Method for forming a housing of an electronic device
First Claim
1. A method for forming a housing of an electronic device, said method comprising:
- forming an adhesive layer on an entire bottom surface of a housing member, wherein the adhesive layer has an area corresponding to a bottom surface area of the housing member;
using the adhesive layer to secure a top surface of a film to the bottom surface of the housing member, the top surface of the film having an area larger than the area of the adhesive layer such that a portion of the top surface remains exposed when the film is adhered to the housing member, wherein the housing member has the bottom surface, a top surface opposite the bottom surface, and a side wall, wherein the top surface and the side wall are separated by a top engaging surface and the bottom surface and the side wall are separated by a bottom engaging surface, wherein the top and bottom engaging surfaces define external shapes of corresponding top and bottom retaining members;
engaging a molding compound with the top and bottom engaging surfaces and with at least a portion of the exposed surface of the film while the top surface of the housing member remains exposed; and
forming the top and bottom retaining members by curing the engaged molding compound such that the top and bottom retaining members lock the housing member in place.
2 Assignments
0 Petitions
Accused Products
Abstract
Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
28 Citations
30 Claims
-
1. A method for forming a housing of an electronic device, said method comprising:
-
forming an adhesive layer on an entire bottom surface of a housing member, wherein the adhesive layer has an area corresponding to a bottom surface area of the housing member; using the adhesive layer to secure a top surface of a film to the bottom surface of the housing member, the top surface of the film having an area larger than the area of the adhesive layer such that a portion of the top surface remains exposed when the film is adhered to the housing member, wherein the housing member has the bottom surface, a top surface opposite the bottom surface, and a side wall, wherein the top surface and the side wall are separated by a top engaging surface and the bottom surface and the side wall are separated by a bottom engaging surface, wherein the top and bottom engaging surfaces define external shapes of corresponding top and bottom retaining members; engaging a molding compound with the top and bottom engaging surfaces and with at least a portion of the exposed surface of the film while the top surface of the housing member remains exposed; and forming the top and bottom retaining members by curing the engaged molding compound such that the top and bottom retaining members lock the housing member in place. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A method of forming a housing for an electronic device, comprising
forming a layer of adhesive on an entire bottom surface of a window, wherein the layer of adhesive has an area corresponding to a bottom surface area of the window; -
securing the window to a top surface of a film substrate using the layer of adhesive, the top surface of the film substrate having an area larger than the area of the layer of adhesive such that a portion of the top surface remains exposed when the film substrate is adhered to the window, wherein the window has the bottom surface, a top surface opposite the bottom surface, and a side wall, wherein the top surface and the side wall are separated by a top engaging surface and the bottom surface and the side wall are separated by a second engaging surface, wherein the first and second engaging surfaces define first and second retaining surfaces of a retaining member; and forming the first and second retaining surfaces by molding the retaining member on at least the first and second engaging surfaces, respectively, while the top surface of the window remains exposed, wherein the first and second retaining surfaces cooperate to lock the window within the retaining member, wherein a portion of the second retaining member is molded on and engaged with at least a portion of the exposed surface of the film substrate. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
26. A method for assembling a device housing of an electronic device, said method comprising:
-
forming an adhesive layer on an entire bottom surface of a window, wherein the adhesive layer has an area corresponding to a bottom surface area of the window; securing a top surface of a metal substrate to the bottom surface of the window using the adhesive layer, the top surface of the metal substrate having an area larger than the area of the adhesive layer such that a portion of the top surface remains exposed when the metal substrate is adhered to the window, the metal substrate having a central opening aligned with a central portion of the window, the window having the bottom surface, top surface opposite the bottom surface, and a side wall, wherein the top surface and the side wall are separated by a top engaging surface and the bottom surface and the side wall are separated by a bottom engaging surface, wherein the top and bottom engaging surfaces define external shapes of corresponding top and bottom retaining members; and engaging a molding compound with the top and bottom engaging surfaces and with at least a portion of the exposed surface of the metal substrate while the top surface of the window remains exposed; and forming the top and bottom retaining members by curing the engaged molding compound such that the top and bottom retaining members lock the housing member in place. - View Dependent Claims (27, 28, 29, 30)
-
Specification