Vertical integrated circuit switches, design structure and methods of fabricating same
First Claim
Patent Images
1. A method of manufacturing a MEMS switch, comprising:
- forming at least two vertically extending vias in a wafer;
filling the at least two vertically extending vias with a metal to form at least two vertically extending wires; and
opening a void in the wafer from a bottom side such that at least one of the vertically extending wires is moveable within the void.
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Abstract
Vertical integrated MEMS switches, design structures and methods of fabricating such vertical switches is provided herein. The method of manufacturing a MEMS switch, includes forming at least two vertically extending vias in a wafer and filling the at least two vertically extending vias with a metal to form at least two vertically extending wires. The method further includes opening a void in the wafer from a bottom side such that at least one of the vertically extending wires is moveable within the void.
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Citations
19 Claims
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1. A method of manufacturing a MEMS switch, comprising:
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forming at least two vertically extending vias in a wafer; filling the at least two vertically extending vias with a metal to form at least two vertically extending wires; and opening a void in the wafer from a bottom side such that at least one of the vertically extending wires is moveable within the void. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a MEMS switch comprising:
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etching at least three vias from a top side of a wafer; filling the vias with a metal to form vertically arranged top side wires; depositing a dielectric material on the bottom side of the wafer; etching the dielectric material to form an opening therein, wherein remaining portions of the dielectric material protect edges of the wafer; and etching a bottom side of the wafer through the opening in the dielectric material to form a void which exposes at least one of the vertically arranged top side wires. - View Dependent Claims (13, 14, 15)
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16. A design structure comprising instructions tangibly embodied in a non-transitory computer readable storage medium for designing, manufacturing, or testing an integrated circuit, the instructions when processed on a data processing system generate a functional representation of the integrated, the design structure comprising:
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at least two vertically extending metal wires formed in a wafer; and a void formed in the wafer which accommodates at least one of the at least two vertically extending metal wires, wherein the at least one of the at least two vertically extending metal wires is moveable within the void upon an application of a voltage. - View Dependent Claims (17, 18, 19)
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Specification