Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods

• US 8,616,451 B1
• Filed: 06/21/2012
• Issued: 12/31/2013
• Est. Priority Date: 06/21/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: AuthenTec Incorporated (Apple Inc.)
• Inventors: Rao, Yang
• Primary Examiner(s): Labaze, Edwyn
• Application Number:
  US13/529,170
• Publication Number:
  US 20130341398A1
• Time in Patent Office: 558 Days
• Field of Search: 235/439, 235/375, 235/476
• US Class Current: 235/439
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

A finger sensing device may include a mounting substrate having a recess in a top surface thereof and having conductive through-vias extending from the top surface to a bottom surface. The conductive through-vias may extend laterally adjacent to the recess. The finger sensing device may also include a finger sensing integrated circuit (IC) die within the recess and may include a finger sensing area on a top surface thereof and bond pads on the top surface laterally adjacent the finger sensing area. The finger sensing device may also include a dielectric layer over the mounting substrate and the finger sensing IC die. The finger sensing device may further include a conductive pattern carried by the dielectric layer and coupling the conductive through-vias to respective ones of the bond pads.

Claims

1. A finger sensing device comprising:

a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess;

a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area;

a dielectric layer over said mounting substrate and said finger sensing IC die; and

a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads.

2. The finger sensing device according to claim 1, wherein said mounting substrate and said finger sensing IC die have flush top surfaces.

3. The finger sensing device according to claim 1, wherein each of said plurality of conductive through-vias comprises an upper tapered portion, a lower vertical portion, and an intermediate landing pad therebetween.

4. The finger sensing device according to claim 1, further comprising a respective conductive via coupling each of said plurality of bond pads and an adjacent portion of said conductive pattern.

5. The finger sensing device according to claim 1, wherein said conductive pattern defines a finger drive electrode.

6. The finger sensing device according to claim 1, further comprising a plurality of conductors coupled to respective ones of said plurality of conductive through-vias on the bottom surface of said mounting substrate and defining a grid array pattern.

7. The finger sensing device according to claim 1, further comprising a further dielectric layer over said conductive pattern and said dielectric layer.

8. The finger sensing device according to claim 1, wherein said dielectric layer has a thickness less than or equal to 25 microns.

9. The finger sensing device according to claim 1, wherein said plurality of conductive through-vias and said conductive pattern comprise copper.

10. A finger sensing device comprising:

a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess;

a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area, the top surface being flush with the top surface of said mounting substrate;

a dielectric layer over said mounting substrate and said finger sensing IC die;

a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads; and

a respective conductive via coupling each of said plurality of bond pads and an adjacent portion of said conductive pattern.

11. The finger sensing device according to claim 10, wherein each of said plurality of conductive through-vias comprises an upper tapered portion, a lower vertical portion, and an intermediate landing pad therebetween.

12. The finger sensing device according to claim 10, wherein said conductive pattern defines a finger drive electrode.

13. The finger sensing device according to claim 10, further comprising a plurality of conductors coupled to respective ones of said plurality of conductive through-vias on the bottom of said mounting substrate and defining a grid array pattern.

14. The finger sensing device according to claim 10, further comprising a further dielectric layer over said conductive pattern and said dielectric layer.

15. A method of making a finger sensing device comprising:

forming a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, the conductive through-vias being laterally adjacent to the recess;

positioning a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent the finger sensing area;

positioning a dielectric layer over the mounting substrate and the finger sensing IC die, the dielectric layer carrying a conductive pattern; and

coupling a conductive pattern to the plurality of conductive through-vias and to respective ones of the plurality of bond pads.

16. The method according to claim 15, wherein the finger sensing IC die is positioned to have the top surface flush with the top surface of the mounting substrate.

17. The method according to claim 15, wherein each of the plurality of conductive through-vias comprises an upper tapered portion, a lower vertical portion, and an intermediate landing pad therebetween.

18. The method according to claim 15, further comprising forming a respective conductive via to couple each of the plurality of bond pads and an adjacent portion of the conductive pattern.

19. The method according to claim 15, wherein the conductive pattern defines a finger drive electrode.

20. The method according to claim 15, further comprising coupling a plurality of conductors to respective ones of the plurality of conductive through-vias on the bottom surface of the mounting substrate and defining a grid array pattern.

21. The method according to claim 15, further comprising forming a further dielectric layer over the conductive pattern and the dielectric layer.

22. The method according to claim 15, wherein the plurality of through-vias are formed in the mounting substrate by laser drilling.

23. The method according to claim 15, wherein forming the conductive pattern comprises forming the conductive pattern layer by electroplating.

24. The method according to claim 15, wherein the plurality of the conductive through-vias are electroplated.