Printed wiring board, electronic device, and printed wiring board manufacturing method

• US 8,614,898 B2
• Filed: 06/09/2011
• Issued: 12/24/2013
• Est. Priority Date: 06/10/2010
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Hiramatsu, Yasuji, Terada, Yuki, Muraki, Tetsuya
• Primary Examiner(s): Wilson, Adrian S
• Assistant Examiner(s): RATHOD, ABHISHEK M
• Application Number:
  US13/156,718
• Publication Number:
  US 20110304997A1
• Time in Patent Office: 929 Days
• Field of Search: 361760-764, 361/824, 361/39, 361/41, 361/18, 361/21, 361/104, 361/275.4, 428/209, 428/210, 174261-262, 174/258, 337/222, 337/208
• US Class Current: 361/761
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: Y10T 29/49107 Fuse making
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.

Claims

1. A printed wiring board comprising:

an insulating resinous substrate having an aperture unit;

a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate; and

a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other;

wherein at least a part of the fuse unit is disposed over the aperture unit, and is covered by a porous inorganic covering material having insulating properties, and

the inorganic covering material has a coefficient of thermal expansion approximately equal to that of the fuse unit.

2. The printed wiring board according to claim 1, wherein the inorganic covering material includes an inorganic binder and a ceramic filler.

3. The printed wiring board according to claim 2, wherein

the ceramic filler is particulate, powdered, or fibrous.

4. The printed wiring board according to claim 2, wherein

the ceramic filler consists of at least one from among alumina, zirconia, silica, and silicon carbide.

5. The printed wiring board according to claim 2, wherein

the inorganic binder consists of at least one from among soluble silicate, hardened ceramic sol, sepiolite, and attapulgite.

6. The printed wiring board according to claim 5, wherein

the ceramic sol consists of at least one from among alumina sol, silica sol, and titania sol.

7. The printed wiring board according to claim 1, wherein

the porosity of the inorganic covering material is approximately 10% to approximately 40%.

8. The printed wiring board according to claim 1, wherein

resin on the interior surface of the aperture unit in the resinous substrate is removed, and an uneven surface is formed.

9. The printed wiring board according to claim 8, wherein

ends of a fibrous stiffener are exposed on the surface.

10. The printed wiring board according to claim 1, wherein

the resinous substrate consists of an epoxy resin impregnated with glass cloth.

11. The printed wiring board according to claim 1, wherein

the resinous substrate consists of a polyester resin, Bismaleimide-Triazine resin, imide resin, phenol resin, or allyl-containing phenylene ether resin impregnated with paper, glass fiber, or aramid fiber.

12. The printed wiring board according to claim 1, wherein

the material of the fuse unit and the material of the first terminal unit and the second terminal unit are approximately the same.

13. The printed wiring board according to claim 1, wherein a conductor width of the fuse unit is in a range from approximately 0.2 mm to approximately 0.5 mm, and a conductor length of the fuse unit is in a range from approximately 2 mm to approximately 15 mm.

14. The printed wiring board according to claim 5, wherein

the soluble silicate is water glass with sodium silicate as its principal ingredient.

15. The printed wiring board according to claim 1, wherein the fuse unit is formed with copper, and the coefficient of thermal expansion for the inorganic covering material is in a range from approximately 10 ppm/°

C. to approximately 25 ppm/°

C.

16. The printed wiring board according to claim 1, wherein

the cross-sectional shape of the fuse unit is an approximate trapezoid.

17. The printed wiring board according to claim 1, wherein

the cross-sectional shape of the fuse unit is an approximate rectangle.

18. The printed wiring board according to claim 1, wherein the conductor pattern of the fuse unit is

a linear pattern whose parts coupling the fuse unit to the first terminal unit and the second terminal unit are thicker,

a pattern whose parts coupling the fuse unit to the first terminal unit and the second terminal unit are tapered,

an approximately S-shaped pattern whose pattern curves are curved or straight, or

a U-shaped pattern that does not proceed directly in the X direction in which the first terminal unit and the second terminal unit are arranged, but instead detours in the Y direction orthogonal to the X direction.

19. The printed wiring board according to claim 1, wherein

a part of the fuse unit is a hanging part.

20. The printed wiring board according to claim 1, wherein

the entirety of the fuse unit is a hanging part.

21. The printed wiring board according to claim 1, wherein

the first terminal unit, the second terminal unit, and the fuse unit are integrally formed.

22. The printed wiring board according to claim 1, wherein

the fuse unit consists of a conductor bar, the two ends of which are respectively coupled to the first terminal unit and the second terminal unit by a conductive adhesive or solder.

