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Financial card with embedded circuit lock technology

  • US 8,608,084 B2
  • Filed: 09/30/2011
  • Issued: 12/17/2013
  • Est. Priority Date: 09/30/2010
  • Status: Active Grant
First Claim
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1. An inlay for use with a proximity payment card comprising:

  • a flexible substrate layer comprising an antenna, the antenna comprising a first conductive lead and a second conductive lead and a space therebetween sufficient to interrupt transmission of the antenna;

    an RFID chip electrically coupled to the antenna;

    a flexible dielectric layer comprising a central aperture situated on top of the substrate layer;

    a flexible bridge circuit layer situated on top of the dielectric layer, the bridge circuit layer comprising a bridge, the bridge being situated over the first conductive lead and the second conductive lead, the bridge being biased away from the first conductive lead and the second conductive lead in a first position and biased against the first conduct lead and the second conductive lead in a second position when the inlay is flexed.

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