Light emitting diode (LED) packages, systems, devices and related methods
First Claim
Patent Images
1. A package for a light emitting diode (LED) comprising:
- a lead frame comprising an electrically conductive chip carrier comprising an upper surface for attachment of one or more LEDs;
a casing covering at least a portion of the lead frame; and
a reflector cavity disposed at least partially within the casing, the cavity having substantially parallel and angled side wall portions disposed between substantially parallel and angled end wall portions, the angled side wall portions and angled end wall portions surrounding at least a portion of the upper surface of the chip carrier, the side wall portions extending at an angle that is different from an angle at which the end wall portions extend.
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0 Petitions
Accused Products
Abstract
Packages, systems, and devices for light emitting diodes (LEDs) and related methods are provided. The packages can include a lead frame with an electrically conductive chip carrier comprising an upper surface. An LED can be placed on the upper surface of the electrically conductive chip carrier. A casing can be disposed on the lead frame covering at least a portion of the lead frame. A reflector cavity can be in the casing surrounding the LED. The reflector cavity can have angled side wall portions and angled end wall portions with an angle at which the side wall portions are angled that is different from an angle at which the end wall portions are angled.
130 Citations
37 Claims
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1. A package for a light emitting diode (LED) comprising:
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a lead frame comprising an electrically conductive chip carrier comprising an upper surface for attachment of one or more LEDs; a casing covering at least a portion of the lead frame; and a reflector cavity disposed at least partially within the casing, the cavity having substantially parallel and angled side wall portions disposed between substantially parallel and angled end wall portions, the angled side wall portions and angled end wall portions surrounding at least a portion of the upper surface of the chip carrier, the side wall portions extending at an angle that is different from an angle at which the end wall portions extend. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A light emitting diode (LED) package comprising:
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a lead frame comprising an electrically conductive chip carrier comprising an upper surface; at least one LED on the upper surface of the electrically conductive chip carrier; a casing disposed on and covering at least a portion of the lead frame; a reflector cavity in the casing, the cavity having angled side wall portions and angled end wall portions surrounding the LED, the angled side wall portions of the reflector cavity being disposed along an angle of approximately 50°
or more, and the angled end wall portions of the reflector cavity being disposed along an angle of approximately 70°
or more; andthe LED package having a width distance as measured between outer side walls of the LED package of less than approximately 3.0 mm, and the LED package having a length distance as measured between outer end walls of the LED package of less than approximately 3.5 mm.
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20. A method of providing a light emitting device, the method comprising:
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providing a lead frame comprising an electrically conductive chip carrier comprising an upper surface; securing a casing covering at least a portion of the lead frame; and forming a reflector cavity in the casing surrounding at least a portion of the upper surface, the reflector cavity having substantially parallel and angled side wall portions disposed between substantially parallel and angled end wall portions;
wherein an angle at which the side wall portions are angled is different from an angle at which the end wall portions are angled. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. An LED display comprising:
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a printed circuit board (PCB); and an array of LED packages arranged in vertical columns and horizontal rows and electrically connected to the PCB, each of LED packages comprising; a lead frame comprising an electrically conductive chip carrier comprising an upper surface; an LED on the upper surface of the electrically conductive chip carrier; a casing disposed on the lead frame and covering at least a portion of the lead frame; and a reflector cavity in the casing having angled side wall portions and angled end wall portions surrounding the LED, the side wall portions extending at an angle that is different from an angle at which the end wall portions extend.
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34. An LED backlighting device comprising:
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a printed circuit board (PCB); and an array of LED packages arranged in vertical columns and horizontal rows and electrically connected to the PCB, each of LED packages comprising; a lead frame comprising an electrically conductive chip carrier comprising an upper surface; an LED on the upper surface of the electrically conductive chip carrier; a casing disposed on the lead frame and covering at least a portion of the lead frame; and a reflector cavity in the casing having angled side wall portions and angled end wall portions surrounding the LED, the side wall portions extending at an angle that is different from an angle at which the end wall portions extend. - View Dependent Claims (35)
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36. An LED lighting device comprising:
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a printed circuit board (PCB); and a strip of LED packages arranged in a row and electrically connected to the PCB, each of LED packages comprising; a lead frame comprising an electrically conductive chip carrier comprising an upper surface; an LED on the upper surface of the electrically conductive chip carrier; a casing disposed on the lead frame and covering at least a portion of the lead frame; and a reflector cavity in the casing having angled side wall portions and angled end wall portions surrounding the LED, the side wall portions extending at an angle that is different from an angle at which the end wall portions extend. - View Dependent Claims (37)
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Specification