Room-temperature bonding method and room-temperature bonding apparatus including sputtering
First Claim
1. A room-temperature bonding apparatus comprising:
- a vacuum chamber,an evacuation apparatus evacuating said vacuum chamber,a pair of substrate holders arranged to face each other in said vacuum chamber,a pressure bonding mechanism connected to at least one of said substrate holders to bond substrates to each other, each of the substrates is mounted on a corresponding one of the substrate holders, andonly a single physical sputtering source,wherein a target irradiated with ion beams or atom beams emitted from said physical sputtering source is arranged in said vacuum chamber independently of said substrate holders, said pressure bonding mechanism and said physical sputtering source,wherein said target is mounted on a singular target substrate or a plurality of target substrates, andwherein said substrates arranged at a position away from an axis line of said physical sputtering source and said singular target substrate or at least one of said plurality of target substrates is arranged at another position away from said axis line,wherein said pair of substrate holders is arranged at a different position away from said axis line,said axis line starting at a center of said physical sputtering source and being parallel to a direction which said physical sputtering source faces, said axis line extending beyond said physical sputtering source past said substrates and said singular target substrate or at least one of said plurality of target substrates.
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Accused Products
Abstract
A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
34 Citations
9 Claims
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1. A room-temperature bonding apparatus comprising:
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a vacuum chamber, an evacuation apparatus evacuating said vacuum chamber, a pair of substrate holders arranged to face each other in said vacuum chamber, a pressure bonding mechanism connected to at least one of said substrate holders to bond substrates to each other, each of the substrates is mounted on a corresponding one of the substrate holders, and only a single physical sputtering source, wherein a target irradiated with ion beams or atom beams emitted from said physical sputtering source is arranged in said vacuum chamber independently of said substrate holders, said pressure bonding mechanism and said physical sputtering source, wherein said target is mounted on a singular target substrate or a plurality of target substrates, and wherein said substrates arranged at a position away from an axis line of said physical sputtering source and said singular target substrate or at least one of said plurality of target substrates is arranged at another position away from said axis line, wherein said pair of substrate holders is arranged at a different position away from said axis line, said axis line starting at a center of said physical sputtering source and being parallel to a direction which said physical sputtering source faces, said axis line extending beyond said physical sputtering source past said substrates and said singular target substrate or at least one of said plurality of target substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification