Heat dissipation in computing device
First Claim
1. A computing device, comprising:
- an outer housing adapted to contain internal operational components therein, the outer housing being formed from a thermally conductive material;
an internal structure disposed inside the outer housing and configured to support the outer housing, the internal structure being formed from a thermally conductive material;
one or more heat producing elements disposed inside the outer housing; and
a heat transfer system configured to facilitate the transfer of heat generated at the one or more heat producing elements into both of the outer housing and the internal structure such that the heat is dissipated throughout the outer housing and the internal structure, wherein the heat transfer system forms thermal paths between the heat producing element and the internal structure and between the heat producing element and the outer housing.
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Abstract
A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.
105 Citations
15 Claims
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1. A computing device, comprising:
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an outer housing adapted to contain internal operational components therein, the outer housing being formed from a thermally conductive material; an internal structure disposed inside the outer housing and configured to support the outer housing, the internal structure being formed from a thermally conductive material; one or more heat producing elements disposed inside the outer housing; and a heat transfer system configured to facilitate the transfer of heat generated at the one or more heat producing elements into both of the outer housing and the internal structure such that the heat is dissipated throughout the outer housing and the internal structure, wherein the heat transfer system forms thermal paths between the heat producing element and the internal structure and between the heat producing element and the outer housing. - View Dependent Claims (2, 3, 4, 5)
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6. A method of dissipating heat in a computing device, comprising:
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thermally coupling a first heat transfer component to a first heat producing element located within the computing device; placing a second heat transfer component between the first heat transfer component and a housing of the computing device, the housing being formed from a thermally conductive material, wherein the second heat transfer component thermally couples the first heat transfer component to the housing; positioning an internal structure proximate to the first heat transfer component, the internal structure being formed from a thermally conductive material and being disposed inside the housing and configured to support the housing, wherein the first heat transfer component thermally couples the first heat producing element to the internal structure; conducting heat from the first heat producing element to the internal structure by way of the first heat transfer component such that heat is dissipated throughout the internal structure; and conducting heat from the first heat producing element to the housing by way of the first and second heat transfer components such that heat is dissipated throughout the housing. - View Dependent Claims (7, 8, 9, 10)
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11. A heat transfer system configured to facilitate the dissipation of heat in a computing device, comprising:
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a first heat transfer component adapted to thermally couple to a first heat producing element and an internal structure of a computing device such that heat is transferred from the first heat producing element and dissipated throughout the internal structure; a second heat transfer component adapted to thermally couple to a second heat producing element and the internal structure such that heat is transferred from the second heat producing element and dissipated throughout the internal structure; and a third heat transfer component thermally coupled to both of the first and second heat transfer components, wherein the third heat transfer component is adapted to thermally couple to an outer housing of the computing device such that heat is transferred from both of the first and second heat transfer components and dissipated throughout the outer housing. - View Dependent Claims (12, 13, 14, 15)
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Specification