LED package having an array of light emitting cells coupled in series

• US 8,610,138 B2
• Filed: 11/15/2011
• Issued: 12/17/2013
• Est. Priority Date: 03/11/2005
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Lee, Chung Hoon, Lee, Keon Young, Kim, Hong San, Kim, Dae Won, Choi, Hyuok Jung
• Primary Examiner(s): Tran, Tran
• Application Number:
  US13/296,735
• Publication Number:
  US 20120056215A1
• Time in Patent Office: 763 Days
• Field of Search: 257/88, 257 98-100, 257/E33.062, 257/690, 257/696, 257/706
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Claims

1. A light-emitting diode package, comprising:

a heat sink;

a package body coupled with the heat sink, the package body exposing a bottom surface of the heat sink;

a light-emitting chip arranged on the heat sink;

a first lead frame electrically connected to the heat sink, the first lead frame comprising;

a first inner lead frame disposed inside the package body; and

a first outer lead frame coupled with the first inner lead frame, the first outer lead frame protruding from the package body and comprising a first bent portion;

a second lead frame separated from the heat sink, the second lead frame comprising;

a second inner lead frame disposed inside the package body; and

a second outer lead frame coupled with the second inner lead frame, the second outer lead frame protruding from the package body and comprising a second bent portion; and

an opening defined by a first side edge of the first inner lead frame and a second side edge of the first inner lead frame, wherein the second inner lead frame is arranged in the opening and below a top surface of the heat sink,

wherein the first inner lead is arranged around a portion of the heat sink on which the light-emitting chip is arranged, and

wherein a first portion of the first inner lead is exposed from the package body.

2. The light-emitting diode package of claim 1, wherein the second inner lead frame comprises a fastening groove, the fastening groove receiving a portion of the package body.

3. The light-emitting diode package of claim 1, wherein a first distal end of the second inner lead frame follows a contour of the heat sink.

4. The light-emitting diode package of claim 1, wherein the heat sink comprises a latching groove, the package body being disposed in the latching groove and supporting the heat sink.

5. The light-emitting diode package of claim 1, wherein the bottom surface of the heat sink, the first bent portion of the first outer lead frame, and the second bent portion of the second outer lead frame are aligned for surface mounting.

6. The light-emitting diode package of claim 1, further comprising a wire electrically connecting the light-emitting chip and the second lead frame.

7. The light-emitting diode package of claim 1, further comprising a molding member or encapsulant arranged on the package body.

8. The light-emitting diode package of claim 1, wherein the light-emitting chip comprises a serially connected light-emitting cell array.

9. The light-emitting diode package of claim 1, wherein the light-emitting chip comprises a flip-bonded light-emitting cell array.

10. The light-emitting diode package of claim 1, wherein the first lead frame and the heat sink are integrally formed.

11. The light-emitting diode package of claim 1, wherein the first portion of the first inner lead is an opposite side of the first inner lead than a second portion of the first inner lead, the second portion of the first inner lead contacting the package body.

12. The light-emitting diode package of claim 1, wherein a first portion of the second inner lead is exposed from the package body, and the first portion of the first inner lead is substantially parallel to the first portion of the second inner lead.

13. The light-emitting diode package of claim 1, wherein the light-emitting chip is arranged on an upper surface of the heat sink, and the upper surface of the heat sink is arranged above the first lead frame and the second lead frame.

14. The light-emitting diode package of claim 13, wherein the package body is arranged below the upper surface of the heat sink.

15. The light-emitting diode package of claim 1, wherein the entire second inner lead frame is substantially flat.

16. The light-emitting diode package of claim 2, wherein the fastening groove comprises a hole formed in the second inner lead.

17. The light-emitting diode package of claim 1, wherein the first lead frame extends from the heat sink.

18. A light-emitting diode package, comprising:

a heat sink;

a package body coupled with the heat sink, the package body exposing a bottom surface of the heat sink;

a light-emitting chip arranged on an upper portion of the heat sink;

a first lead frame electrically connected to the heat sink, the first lead frame comprising;

a first inner lead frame disposed inside the package body; and

a first outer lead frame coupled with the first inner lead frame, the first outer lead frame protruding from the package body and comprising a first bent portion;

a second lead frame separated from the heat sink, the second lead frame comprising;

a second inner lead frame disposed inside the package body; and

a second outer lead frame coupled with the second inner lead frame, the second outer lead frame protruding from the package body and comprising a second bent portion,

wherein the second inner lead frame is directly between a first side edge of the first inner lead frame and a second side edge of the first inner lead frame,

wherein the first inner lead frame is arranged around a portion of the heat sink on which the light-emitting chip is arranged, and

wherein the upper portion of the heat sink is arranged above the first inner lead frame and the second inner lead frame.

19. A light-emitting diode package, comprising:

a heat sink;

a package body coupled with the heat sink, the package body exposing a bottom surface of the heat sink;

a light-emitting chip arranged on an upper portion of the heat sink;

a first lead frame electrically connected to the heat sink, the first lead frame comprising;

a first inner lead frame disposed inside the package body; and

a first outer lead frame coupled with the first inner lead frame, the first outer lead frame protruding from the package body and comprising a first bent portion;

a second lead frame separated from the heat sink, the second lead frame comprising;

a second inner lead frame disposed inside the package body; and

a second outer lead frame coupled with the second inner lead frame, the second outer lead frame protruding from the package body and comprising a second bent portion; and

an opening defined by a first side edge of the first inner lead frame and a second side edge of the first inner lead frame, wherein the second inner lead frame is arranged in the opening and directly between the first side edge and the second side edge,

wherein the first inner lead frame is arranged around a portion of the heat sink on which the light-emitting chip is arranged, and

wherein the upper portion of the heat sink is arranged above the first inner lead frame and the second inner lead frame.