Microcircuit device including means for amplifying the gain of an antenna

• US 8,608,082 B2
• Filed: 07/19/2011
• Issued: 12/17/2013
• Est. Priority Date: 07/20/2010
• Status: Active Grant

• Current Assignee: IDEMIA France (Advent International Corporation)
• Original Assignee: Oberthur Technologies SA
• Inventors: Launay, Franois, Le Garrec, Loc, Duval, Agns
• Primary Examiner(s): St Cyr, Daniel
• Application Number:
  US13/186,344
• Publication Number:
  US 20120018522A1
• Time in Patent Office: 882 Days
• Field of Search: 234/92, 234/87, 235/492, 235/487
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

The electronic device (10) comprising a microcircuit (18) module (20), a near-field communication antenna (36) electrically connected to the microcircuit (18) of the module (20), delimiting an antenna surface (S), and a body (12) incorporating the module (20). More precisely, the antenna (36) is arranged within the module (20) and the body (12) incorporates means (40) of amplifying the gain of the antenna (36) comprising an electrically conductive element (42) electrically isolated from the microcircuit (18) and the antenna (36), of an annular general shape arranged around an area (R) of the body (12) forming a volume generated by the projection of the antenna surface (S) along a direction (Z) substantially orthogonal to the surface (S).

Claims

1. An electronic device comprising a microcircuit associated with a module, a near-field communication antenna electrically connected to the microcircuit associated with the module, the antenna delimiting an antenna surface, and a body incorporating the module, wherein the antenna is arranged on a substrate of the module and wherein the body incorporates an amplifier adapted to amplify the gain of the antenna, the amplifier comprising an electrically conductive element electrically insulated from the microcircuit and from the antenna, of generally annular shape arranged around an area of the body forming a volume generated by a projection of the antenna surface along a direction substantially orthogonal to the antenna surface, wherein the body is provided with a cavity receiving the module and the electrically conductive element is a layer through which the cavity passes.

2. The electronic device according to claim 1, wherein the electrically conductive element delimits an inner peripheral edge surrounding the area at a minimized distance, less than or equal to five millimeters.

3. The electronic device according to claim 2, wherein the electrically conductive element extends within the same plane as the antenna or at least a part of the antenna and the minimized distance is configured so as to ensure electrical isolation of the antenna and the electrically conductive element.

4. The electronic device according to claim 3, wherein the antenna comprises a winding of electrically conductive coils, and the minimized distance is greater than one coil interval.

5. The electronic device according to claim 1, wherein the electrically conductive element extends within a plane parallel to a plane containing the antenna or at least a part of the antenna.

6. The electronic device according to claim 5, wherein the antenna extends along the periphery of at least one of a plurality of faces of the substrate or of two opposite faces of the substrate of the module.

7. The electronic device according to claim 1, wherein the electrically conductive element extends within a plane containing the antenna or at least a part of the antenna.

8. The electronic device according to claim 1, wherein the electrically conductive element delimits an inner peripheral edge surrounding the module which is at least partially flush with a surface of a peripheral wall of the cavity.

9. The electronic device according to claim 8, wherein the cavity has a deep central area for receiving the microcircuit and a peripheral area, raised with respect to the central area, supporting the substrate of the module, and the electrically conductive element surrounds the peripheral area.

10. The electronic device according to claim 1, wherein the electrically conductive element forms a closed ring or a ring that is broken at least once.

11. The electronic device according to claim 1, the electronic device being a chip card of the contactless type, or of the dual type, or an inlay.

12. The electronic device according to claim 1, wherein the electrically conductive element is made of a metallic material with a relative magnetic permeability less than or equal to one.

13. The electronic device according to claim 12, wherein the metallic material is an electrically conductive ink.

14. The electronic device according to claim 1, wherein the electrically conductive element has a full pattern.

15. The electronic device according to claim 14, wherein the electrically conductive element forms a grid or includes a set of concentric rings.

16. The electronic device according to claim 15, wherein the electrically conductive element is:

a grid of the size of the page of a passport having a rectangular main opening of 27.2 mm×

17.8 mm dimension;

or

a grid of the size of an ID1 format card having a rectangular main opening of 27.2 mm×

17.8 mm or 27.2 mm×

13.1 mm dimension.

17. A manufacturing method for an electronic device comprising a step of forming a body of the device and a step of forming a cavity in the body, wherein during the step of forming the body, an electrically conductive layer is arranged in the body such that, during the step of forming the cavity, the cavity passes through the electrically conductive layer to form an electrically conductive element incorporated in the body and of generally annular shape, and a step of incorporating a microcircuit associated with a module in the body, on a substrate of which a near-field communication antenna electrically connected to the microcircuit associated with the module is arranged, the antenna delimiting an antenna surface, the electrically conductive element adapted to amplify the gain of the antenna and being arranged around an area of the body forming a volume generated by a projection of the antenna surface along a direction substantially orthogonal to the surface.

18. The manufacturing method according to claim 17, wherein the electrically conductive layer extends transversely over the entire surface of the body.

19. The manufacturing method according to claim 17, wherein the body has a multilayer structure, the electrically conductive layer being interleaved between two layers of the body.

20. The manufacturing method according to claim 17, wherein the electrically conductive layer is printed onto one of the layers of the body with electrically conductive ink, by silk-screening onto one of the layers of the body.

21. An electronic device comprising a microcircuit associated with a module, a near-field communication antenna electrically connected to the microcircuit associated with the module, the antenna delimiting an antenna surface, and a body incorporating the module, wherein the antenna is arranged on a substrate of the module and wherein the body incorporates an amplifier adapted to amplify the gain of the antenna, the amplifier comprising an electrically conductive element electrically insulated from the microcircuit and from the antenna, of generally annular shape arranged around an area of the body forming a volume generated by a projection of the antenna surface along a direction substantially orthogonal to the antenna surface,

wherein the electrically conductive element forms a ring that is broken at least once.