Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices

• US 8,609,454 B2
• Filed: 07/17/2012
• Issued: 12/17/2013
• Est. Priority Date: 05/10/2012
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Dai, Ming-Ji, Liu, Chun-Kai, Chien, Heng-Chieh, Liao, Li-Ling, Tzeng, Yen-Lin, Lin, Yan-Bo, Wang, Ker-Win
• Primary Examiner(s): Lee, Cheung
• Application Number:
  US13/551,606
• Publication Number:
  US 20130302935A1
• Time in Patent Office: 518 Days
• Field of Search: 297/44, 297/57, 438/120
• US Class Current: 438/64
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H10N 10/01 Manufacture or treatment
• CPC Class Codes: Y10T 29/49895 Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part

Abstract

A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.

Claims

1. A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio, the self-assembly apparatus comprising:

a guiding element having a mesh structure;

a vibration device connected with the guiding element and configured to vibrate the guiding element; and

a magnetic field inducing device disposed below the guiding element and configured to generate a time-varying magnetic field to rotate the plurality of devices,

wherein through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and a self-gravity of each of the plurality of devices, the plurality of devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.

2. The self-assembly apparatus according to claim 1, wherein the guiding element is a board-shaped element.

3. The self-assembly apparatus according to claim 2, wherein the board-shaped element comprises metal.

4. The self-assembly apparatus according to claim 2, wherein the board-shaped element comprises non-metal.

5. The self-assembly apparatus according to claim 4, wherein the board-shaped element comprises SU8, PET, or PI.

6. The self-assembly apparatus according to claim 2, wherein the mesh structure is formed by lithography, electrochemical discharge machining, laser machining, or CNC precision machining.

7. The self-assembly apparatus according to claim 1, wherein the mesh structure of the guiding element is formed by weaving a plurality of mesh wires.

8. The self-assembly apparatus according to claim 1, wherein the magnetic field inducing device comprises:

a magnet; and

a motor configured to rotate the magnet.

9. The self-assembly apparatus according to claim 1, wherein the plate has a plurality of indentations, and each of the plurality of indentations is suitable for accommodating each of the plurality of devices.

10. The self-assembly apparatus according to claim 1, wherein the predetermined aspect ratio is greater than 1.

11. The self-assembly apparatus according to claim 1, wherein the plurality of devices are thermoelectric devices each comprising a magnetic conductive electrode.

12. The self-assembly apparatus according to claim 11, wherein the plate is a substrate of a thermoelectric module, and a plurality of electrodes corresponding to the mesh structure is formed on the substrate.

13. A device self-assembling method, comprising:

placing a plurality of devices on a guiding element, wherein the guiding element has a mesh structure;

vibrating the guiding element;

applying a time-varying magnetic field to the plurality of devices to rotate each of the plurality of devices;

through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and a self-gravity of each of the plurality of devices, positioning the plurality of devices on a plate below the guiding element through the mesh structure.

14. The device self-assembling method according to claim 13, wherein the plate has a plurality of indentations, and each of the plurality of indentations is suitable for accommodating each of the plurality of devices;

and

after positioning the plurality of devices on the plate through the mesh structure, the device self-assembling method further comprises;

tilting the plate so that the plurality of devices lean against to corners of the plurality of indentations.

15. The device self-assembling method according to claim 13, wherein a vibration amplitude of the guiding element is between 6 μ

m and 20 μ

m.

16. The device self-assembling method according to claim 15, wherein the guiding element is vibrated by applying a sinusoidal voltage having a frequency between 600 Hz and 1600 Hz and a voltage level between 0.6 V and 1.8 V on a vibration device coupled to the guiding element.

17. The device self-assembling method according to claim 13, wherein a vibration amplitude of the guiding element is greater than 20 μ

m.