23. An electronic device comprising:

a plurality of electronic components; and

the printed wiring board according to claim 1;

wherein

the fuse unit is individually provided for each of the plurality of electronic components.

24. The electronic device according to claim 23, wherein

the fuse units of the printed wiring board are coupled in series to a power source and the electronic components.

25. The electronic device according to claim 23, wherein

a power source and the electronic components are electrically coupled to each other via a load.

26. The electronic device according to claim 23, wherein

a plurality of loads are coupled in parallel, and the respective loads are coupled in series to the electronic components and the fuse units.

27. The electronic device according to claim 23, wherein

the electronic components are semiconductor elements.

28. The electronic device according to claim 23, wherein

each electronic component is an IC circuit, a capacitor, a resistor, or a coil.

29. The printed wiring board according to claim 23, wherein the inorganic covering material includes an inorganic binder and a ceramic filler.

30. The electronic device according to claim 29, wherein

the ceramic filler is particulate, powdered, or fibrous.

31. The electronic device according to claim 29, wherein

the ceramic filler consists of at least one from among alumina, zirconia, silica, and silicon carbide.

32. The electronic device according to claim 29, wherein

the inorganic binder consists of at least one from among soluble silicate, hardened ceramic sol, sepiolite, and attapulgite.

33. The electronic device according to claim 32, wherein

the ceramic sol consists of at least one from among alumina sol, silica sol, and titania sol.

34. The electronic device according to claim 23, wherein

the porosity of the inorganic covering material of the printed wiring board is approximately 10% to approximately 40%.

35. The electronic device according to claim 23, wherein

on the printed wiring board, resin on the interior surface of the aperture unit in the resinous substrate is removed, and an uneven surface is formed.

36. The electronic device according to claim 35, wherein

ends of a fibrous stiffener are exposed on the surface.

37. The electronic device according to claim 23, wherein

the resinous substrate of the printed wiring board consists of an epoxy resin impregnated with glass cloth.

38. The electronic device according to claim 23, wherein

the resinous substrate of the printed wiring board comprising a polyester resin, Bismaleimide-Triazine resin, imide resin, phenol resin, or allyl-containing phenylene ether resin impregnated with paper, glass fiber, or aramid fiber.

39. The electronic device according to claim 23, wherein

on the printed wiring board, the material of the fuse unit and the material of the first terminal unit and the second terminal unit are approximately the same.

40. The printed wiring board according to claim 23, wherein a conductor width of the fuse unit is in a range from approximately 0.2 mm to approximately 0.5 mm, and a conductor length of the fuse unit is in a range from approximately 2 mm to approximately 15 mm.

41. The electronic device according to claim 32, wherein

the soluble silicate is water glass with sodium silicate as its principal ingredient.

42. The electronic device according to claim 23, wherein

the inorganic covering material of the printed wiring board has a coefficient of thermal expansion approximately equal to that of the fuse unit.

43. The electronic device according to claim 42, wherein the fuse unit is formed with copper, and the coefficient of thermal expansion for the inorganic covering material is in a range from approximately 10 ppm/°

C. to approximately 25 ppm/°

C.

44. The electronic device according to claim 23, wherein

the cross-sectional shape of the fuse unit is an approximate trapezoid.

45. The electronic device according to claim 23, wherein

the cross-sectional shape of the fuse unit is an approximate rectangle.

46. The printed wiring board according to claim 23, wherein the conductor pattern of the fuse unit is

a linear pattern whose parts coupling the fuse unit to the first terminal unit and the second terminal unit are thicker,

a pattern whose parts coupling the fuse unit to the first terminal unit and the second terminal unit are tapered,

an approximately S-shaped pattern whose pattern curves are curved or straight, or

a U-shaped pattern that does not proceed directly in the X direction in which the first terminal unit and the second terminal unit are arranged, but instead detours in the Y direction orthogonal to the X direction.

47. The electronic device according to claim 23, wherein

a part of the fuse unit of the printed wiring board is a hanging part.

48. The electronic device according to claim 23, wherein

the entirety of the fuse unit of the printed wiring board is a hanging part.

49. The electronic device according to claim 23, wherein

the first terminal unit, the second terminal unit, and the fuse unit are integrally formed on the printed wiring board.

50. The electronic device according to claim 23, wherein

on the printed wiring board, the fuse unit consists of a conductor bar, the two ends of which are respectively coupled to the first terminal unit and the second terminal unit by a conductive adhesive or solder.