CMOS structures and processes based on selective thinning
First Claim
1. A method of fabricating semiconductor devices, comprising:
- providing a substrate having a semiconducting surface and a first layer disposed directly on the semiconducting surface, the semiconducting surface having formed therein a plurality of active regions, the plurality of active regions comprising at least a first active region and a second active region, each of the first active region and the second active region comprising the first layer and a second layer, the first layer comprising a substantially undoped layer that extends across the semiconducting surface and the second layer comprising at least one highly doped screening layer, a combination of the first layer and the second layer defining at least one device characteristic for the semiconductor devices in each of the first active region and the second active region;
identifying at least one device characteristic target required for the semiconductor devices in at least a portion of the first active region, the at least one device characteristic target comprising at least a threshold voltage target;
tuning the at least one device characteristic in the portion of the first active region to match the at least one device characteristic target by performing a first process with the substrate to remove a part of the first layer to reduce a thickness of the first layer in the portion of the first active region without a corresponding thickness reduction of the first layer in the second active region, the portion of the first active region defining at least one processed region; and
forming the semiconductor devices in at least the one processed region and the second active region,wherein a gate for the semiconductor devices is formed directly on the first layer, and wherein the part of the first layer is selected based on the at least one device characteristic target.
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Accused Products
Abstract
Methods for fabricating semiconductor devices and devices therefrom are provided. A method includes providing a substrate having a semiconducting surface with first and second layers, where the semiconducting surface has a plurality of active regions comprising first and second active regions. In the first active region, the first layer is an undoped layer and the second layer is a highly doped screening layer. The method also includes removing a part of the first layer to reduce a thickness of the substantially undoped layer for at least a portion of the first active region without a corresponding thickness reduction of the first layer in the second active region. The method additionally includes forming semiconductor devices in the plurality of active regions. In the method, the part of the first layer removed is selected based on a threshold voltage adjustment required for the substrate in the portion of the first active region.
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Citations
18 Claims
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1. A method of fabricating semiconductor devices, comprising:
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providing a substrate having a semiconducting surface and a first layer disposed directly on the semiconducting surface, the semiconducting surface having formed therein a plurality of active regions, the plurality of active regions comprising at least a first active region and a second active region, each of the first active region and the second active region comprising the first layer and a second layer, the first layer comprising a substantially undoped layer that extends across the semiconducting surface and the second layer comprising at least one highly doped screening layer, a combination of the first layer and the second layer defining at least one device characteristic for the semiconductor devices in each of the first active region and the second active region; identifying at least one device characteristic target required for the semiconductor devices in at least a portion of the first active region, the at least one device characteristic target comprising at least a threshold voltage target; tuning the at least one device characteristic in the portion of the first active region to match the at least one device characteristic target by performing a first process with the substrate to remove a part of the first layer to reduce a thickness of the first layer in the portion of the first active region without a corresponding thickness reduction of the first layer in the second active region, the portion of the first active region defining at least one processed region; and forming the semiconductor devices in at least the one processed region and the second active region, wherein a gate for the semiconductor devices is formed directly on the first layer, and wherein the part of the first layer is selected based on the at least one device characteristic target. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating an integrated circuit comprising a plurality of semiconductor devices defined in a plurality of active regions of a substrate having a semiconducting surface and a first layer disposed directly on the semiconducting surface, the plurality of active regions comprising at least a first active region and a second active region, each of the first active region and the second active region comprising the first layer and a second layer, the first layer comprising a substantially undoped layer of a pre-defined thickness range layer that extends across the semiconducting surface and the second layer comprising a highly doped screening layer, the method comprising:
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identifying a first target thickness range for the substantially undoped layer in the first active region based on at least one pre-defined device characteristic target for the first active region and pre-defined doping conditions for the substrate, the at least one pre-defined device characteristic target comprising a threshold voltage target; if the first target thickness range and the pre-defined thickness range fail to meet a minimum overlap criteria, tuning a threshold voltage for the first active region by determining a first amount of the first layer to remove from the first active region to provide a first reduced thickness range for the substantially undoped layer in the first active region that meets the minimum overlap criteria; performing a first process with the substrate to remove the first amount of the first layer from the selected portion without removing the first amount in other portions of the semiconducting surface; and forming semiconductor devices in at least the selected portion and the second active region, wherein a gate for the semiconductor devices is formed directly on the first layer. - View Dependent Claims (9, 10, 11, 12)
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13. A method of fabricating an integrated circuit, comprising:
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providing a substrate with a semiconducting surface, the semiconducting surface comprising silicon; defining a plurality of active regions in the semiconducting surface, the plurality of active regions comprising at least one first active region with a first highly doped screening layer and at least one second active region with a second highly doped screening layer; forming a substantially undoped epitaxial layer comprising silicon that extends across the semiconducting surface, a combination of the substantially undoped epitaxial layer and the first highly doped screening layer defining a threshold voltage for semiconductor devices in the at least one first active region, and a combination of the substantially undoped epitaxial layer and the second highly doped screening layer defining the threshold voltage for semiconductor devices in the at least one second active region; after said forming, identifying an threshold voltage adjustment required for the semiconductor devices in the at least one first active region; tuning the threshold voltage for the at least one first active region by performing a first process with the substrate that removes a portion of the substantially undoped epitaxial layer over the at least one first active region without removing a corresponding portion of the layer of the substantially undoped epitaxial layer over the at least one second active region; forming semiconductor devices in plurality of active regions, wherein a gate for the semiconductor devices is disposed directly on the substantially undoped epitaxial layer, and wherein the portion of the first layer is selected based at least on the threshold voltage adjustment. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification