Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods
First Claim
1. A finger sensing device comprising:
- a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess;
a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area;
a dielectric layer over said mounting substrate and said finger sensing IC die; and
a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads.
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Accused Products
Abstract
A finger sensing device may include a mounting substrate having a recess in a top surface thereof and having conductive through-vias extending from the top surface to a bottom surface. The conductive through-vias may extend laterally adjacent to the recess. The finger sensing device may also include a finger sensing integrated circuit (IC) die within the recess and may include a finger sensing area on a top surface thereof and bond pads on the top surface laterally adjacent the finger sensing area. The finger sensing device may also include a dielectric layer over the mounting substrate and the finger sensing IC die. The finger sensing device may further include a conductive pattern carried by the dielectric layer and coupling the conductive through-vias to respective ones of the bond pads.
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Citations
24 Claims
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1. A finger sensing device comprising:
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a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess; a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area; a dielectric layer over said mounting substrate and said finger sensing IC die; and a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A finger sensing device comprising:
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a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess; a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area, the top surface being flush with the top surface of said mounting substrate; a dielectric layer over said mounting substrate and said finger sensing IC die; a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads; and a respective conductive via coupling each of said plurality of bond pads and an adjacent portion of said conductive pattern. - View Dependent Claims (11, 12, 13, 14)
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15. A method of making a finger sensing device comprising:
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forming a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, the conductive through-vias being laterally adjacent to the recess; positioning a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent the finger sensing area; positioning a dielectric layer over the mounting substrate and the finger sensing IC die, the dielectric layer carrying a conductive pattern; and coupling a conductive pattern to the plurality of conductive through-vias and to respective ones of the plurality of bond pads. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification