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Vertical integrated circuit switches, design structure and methods of fabricating same

  • US 8,604,898 B2
  • Filed: 04/20/2009
  • Issued: 12/10/2013
  • Est. Priority Date: 04/20/2009
  • Status: Active Grant
First Claim
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1. A method of manufacturing a MEMS switch, comprising:

  • forming at least two vertically extending vias in a wafer;

    filling the at least two vertically extending vias with a metal to form at least two vertically extending wires; and

    opening a void in the wafer from a bottom side such that at least one of the vertically extending wires is moveable within the void.

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