Method and system for assembly of glass substrate-based radiological imaging sensor

• US 8,614,421 B2
• Filed: 03/06/2012
• Issued: 12/24/2013
• Est. Priority Date: 03/07/2011
• Status: Active Grant

• Current Assignee: Teledyne Digital Imaging, Inc. (Teledyne Technologies Incorporated)
• Original Assignee: Teledyne Dalsa Incorporated (Teledyne Technologies Incorporated)
• Inventors: van Arendonk, Anton, Lomako, Andrey, Tang, Weidong, Benwell, Brian
• Primary Examiner(s): Kim, Kiho
• Application Number:
  US13/413,114
• Publication Number:
  US 20120228512A1
• Time in Patent Office: 658 Days
• Field of Search: 250/368, 25037001-37015, 378/98.8
• US Class Current: 250/368
• CPC Class Codes: G01T 1/2006 using a combination of a scintillator and photodetector which measures the means radiation intensity

Abstract

A method and system of constructing and assembling a radiological imaging sensor having a transparent crystalline substrate plate, such as a glass or sapphire plate, for use in assembling the radiological imaging sensor using either a clear fiber optic plate of a dark fiber optic plate with ultraviolet curable adhesives. The transparent glass substrate plate may further include at least one crystalline sapphire strip disposed in an aperture therewithin. Flexible cable connections are provided by wire bonding to the imaging die substrate.

Claims

1. A method of assembling a radiological imaging sensor comprising:

providing a transparent crystalline substrate plate having an upper side and a bottom side;

applying a first layer of ultra-violet curable adhesive to the upper side of the crystalline substrate plate;

placing an imaging die on top of the first layer of ultra-violet curable adhesive, the imaging die having an active image sensor region located at a top surface of the imaging die;

curing the first layer of ultra-violet curable adhesive by exposure to ultra-violet radiation, the ultra-violet radiation applied through the bottom side of the transparent crystalline substrate plate;

providing at least one flexible cable connection by forming a wire bond from the flexible cable to the imaging die;

applying a second layer of ultra-violet curable adhesive to the top surface of the imaging die, the second layer covering at least the active image sensor region;

stacking a clear fiber optic plate on the top surface of the imaging die, the clear fiber optic plate covering at least the image sensor region;

curing the second layer of ultra-violet curable adhesive by exposure to ultra-violet radiation, the ultra-violet radiation applied through a top side of the stacked clear fiber optic plate; and

providing a scintillator layer on a top surface of the clear fiber optic plate.

2. The method of claim 1 wherein the scintillator layer is provided by deposition on the top surface of the clear fiber optic plate.

3. The method of claim 1 wherein the scintillator layer comprises a paper strip of scintillator material.

4. The method of claim 3 further comprising securing the paper scintillator strip onto the radiological imaging sensor by attaching a press-on cover.

5. The method of claim 1 wherein the transparent crystalline substrate plate is one of a glass substrate plate and a sapphire substrate plate.

6. The method of claim 1 wherein the imaging die consists of one of a complementary metal oxide semiconductor (CMOS) and a charge couple device (CCD) imaging sensor.

7. The method of claim 1 wherein the transparent crystalline substrate plate comprises a glass substrate plate, the glass substrate plate further including at least one crystalline sapphire strip disposed in an aperture therewithin.

11. The method of claim 1 wherein the imaging die consists of one of a complementary metal oxide semiconductor (CMOS) and a charge couple device (CCD) imaging sensor.

8. A method of assembling a radiological imaging sensor comprising:

providing a transparent crystalline substrate plate having an upper side and a bottom side;

applying a first layer of ultra-violet curable adhesive to the upper side of the crystalline substrate plate;

placing an imaging die on top of the first layer of ultra-violet curable adhesive, the imaging die having an active image sensor region located at a top surface of the imaging die;

curing the first layer of ultra-violet curable adhesive by exposure to ultra-violet radiation, the ultra-violet radiation applied through the bottom side of the transparent crystalline substrate plate;

providing at least one flexible cable connection by forming a wire bond from the flexible cable to the imaging die;

applying a second layer of ultra-violet curable adhesive to the top surface of the imaging die, the second layer covering at least the active image sensor region; and

stacking a dark fiber optic plate on the top surface of the imaging die, the dark fiber optic plate having a coating of scintillator material on a surface distal the imaging die, the dark fiber optic plate further being secured in place by support protrusions applied around a perimeter of the dark fiber optic plate.

9. The method of claim 8 further comprising exposing the scintillator layer to incident x-rays, wherein scintilator emissions cure the second layer of ultra-violet curable adhesive, thereby bonding the dark fiber optic plate onto the imaging die.

10. The method of claim 8 wherein the transparent crystalline substrate plate comprises a transparent glass substrate plate, the transparent glass plate further including at least one crystalline sapphire strip disposed in an aperture therewithin.

12. A radiological imaging sensor comprising:

a transparent crystalline substrate plate having an upper side and a bottom side;

an imaging die disposed on top of the first layer of ultra-violet curable adhesive, the imaging die having an active image sensor region located at a top surface of the imaging die, the imaging die secured in place by a first layer of ultra-violet curable adhesive applied to the upper side of the crystalline substrate plate;

at least one flexible cable connection provided by forming a wire bond from the flexible cable to the imaging die;

a clear fiber optic plate stacked on the top surface of the imaging die, the clear fiber optic plate covering at least the image sensor region, the clear fiber optic plate secured in place by a second layer of ultra-violet curable adhesive applied to the top surface of the imaging die; and

a scintillator layer disposed on a top surface of the clear fiber optic plate.

13. The radiological imaging sensor of claim 12 wherein the scintillator layer is provided by deposition on the top surface of the clear fiber optic plate.

14. The radiological imaging sensor of claim 12 wherein the scintillator layer comprises a paper strip of scintillator material.

15. The radiological imaging sensor of claim 14 further comprising securing the paper scintillator strip onto the radiological imaging sensor using a press-on cover.

16. The radiological imaging sensor of claim 12 wherein the transparent crystalline substrate plate is one of a glass substrate plate and a sapphire substrate plate.

17. The radiological imaging sensor of claim 12 wherein the imaging die is one of a complementary metal oxide semiconductor (CMOS) and a charge coupled device (CCD) imaging sensor.

18. A radiological imaging sensor comprising:

a transparent glass substrate plate having an upper side and a bottom side;

an imaging die stacked on top of the glass plate substrate, the imaging die secured in place by a first layer of ultra-violet curable adhesive, the imaging die having an active image sensor region located at a top surface of the imaging die;

at least one flexible cable connection provided by forming a wire bond from the flexible cable to the imaging die;

a dark fiber optic plate stacked on the top surface of the imaging die, the dark fiber optic plate being secured in place by support protrusions applied around a perimeter of the dark fiber optic plate;

a second layer of ultra-violet curable adhesive applied between the top surface of the imaging die and a bottom surface of the dark fiber optic plate; and

a scintillator layer deposited on a top surface of the dark fiber optic plate, the scintillator layer disposed over at least the active image sensor region of the imaging die.

19. The radiological imaging sensor of claim 18 wherein the imaging die consists of one of a charge couple device (CCD) imaging sensor and a complementary metal oxide semiconductor (CMOS) imaging sensor.

20. The radiological imaging sensor of claim 18 wherein the glass substrate plate further includes at least one crystalline sapphire strip disposed in an aperture therewithin.