a portion of a second material. The first and the second materials have a thermoelectric potential. The IC includes a trace of the first material coupled to the first material of each electrical connector, and a trace of the second material coupled to the second material of each electrical connector and the first trace. A portion of the second trace extends away from a portion of the first trace. The IC has charge storing elements coupled to the first and/or second traces. The first material and the second material are heated to create an electron flow from a thermal gradient between a first zone of the heated first and second materials and a second zone of the first and the second materials away from the first zone.

Claims

1. An energy harvesting integrated circuit (IC) apparatus, comprising:

a plurality of electrical connectors, each connector comprising a first material and a second material, the first and the second materials having a thermoelectric potential;

a first trace of the first material coupled to the first material of each electrical connector;

a second trace of the second material coupled to the second material of each electrical connector and the first trace, a portion of the second trace extending away from a portion of the first trace; and

a plurality of charge storing elements coupled to at least one of the first and second traces.

2. The apparatus of claim 1, in which the electrical connectors comprise pillars.

3. The apparatus of claim 2, in which the pillars are substantially cylindrical and the second material substantially surrounds the first material of each of the pillars.

4. The apparatus of claim 1, in which the first material comprises copper and the second material comprises copper oxide.

5. The apparatus of claim 4, in which each electrical connector comprises an interior layer and an exterior layer, the interior layer comprising the first material and the exterior layer comprising the second material.

6. The apparatus of claim 1, in which the charge storing elements comprise capacitors.

7. The apparatus of claim 6, in which the capacitors are arranged in a parallel configuration.

8. The apparatus of claim 6, in which the capacitors are arranged in a series configuration.

9. The apparatus of claim 1, further comprising a die coupled to a packaging substrate with the electrical connectors.

10. The apparatus of claim 1, further comprising a first die coupled to a second die with the electrical connectors.

11. The apparatus of claim 1, further comprising a printed circuit board coupled to a packaging substrate with the electrical connectors.

12. The apparatus of claim 1, further comprising a first package coupled to a second package with the electrical connectors.

13. The apparatus of claim 1, in which the portion of the first trace gradually extend away from the portion of the second trace.

14. The apparatus of claim 1, in which the portion of the first trace step-wise extend away from the portion of the second trace.

15. The apparatus of claim 1, further comprising at least one resistive load electrically coupling the first trace to the second trace.

16. The apparatus of claim 1, in which the first material and the second material are subjected to heat to create an electron flow based on a thermal gradient between a first zone of the heated first and second materials and a second zone associated with the first and the second materials away from the first zone.

17. The apparatus of claim 1, in which at least one of the plurality of electrical connectors carries a signal and in which at least one of the plurality of electrical connectors generates the thermoelectric potential.

18. The apparatus of claim 1, integrated into at least one of a mobile phone, a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, microprocessor and a computer.

19. An energy harvesting method, comprising:

coupling a first material of each electrical connector of a plurality of electrical connectors to a trace of the first material;

coupling a second material of each electrical connector of the plurality of electrical connectors to a trace of the second material, the first material and the second material having a thermoelectric potential;

extending a portion of the trace of the first material away from a portion of the trace of the second material; and

coupling a plurality of charge storing elements to at least one of the traces.

20. The method of claim 19, further comprising integrating the electrical connector into at least one of a mobile phone, a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, microprocessor and a computer.

21. An energy harvesting integrated circuit (IC) apparatus, comprising:

means for electrically connecting integrated circuit devices, each connecting means comprising a first material and a second material, the first and the second materials having a thermoelectric potential;

a first trace of the first material coupled to the first material of each connecting means;

a second trace of the second material coupled to the second material of each connecting means and the first trace, a portion of the second trace extending away from a portion of the first trace; and

means for storing electric charge coupled to at least one of the first and second traces.

22. The apparatus of claim 21, integrated into at least one of a mobile phone, a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, microprocessor and a computer.