Process control using analysis of an upstream process

• US 8,615,314 B1
• Filed: 09/02/2004
• Issued: 12/24/2013
• Est. Priority Date: 09/02/2004
• Status: Active Grant

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Sonderman, Thomas J., Bode, Christopher A., Pasadyn, Alexander J.
• Primary Examiner(s): VON BUHR, MARIA N
• Application Number:
  US10/932,989
• Time in Patent Office: 3,400 Days
• Field of Search: 700 28- 31, 700/44, 700/45, 700 47- 50, 700108-110, 700117-121, 700/173, 700/174, 706902-904, 706/906, 706/911, 706/912, 706/914
• US Class Current: 700/31
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/32182 If state of tool, product deviates from standard, adjust system, feedback
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method, apparatus and a system, for performing a process control using analysis of an upstream process is provided. The method comprises performing a first process on a workpiece and performing a qualitative analysis upon the workpiece relating to the first process, the qualitative analysis comprises analyzing at least one metrology measurement relating to the first process and a workpiece feature to evaluate a characteristic of the workpiece. The method further comprises selecting a process control parameter for performing a second process upon the workpiece based upon the qualitative analysis.

Claims

1. A method, comprising:

performing a first process on a workpiece;

performing a qualitative analysis relating to said first process performed on said workpiece, said qualitative analysis comprising analyzing at least one metrology measurement relating to said first process and analyzing a workpiece feature, to evaluate a characteristic of said workpiece; and

selecting a process control parameter for performing a second process on said workpiece based upon said qualitative analysis;

wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups, associating a plurality of recipes respectively to each of said groups, and selecting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece;

wherein selecting one of said plurality of recipes further comprises selecting a recipe that at least partially causes a reduction in copper residue during a copper polishing process.

2. The method of claim 1, wherein performing said first process step upon said workpiece further comprises performing said first process step on a semiconductor wafer.

3. The method of claim 1, further comprising performing said first process based upon said selected process control parameter on at least an additional workpiece.

4. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed upon said workpiece further comprises performing an analysis of said at least one metrology measurement and said workpiece feature using a rule-based algorithm.

5. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed upon said workpiece further comprises performing an analysis of said at least one metrology measurement and said workpiece feature using a decision-based algorithm.

6. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed upon said workpiece further comprises performing said qualitative analysis using a neural network.

7. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed upon said workpiece further comprises performing said qualitative analysis using a fuzzy logic controller.

8. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed upon said workpiece further comprises performing said qualitative analysis using a qualitative transfer function.

9. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed upon said workpiece further comprises analyzing a plurality of metrology measurements from said workpiece.

10. The method of claim 9, wherein analyzing a plurality of metrology measurements from said workpiece further comprises analyzing at least one of a trench depth formed on said workpiece, deposition thickness associated with a deposition layer on said workpiece, a mean thickness associated with a deposition layer on said workpiece, and a center to edge slope of a deposition thickness associated with a deposition layer on said workpiece.

11. The method of claim 1, wherein analyzing said workpiece feature further comprises analyzing a pattern formed in said workpiece.

12. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises adjusting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece.

13. The method of claim 1, wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises performing said qualitative analysis on a wafer-to-wafer basis.

14. The method of claim 1, wherein selecting one of said plurality of recipes further comprises selecting a recipe that results in reduced dishing.

15. The method of claim 1, wherein selecting one of said plurality of recipes further comprises selecting a recipe that results in reduced erosion.

16. The method of claim 1, further comprises performing said second process upon said workpiece based upon said selecting one of said plurality of said recipes.

17. The method of claim 1, wherein performing said first process further comprises performing an etch process.

18. The method of claim 1, wherein performing said first process further comprises performing a deposition process.

19. The method of claim 1, wherein performing said second process further comprises performing a copper polishing process.

20. The method of claim 1, wherein said second process is a downstream process relative to said first process.

21. The method of claim 1, wherein said qualitative analysis comprises analyzing at least one of a non-numeric process parameter and a business rule.

22. The method of claim 1, wherein performing said qualitative analysis further comprises at least one of determining a qualitative description of workpiece quality, determining a description of the spatial uniformity of one or more post-process workpiece characteristics, aggregating a plurality of workpieces into like groups based upon the one or more post-process characteristics, and considering at least one business rule.

23. A method, comprising:

performing a first process on a workpiece;

performing a qualitative analysis relating to said first process performed on said workpiece, said qualitative analysis comprising analyzing at least one metrology measurement relating to said first process and analyzing a workpiece feature to evaluate a characteristic of said workpiece;

associating a process recipe to said characteristic of said workpiece;

using said process recipe to perform a second process on said workpiece; and

selecting a process control parameter for performing said second process on said workpiece based upon said qualitative analysis;

wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups, associating a plurality of recipes respectively to each of said groups, and selecting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece;

wherein selecting one of said plurality of recipes further comprises selecting a recipe that at least partially causes a reduction in copper residue during a copper polishing process.

24. The method of claim 23, further comprising performing said second process based upon said process recipe on at least an additional workpiece.

