Inlays for security documents
First Claim
1. An inlay substrate for a secure document having a recess extending into the inlay substrate from a first (top) surface thereof for receiving a chip module therein, and an antenna wire disposed in the inlay substrate, wherein:
- the inlay substrate comprises at least two layers of a synthetic material laminated to one another with a layer of adhesive; and
the recess extends through a top of the two layers and at least into a bottom of the two layers.
5 Assignments
0 Petitions
Accused Products
Abstract
Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.
182 Citations
20 Claims
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1. An inlay substrate for a secure document having a recess extending into the inlay substrate from a first (top) surface thereof for receiving a chip module therein, and an antenna wire disposed in the inlay substrate, wherein:
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the inlay substrate comprises at least two layers of a synthetic material laminated to one another with a layer of adhesive; and the recess extends through a top of the two layers and at least into a bottom of the two layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification