Field barrier structures within a conformal shield

• US 8,614,899 B2
• Filed: 03/08/2012
• Issued: 12/24/2013
• Est. Priority Date: 06/27/2007
• Status: Expired due to Fees

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: RF Micro Devices Incorporated (Qorvo, Inc.)
• Inventors: Madsen, Ulrik Riis, Ubbesen, Lars Sandahl
• Primary Examiner(s): Swanson, Walter H
• Application Number:
  US13/415,643
• Publication Number:
  US 20120170239A1
• Time in Patent Office: 656 Days
• Field of Search: 361/777
• US Class Current: 361/777
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01016 Sulfur [S]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2203/0723 : Electroplating, e.g. finish plating
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/181 : by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49 : Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 : by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49153 : with shaping or forcing terminal into base aperture
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49789 : Obtaining plural product pieces from unitary workpiece

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Claims

1. A meta-module comprising:

a substrate;

a ground plane located inside of the substrate or located on a bottom surface of the substrate;

a component area located on a top surface of the substrate, wherein the component area includes a first electronic component and a second electronic component;

a metallic layer grid located on the top surface of the substrate and substantially surrounding the component area;

a dielectric body substantially covering the component area;

an electromagnetic shield substantially covering the dielectric body, and in electrical communication with the metallic layer grid;

a shield via electrically connecting the metallic layer grid to the ground plane through the substrate, such that the electromagnetic shield, the metallic layer grid, the shield via, and the ground plane are all in electrical communication with each other;

a first field barrier structure, wherein the first field barrier structure begins at an upper portion of the electromagnetic shield, extends downward through the dielectric body, and extends further downward through the component area, such that the first field barrier structure is in electrical communication with the electromagnetic shield, the metallic layer grid, the shield via, and the ground plane, and

wherein the first field barrier structure is configured to reduce electromagnetic interference between the first electrical component and the second electronic component.

2. The meta-module of claim 1, further comprising:

a first field barrier structure via located inside of the substrate and electrically connecting the ground plane with the first field barrier structure.

3. The meta-module of claim 1, wherein a lower surface of the first field barrier structure terminates on the top surface of the substrate, and wherein the first field barrier structure is in electrical communication with the ground plane only through a path including the electromagnetic shield, the metallic layer grid, and the shield via.

4. The meta-module of claim 1, further comprising:

a second field barrier structure; and

a third electronic component, and

wherein the first field barrier structure is located adjacent to the first electronic component and to the second electronic component, such that the first field barrier structure reduces electromagnetic interference between the first electronic component and the second electronic component, and

wherein the second field barrier structure is located adjacent to the second electronic component and to the third electronic component, such that the second field barrier structure reduces electromagnetic interference between the second electronic component and the third electronic component.

5. The meta-module of claim 1, wherein the second electronic component is substantially rectangular, and wherein the first field barrier structure and the second field barrier structure are located diagonally across from each other relative to the second electronic component.

6. The meta-module of claim 5, further comprising additional electronic components and additional field barrier structures, wherein the field barrier structures are staggered between the electronic components.

7. The meta-module of claim 1, wherein the field barrier structure is cylindrically shaped.

8. The meta-module of claim 1, wherein the field barrier structure is shaped like a wall.

9. The meta-module of claim 1, wherein the first field barrier structure is located between a first wall of the first electronic component and a first wall of the second electronic component.