Resistive touch screen and method for manufacturing same

• US 8,610,691 B2
• Filed: 08/07/2009
• Issued: 12/17/2013
• Est. Priority Date: 08/19/2008
• Status: Active Grant

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Inventors: Cherif, Mondher
• Primary Examiner(s): Eisen, Alexander
• Assistant Examiner(s): MISHLER, ROBIN J
• Application Number:
  US12/537,620
• Publication Number:
  US 20100156842A1
• Time in Patent Office: 1,593 Days
• Field of Search: 345173-177
• US Class Current: 345/174
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

A touch screen and method for manufacturing a touch screen includes a transparent substrate having a first surface and a second surface opposite the first surface. The transparent substrate has a first transparent conductive layer disposed on the first surface. A cover sheet is spaced from the substrate by a plurality of spacer elements and has a second transparent conductive layer coated at a surface of the cover sheet and opposed to the first transparent conductive layer. An electromagnetic interference shield is disposed at the second surface of the transparent substrate. The electromagnetic interference shield includes a third transparent conductive layer.

Claims

1. A method of manufacturing a resistive touch screen comprising:

providing a transparent substrate having a first surface and a second surface opposite said first surface, said transparent substrate having a first transparent conductive layer disposed on said first surface;

providing a cover sheet used as a contact layer having a second transparent conductive layer coated at a surface of said cover sheet;

spacing said cover sheet from said transparent substrate by a plurality of spacer elements and with said second transparent conductive layer opposing said first transparent conductive layer of said transparent substrate; and

providing a grounded electromagnetic interference shield at said second surface of said transparent substrate after oxidizing, said first transparent conductive layer and before reducing said first transparent conductive layer, said grounded electromagnetic interference shield comprising a third transparent conductive layer.

2. The method of claim 1, wherein providing said grounded electromagnetic interference shield at said second surface of said transparent substrate comprises providing said grounded electromagnetic interference shield at said second surface of said transparent substrate before cutting said transparent substrate to its final form.

3. The method of claim 1, wherein said first transparent conductive layer and said grounded electromagnetic interference shield comprise the same material.

4. The method of claim 1, wherein providing said transparent substrate comprises providing said transparent substrate and coating said first surface of said transparent substrate with a first transparent conductive layer, and wherein providing said grounded electromagnetic interference shield at said second surface of said transparent substrate comprises coating said grounded electromagnetic interference shield at said second surface of said transparent substrate.

5. The method of claim 4, wherein coating said first surface of said transparent substrate with said first transparent conductive layer and coating said grounded electromagnetic interference shield at said second surface of said transparent substrate are accomplished in the same coating process.

6. The method of claim 1, further comprising providing at least one optical enhancing layer or durability enhance layer disposed on said grounded electromagnetic interference shield.