18. A method of assembling thermoelectric devices, comprising:

placing a plurality of p-type thermoelectric devices each comprising a magnetic conductive electrode on a first guiding element, wherein the first guiding element has a first mesh structure;

vibrating the first guiding element;

applying a first time-varying magnetic field to the plurality of p-type thermoelectric devices to rotate each of the plurality of p-type thermoelectric devices;

through a collective effect of the vibration of the first guiding element, the first time-varying magnetic field, and a self-gravity of each of the plurality of p-type thermoelectric devices, positioning the plurality of p-type thermoelectric devices on a plate through the first mesh structure;

placing a plurality of n-type thermoelectric devices each comprising a magnetic conductive electrode on a second guiding element, wherein the second guiding element has a second mesh structure;

vibrating the second guiding element;

applying a second time-varying magnetic field to the plurality of n-type thermoelectric devices to rotate each of the plurality of n-type thermoelectric devices;

through a collective effect of the vibration of the second guiding element, the second time-varying magnetic field, and a self-gravity of each of the plurality of n-type thermoelectric devices, positioning the plurality of n-type thermoelectric devices on the plate through the second mesh structure,

wherein the plurality of p-type thermoelectric devices and the plurality of n-type thermoelectric devices are alternatively disposed on the plate.

19. The method of assembling thermoelectric devices according to claim 18, wherein the plate has a plurality of indentations, and each of the plurality of indentations is suitable for accommodating one of the plurality of n-type thermoelectric devices or one of the plurality of p-type thermoelectric devices;

and

after the plurality of p-type thermoelectric devices are positioned on the plate through the first mesh structure and the plurality of n-type thermoelectric devices are positioned on the plate through the second mesh structure, the method of assembling thermoelectric devices further comprises;

tilting the plate so that the plurality of n-type thermoelectric devices and the plurality of p-type thermoelectric devices lean against corners of the plurality of indentations.

20. The method of assembling thermoelectric devices according to claim 18 further comprising moving the plurality of p-type thermoelectric devices and the plurality of n-type thermoelectric devices from the plate to a substrate.

21. A method of assembling thermoelectric devices, comprising:

placing a plurality of p-type thermoelectric devices each comprising a magnetic conductive electrode on a first guiding element, wherein the first guiding element has a first mesh structure;

vibrating the first guiding element;

applying a first time-varying magnetic field to the plurality of p-type thermoelectric devices to rotate each of the plurality of p-type thermoelectric devices;

through a collective effect of the vibration of the first guiding element, the first time-varying magnetic field, and a self-gravity of each of the plurality of p-type thermoelectric devices, positioning the plurality of p-type thermoelectric devices on a first plate below the first guiding element through the first mesh structure;

placing a plurality of n-type thermoelectric devices each comprising a magnetic conductive electrode on a second guiding element, wherein the second guiding element has a second mesh structure;

vibrating the second guiding element;

applying a second time-varying magnetic field to the plurality of n-type thermoelectric devices to rotate each of the plurality of n-type thermoelectric devices;

through a collective effect of the second guiding element, the second time-varying magnetic field and a self-gravity of each of the plurality of n-type thermoelectric devices, positioning the plurality of n-type thermoelectric devices on a second plate through the second mesh structure; and

assembling the first plate and the second plate so that the plurality of p-type thermoelectric devices and the plurality of n-type thermoelectric devices are located between the first plate and the second plate, and the plurality of p-type thermoelectric devices and the plurality of n-type thermoelectric devices are alternatively disposed.

22. The method of assembling thermoelectric devices according to claim 21, wherein

the first plate has a plurality of first indentations, and each of the plurality of first indentations is suitable for accommodating one of the plurality of p-type thermoelectric devices, the second plate has a plurality of second indentations, and each of the plurality of second indentations is suitable for accommodating one of the plurality of n-type thermoelectric devices;

and

after the plurality of p-type thermoelectric devices are positioned on the first plate through the first mesh structure and the plurality of n-type thermoelectric devices are positioned on the second plate through the second mesh structure, the method of assembling thermoelectric devices further comprises;

tilting the first plate so that the plurality of p-type thermoelectric devices lean against corners of the plurality of first indentations; and

tilting the second plate so that the plurality of n-type thermoelectric devices lean against corners of the plurality of second indentations.