Micro-electromechanical device

• US 8,610,997 B2
• Filed: 10/22/2011
• Issued: 12/17/2013
• Est. Priority Date: 04/30/2009
• Status: Active Grant

• Current Assignee: Toshiyuki Kaeriyama
• Original Assignee: Toshiyuki Kaeriyama
• Inventors: Kaeriyama, Toshiyuki
• Primary Examiner(s): Ben, Loha
• Application Number:
  US13/279,259
• Publication Number:
  US 20120069422A1
• Time in Patent Office: 787 Days
• Field of Search: 359290-295, 359/298, 359/224.1, 359/224.2, 359/223.1, 359/212.1, 359/212.2, 359/213.1, 359/230, 359/233, 359/237, 438/50, 438/52, 438/65, 438/66, 257/418, 345/690, 428/117
• US Class Current: 359/291
• CPC Class Codes: G02B 26/06 for controlling the phase of light G02B26/08 takes precedence , measuring optical phase difference G01J9/00
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

As for the method that modulates optical path length by the position of reflection plane of light, the movement of the position-movable plate in micrometer-size electromechanical device can be restricted by the stopping plates placed above and below the edge of the position-movable plate, the distance between the stopping plates may be set depending on the desired amount in modulating the optical path length. The voltage differential in the device is operable to create electrostatic attraction, to perform transition movement of the position-movable plate between the stopping plates, the light reflector connected to the position-movable plate takes at least two states in positioning, enabling to modulate the optical path length of reflected light by the light reflector with high reproducibility and high accuracy.

Claims

1. A micro-electromechanical device, said device comprising:

a substrate;

a 1^st layer level metal plate supported on said substrate;

a 5^th layer level metal plate, supported by a first set of two or more metal support pillars laid out around said 5^th layer level metal plate on said substrate;

a 3^rd layer level metal plate, said 3^rd layer level metal plate being attached to two or more bendable metal elements mounted on a second set of metal support pillars laid out around said 3^rd layer level metal plate;

two or more 2^nd layer level metal stopping plates laid out around said 3^rd layer level metal plate with making free ends of said 2^nd layer level metal stopping plates overlap slightly to the bottom surface of an edge of said 3^rd layer level metal plate below said 3^rd layer level metal plate and above said 1^st layer level metal plate, while two or more opposite ends to the free ends of said 2^nd layer level metal stopping plates are connected to corresponding two or more of a third set of metal support pillars;

two or more 4^th layer level metal stopping plates laid out around said 3^rd layer level metal plate with making free ends of said 4^th layer level metal stopping plates overlap slightly to the upper surface of the edge of said 3^rd layer level metal plate above said 3^rd layer level metal plate and below said 5th layer level metal plate, while two or more opposite ends to the free ends of said 4^th layer level metal stopping plates are connected to said corresponding two or more of said third set of metal support pillars;

a 6^th layer level metal plate supported by a metal support pillar built on said 3^rd layer level metal plate not to make any contact with said 5^th layer level metal plate;

a gap among said 1^st layer level metal plate, said 5^th layer level metal plate, two or more said 2^nd layer level metal stopping plates, two or more said 4^th layer metal level stopping plates, two or more said bendable metal elements at 3^rd layer level, said 3^rd layer level metal plate, said 6^th layer level metal plate, and said metal support pillar built on said 3^rd layer level metal plate, allowing operability for bending two or more said bendable metal elements at said 3^rd layer level, position—

movement of said 3^rd layer level metal plate together with said metal support pillar built on said 3^rd layer level metal plate and said 6^th layer level metal plate, and stopping of position—

movement of said 3^rd layer level metal plate by either said 2^nd layer level metal stopping plates or said 4^th layer level metal stopping plates; and

a position-movable rigid metal member comprising said 3^rd layer level metal plate, said 6^th layer level metal plate, said metal support pillar built on said 3^rd layer level metal plate, and two or more said bendable metal elements fixed to corresponding two or more of said second set of metal support pillars on said substrate; and

