Semiconductor light emitting device

• US 8,614,457 B2
• Filed: 03/14/2013
• Issued: 12/24/2013
• Est. Priority Date: 11/14/2008
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Jeong, Hwan Hee
• Primary Examiner(s): Mandala, Victor A
• Application Number:
  US13/829,637
• Publication Number:
  US 20130200418A1
• Time in Patent Office: 285 Days
• Field of Search: 257/98, 257/99, 257/100, 257/E33.06, 257/E33.059, 257/E33.062
• US Class Current: 257/99
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/10 with a light reflecting structure, e.g. semiconductor Bragg reflector
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer. An electrode is on a bottom surface of the light emitting structure and an electrode layer and a conductive support member are disposed on the top surface of the light emitting structure. A recess is recessed from a top surface of the light emitting structure. A transmittive layer is between the light emitting structure and the electrode layer. The transmittive layer includes a first portion having a protrusion disposed in the recess.

Claims

1. A semiconductor light emitting device comprising:

a light emitting structure including a first conductive semiconductor layer, an active layer on a top surface of the first conductive semiconductor layer and a second conductive semiconductor layer on a top surface of the active layer;

an electrode disposed on a bottom surface of the light emitting structure;

a recess recessed from a top surface of the light emitting structure;

an electrode layer on the top surface of the light emitting structure;

a transmittive layer disposed between the light emitting structure and the electrode layer; and

a conductive support member disposed on a top surface of the electrode layer,

wherein the recess is recessed in a direction toward the bottom surface of the light emitting structure,

wherein the transmittive layer includes a first portion disposed between the top surface of the light emitting structure and the electrode layer and a second portion extended outward beyond an outer wall of the light emitting structure, and

wherein a protrusion of the first portion of the transmittive layer is disposed in the recess.

2. The semiconductor light emitting device of claim 1, wherein the recess is formed in plurality, the plurality of recesses are spaced apart from each other, and

wherein the protrusion of the first portion of the transmittive layer is disposed in the plurality of recesses, respectively.

3. The semiconductor light emitting device of claim 2, wherein the plurality of recesses are disposed at a peripheral portion of a top surface of the second conductive semiconductor layer.

4. The semiconductor light emitting device of claim 1, wherein the protrusion of the first portion of the transmittive layer is contacted with an inner region of the second conductive semiconductor layer.

5. The semiconductor light emitting device of claim 2, wherein the plurality of recesses is irregularly spaced apart from each other.

6. The semiconductor light emitting device of claim 1, wherein the protrusion of the first portion of the transmittive layer is located at a lower position than the top surface of the light emitting structure.

7. The semiconductor light emitting device of claim 1, wherein the electrode layer has a width wider than that of the top surface of the light emitting structure.

8. The semiconductor light emitting device of claim 1, wherein the conductive support member has a width wider than that of the top surface of the light emitting structure.

9. The semiconductor light emitting device of claim 7, wherein the transmissive layer includes an insulating material.

10. The semiconductor light emitting device of claim 1, wherein the transmissive layer includes a conductive material.

11. The semiconductor light emitting device of claim 1, wherein the electrode layer includes a protrusion protruded in a direction toward the bottom surface of the light emitting structure.

12. The semiconductor light emitting device of claim 1, wherein the protrusion of the electrode layer is directly contacted with the second conductive semiconductor layer.

13. The semiconductor light emitting device of claim 1, wherein at least one of the first conductive semiconductor layer and the second conductive semiconductor layer includes at least one selected from the group consisting of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP or AlGaInP.

14. The semiconductor light emitting device of claim 13, wherein the first conductive semiconductor layer is an n type semiconductor layer and the second conductive semiconductor layer is a p type semiconductor layer.

15. The semiconductor light emitting device of claim 14, wherein the conductive support member is formed of at least one selected from the group consisting of Cu, Au, Ni, Mo, Si, siC, SiGe, ZnO, GaN, or Ge.

16. The semiconductor light emitting device of claim 1, wherein the protrusion of the transmissive layer includes a height of about 10 nm to about 300 nm.

17. The semiconductor light emitting device of claim 1, wherein the protrusion of the transmissive layer is spaced apart from the outer wall of the light emitting structure by a distance about 1 μ

m to about 5 μ

m.

18. The semiconductor light emitting device of claim 12, wherein the electrode layer includes a reflective layer.

19. The semiconductor light emitting device of claim 1, further comprising a contact layer disposed on an interface between the electrode layer and the second conductive semiconductor layer.

20. The semiconductor light emitting device of claim 1, wherein the recess has a polygonal sectional shape.