Light emitting device and manufacturing method thereof
First Claim
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1. A light emitting device comprising:
- a transistor comprising a channel forming region, a gate insulating film, and a gate electrode over a substrate;
an insulating film having a contact hole over the transistor;
a layer having an uneven surface over the insulating film, wherein the uneven surface is provided opposite to a side of the layer closest to the substrate, wherein the uneven surface does not overlap with the contact hole, and wherein the uneven surface is intentionally formed;
a conductive film over the uneven surface, wherein the conductive film is electrically connected to the transistor through the contact hole;
an organic layer over the conductive film; and
an electrode over the organic layer.
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Abstract
There is provided a method for manufacturing a light emitting device in which no copy-in is caused in the case of a light emitting device having a glossy cathode. An uneven portion is formed on the surface of a cathode which is in contact with an organic layer in a pixel portion, and incident light is reflected in all directions. An insulating film having a high light absorption property is formed in a driver circuit portion, and the copy-in becomes invisible to the observer.
44 Citations
16 Claims
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1. A light emitting device comprising:
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a transistor comprising a channel forming region, a gate insulating film, and a gate electrode over a substrate; an insulating film having a contact hole over the transistor; a layer having an uneven surface over the insulating film, wherein the uneven surface is provided opposite to a side of the layer closest to the substrate, wherein the uneven surface does not overlap with the contact hole, and wherein the uneven surface is intentionally formed; a conductive film over the uneven surface, wherein the conductive film is electrically connected to the transistor through the contact hole; an organic layer over the conductive film; and an electrode over the organic layer. - View Dependent Claims (2, 3, 4)
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5. A light emitting device comprising:
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a transistor comprising a channel forming region, a gate insulating film, and a gate electrode over a substrate; a first insulating film over the transistor; a layer having an uneven surface on the first insulating film, wherein the uneven surface is provided opposite to a side of the layer closest to the substrate; a second insulating film on the first insulating film, wherein a contact hole is provided in the first insulating film and the second insulating film, and wherein the uneven surface does not overlap with the contact hole; a conductive film over the uneven surface, wherein the conductive film is electrically connected to the transistor through the contact hole; an organic layer over the conductive film; and an electrode over the organic layer. - View Dependent Claims (6, 7, 8)
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9. A light emitting device comprising:
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a transistor comprising a channel forming region, a gate insulating film, and a gate electrode over a substrate; an insulating film having a contact hole over the transistor; a layer comprising a resin, and having an uneven surface over the insulating film, wherein the uneven surface is provided opposite to a side of the layer closest to the substrate, and wherein the uneven surface does not overlap with the contact hole; a first electrode over the uneven surface, wherein the first electrode is electrically connected to the transistor through the contact hole; an organic layer over the first electrode and in contact with a portion of the first electrode; and a second electrode over the organic layer. - View Dependent Claims (10, 11, 12)
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13. A light emitting device comprising:
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a transistor comprising a channel forming region, a gate insulating film, and a gate electrode over a first substrate; an insulating film having a contact hole over the transistor; a layer having an uneven surface over the insulating film, wherein the uneven surface is provided opposite to a side of the layer closest to the first substrate, and wherein the uneven surface is intentionally formed; a first electrode over the uneven surface, wherein the first electrode is electrically connected to the transistor through the contact hole; an organic layer over the first electrode and in contact with a portion of the first electrode; a second electrode over the organic layer; and a second substrate over the second electrode bonded to the first substrate. - View Dependent Claims (14, 15, 16)
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Specification