25. A method, comprising:

performing a first process on a workpiece;

performing a qualitative analysis relating to said first process performed on said workpiece, said qualitative analysis comprising analyzing at least one metrology measurement relating to said first process and analyzing a workpiece feature to evaluate a characteristic of said workpiece;

categorizing said workpiece based upon said characteristic of said workpiece to at least one of a first category and a second category;

selecting a process control parameter for performing a second process on said workpiece based upon said qualitative analysis;

selecting at least one of a first process recipe and a second process recipe respectively corresponding to first and second categories to provide a selected process recipe; and

using said selected process recipe to perform a said second process upon said workpiece,

wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups, associating a plurality of recipes respectively to each of said groups, and selecting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece;

wherein selecting one of said plurality of recipes further comprises selecting a recipe that at least partially causes a reduction in copper residue during a copper polishing process.

26. The method of claim 25, further comprising performing said second process comprised of said selected process control parameter on at least an additional workpiece.

27. An apparatus, comprising:

means for performing a first process on a workpiece;

means for performing a qualitative analysis relating to said first process performed upon said workpiece, said qualitative analysis comprises analyzing at least one metrology measurement relating to said first process and analyzing a workpiece feature to evaluate a characteristic of said workpiece; and

means for selecting a process control parameter for performing a second process upon said workpiece based upon said qualitative analysis

wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups, associating a plurality of recipes respectively to each of said groups, and selecting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece;

wherein selecting one of said plurality of recipes further comprises selecting a recipe that at least partially causes a reduction in copper residue during a copper polishing process.

28. A system, comprising:

a first processing tool to perform a first process upon a workpiece;

a metrology tool to acquire metrology data relating to said first process performed on said workpiece to provide at least one metrology measurement;

a second processing tool to perform a second process upon said workpiece; and

a process controller operatively coupled to said first and second processing tools, said process controller to qualitatively analyze said metrology measurement relating to said first process and analyzing a workpiece feature to evaluate a characteristic of said workpiece, said process controller also to select a process control parameter for performing said second process upon said workpiece based upon said characteristic of said workpiece;

wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups, associating a plurality of recipes respectively to each of said groups, and selecting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece;

wherein selecting one of said plurality of recipes further comprises selecting a recipe that at least partially causes a reduction in copper residue during a copper polishing process.

29. The system of claim 28, wherein said workpiece is a semiconductor wafer.

30. The system of claim 28, wherein said process controller being further operable to categorize said characteristic of said workpiece into a first category and correlate said first category to a first recipe for controlling said second process.

31. The system of claim 28, wherein said process controller further comprising a upstream-downstream feed-forward unit to perform a qualitative analysis of said first process based upon said metrology measurement and said workpiece feature to evaluate said characteristic of said workpiece.

32. The system of claim 31, wherein said upstream-downstream feed-forward unit further comprises a fuzzy logic controller to perform said qualitative analysis of said first process.

33. The system of claim 31, wherein said upstream-downstream feed-forward unit further comprises a qualitative transfer function controller to perform said qualitative analysis of said first process.

34. The system of claim 31, wherein said upstream-downstream feed-forward unit further comprises a neural network controller to perform said qualitative analysis of said first process.

35. The system of claim 28, further comprising a database unit to store said at least one of metrology data, said data relating to said characteristic of said workpiece.

36. The system of claim 28, wherein said first processing tool is an upstream processing tool and said second processing tool is a downstream processing tool relative to said upstream processing tool.

37. A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising:

performing a first process on a workpiece;

performing a qualitative analysis upon said workpiece relating to said first process, said qualitative analysis comprises analyzing at least one metrology measurement relating to said first process and analyzing a workpiece feature to evaluate a characteristic of said workpiece; and

selecting a process control parameter for performing a second process upon said workpiece based upon said qualitative analysis;

wherein performing said qualitative analysis relating to said first process performed on said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups, associating a plurality of recipes respectively to each of said groups, and selecting one of said plurality of recipes based upon said categorizing of said characteristic of said workpiece;

wherein selecting one of said plurality of recipes further comprises selecting a recipe that at least partially causes a reduction in copper residue during a copper polishing process.

38. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, wherein performing said qualitative analysis upon said workpiece further comprises performing an analysis of said at least one metrology measurement and said workpiece feature using a rule-based algorithm.

39. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, wherein performing said qualitative analysis upon said workpiece further comprises performing an analysis of said at least one metrology measurement and said workpiece feature using a decision-based algorithm.

40. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, wherein performing said qualitative analysis upon said workpiece further comprises performing said qualitative analysis using a qualitative transfer function.

41. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, wherein performing said qualitative analysis upon said workpiece further comprises analyzing a plurality of metrology measurements from said workpiece.

42. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 41, wherein analyzing a plurality of metrology measurements from said workpiece further comprises analyzing at least one of a trench depth formed on said workpiece, deposition thickness associated with a deposition layer on said workpiece, a mean thickness associated with a deposition layer on said workpiece, and a center to edge slope of a deposition thickness associated with a deposition layer on said workpiece.

43. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, analyzing said workpiece feature further comprises analyzing a pattern formed in said workpiece.

44. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, wherein performing said qualitative analysis upon said workpiece further comprises categorizing a characteristic of said workpiece into one of a plurality of groups.

45. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 44, wherein performing said qualitative analysis upon said workpiece further comprises associating a plurality of recipes respectively to each of said groups.

46. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 45, wherein performing said qualitative analysis upon said workpiece further comprises selecting one of said plurality of recipes based upon said categorizing said characteristic of said workpiece.

47. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 37, wherein performing said qualitative analysis further comprises at least one of determining a qualitative description of workpiece quality, determining a description of the spatial uniformity of one or more post-process workpiece characteristics, aggregating a plurality of workpieces into like groups based upon the one or more post-process characteristics, and considering at least one business rule.