an electrical connection of a bias voltage to said position-movable rigid metal member and two or more said 2^nd layer metal stopping plates and two or more said 4^th layer metal stopping plates, the electrical connection of a complementary output voltage to said 1^st layer metal plate, and the electrical connection of a complementary output-bar voltage to said 5^th layer metal plate, wherein the voltage differential among said 1^st layer plate, said 5^th layer plate, and said position-movable rigid metal member is operable to create electrostatic attraction with said 1^st layer level metal plate and said 5^th layer level metal plate to cause said 3^rd layer level metal plate in said position-movable rigid metal member to move toward either said 1^st layer level metal plate or said 5^th layer level metal plate and to stop and settle on either two or more said 2^nd layer level metal stopping plates or two or more said 4^th layer level metal stopping plates, allowing said position-movable rigid metal member to take at least two states in positioning.

2. The device set forth in claim 1, wherein said substrate includes discrete area for providing signals for controlling said position movement of said position-movable rigid metal member.

3. The device set forth in claim 2, wherein said substrate contains an address circuitry for issuing said complementary output voltage.

4. The device set forth in claim 3, wherein said substrate further contains a circuitry for issuing said bias voltage.

5. The device set forth in claim 1, wherein said gap is an air gap.

6. The device set forth in claim 1, wherein said bendable metal elements are hinges.

7. The device set forth in claim 1, wherein said 2^nd layer level metal stopping plates are 2^nd layer level metal cantilever stopping beams and 4^th layer metal stopping plates are 4^th layer level metal cantilever stopping beams.

8. The device set forth in claim 7, wherein a stress-strain characteristic of said 2^nd layer level metal cantilever stopping beams and said 4^th layer level metal cantilever stopping beams contributes to the degree of precision in positioning of said 6^th layer level metal plate in said position-movable rigid metal member.

9. The device set forth in claim 8, wherein the distance between the position in height that said 3^rd layer level metal plate is stopped and settled on upper surfaces of the free ends of said 2^nd layer level metal cantilever stopping beams and the position in height that said 3^rd layer level metal plate is stopped and settled on bottom surfaces of free ends of said 4^th layer level metal cantilever stopping beams is fine-tuned by the bias voltage from a bias voltage circuitry.

10. The device set forth in claim 1, wherein, said 3^rd layer level metal plate levels in the middle height between the height of bottom surface of 5^th layer level metal plate and the height of upper surface of 1^st layer level metal plate, when said bias voltage, said complementary output voltage, and said complementary output-bar voltage are turned off.

11. The device set forth in claim 1, wherein the middle height between the height of bottom surface of said 5^th layer level metal plate and the height of upper surface of said 1^st layer level metal plate is equivalent to the middle height between the height of bottom surface of said 4^th layer level metal plate and the height of upper surface of said 2^nd layer level metal plate.

12. The device set forth in claim 1, wherein the height of said metal support pillar connecting said 3^rd layer level metal plate and said 6^th layer level metal plate is set up more than the sum total value of the thickness of said 5^th layer level metal plate and the twice of the distance between the position in height of the bottom surface of said 5^th layer level metal plate and the position in height of the upper surface of said 2^nd layer level metal plate.

13. The device set forth in claim 1, wherein said metal support pillar connecting said 3^rd layer level metal plate and said 6^th layer level metal plate passes through an aperture formed in the middle of said 5^th layer level metal plate not to make contact with any edge of said aperture in said 5^th layer level metal plate.

14. The device set forth in claim 1, wherein said 6^th layer level metal plate is light reflector.

15. The device set forth in claim 14, wherein said 6^th layer level metal plate hides underlying structure.

16. An array that consists of many devices, each being of the type of the device set forth in claim 1, said 6^th layer level metal plate in said device individually allowing to take at least two states of upper positioning and lower positioning in height, said array comprising

a base structure for supporting all of said 6^th layer level metal plates of said many devices, said array being maintained in a plane separate from the plane of said base structure;

a surface area formed of many plates of said 6^th layer level metal plate of said device, wherein the optical path length of the light plane reflected from said surface area is modulated with resolution.