Vacuum processing chambers incorporating a moveable flow equalizer

• US 8,617,347 B2
• Filed: 08/06/2009
• Issued: 12/31/2013
• Est. Priority Date: 08/06/2009
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Kim, Jisoo, Lill, Thorsten B.
• Primary Examiner(s): Zervigon, Rudy
• Application Number:
  US12/537,179
• Publication Number:
  US 20110031214A1
• Time in Patent Office: 1,608 Days
• Field of Search: 118/715, 118/719, 118/729, 156/345.26, 156/345.31, 156/345.33, 156/345.34, 156/345.54
• US Class Current: 156/345.26
• CPC Class Codes: C23C 16/4412 Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
• CPC Class Codes: H01J 2237/182 Obtaining or maintaining desired pressure
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01J 37/185 Means for transferring objects between different enclosures of different pressure or atmosphere
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support

Abstract

A method and apparatus for vacuum processing of a workpiece, the apparatus including a flow equalizer disposed in a vacuum processing chamber between a workpiece support pedestal and a pump port located in a wall of the vacuum processing chamber. In an embodiment, the flow equalizer has a first annular surface concentric about the workpiece support pedestal to provide conductance symmetry about the workpiece support even when the pump port is asymmetrically positioned within the vacuum processing chamber. In an embodiment, the flow equalizer has a second annular surface facing a lower surface of the workpiece support pedestal to restrict conductance as the flow equalizer is moved is response to a chamber pressure control signal. In an embodiment, the apparatus for vacuum processing of a workpiece includes tandem vacuum processing chambers sharing a vacuum pump with each tandem chamber including a flow equalizer to reduce cross-talk between the tandem chambers.

Claims

1. A vacuum processing apparatus comprising:

a workpiece support disposed along a longitudinal axis of a first vacuum processing chamber, the workpiece support having a top surface spanning a first radial distance from the longitudinal axis to hold the workpiece, and a lower surface opposite the top surface;

a pump port disposed in a wall of the first vacuum processing chamber below the lower surface of the workpiece support to couple the first vacuum processing chamber to a vacuum pump; and

a flow equalizer disposed in the first vacuum processing chamber between the lower surface of the workpiece support and the pump port, the flow equalizer movable, independent from the workpiece support, in response to a workpiece pressure control signal to variably restrict gas conductance downstream of the top surface of the workpiece support and upstream of the pump port, wherein the flow equalizer further comprises;

an annular top surface spanning a second radial distance from the longitudinal axis wherein at least a portion of the annular top surface underlying the workpiece support and spaced apart from the workpiece support lower surface by a first gap in a direction parallel to said longitudinal axis, said first gap extending over a radial distance where the first and second radial distances overlap, the first gap modulated by the movement of the flow equalizer along the longitudinal chamber axis; and

a side surface concentrically surrounding a stem of the workpiece support along the longitudinal chamber axis, the stem extending a third radial distance from the longitudinal axis that is less than the first radial distance, and the side surface disposed a radial distance from the stem to form a radial gap between the workpiece support and the flow equalizer which is smaller than a radial distance between the longitudinal chamber axis and the pump port, wherein the radial gap is fluidly coupled to the first gap to conduct gas from the first gap toward the pump port.

2. The vacuum processing apparatus as in claim 1, wherein the radial gap is to remain constant during the movement of the flow equalizer along the longitudinal chamber axis.

3. The vacuum processing apparatus as in claim 1, wherein the pump port is disposed in a sidewall of the first vacuum processing chamber with the radial distance between the longitudinal chamber axis and the pump port equal to approximately ½

an inner diameter of the first vacuum processing chamber.

4. The vacuum processing apparatus as in claim 1, further comprising a gate valve disposed between the pump port and the vacuum pump, the gate valve moveable in response to a vacuum pump side pressure control signal derived from a pressure measured downstream of the flow equalizer.

5. The vacuum processing apparatus as in claim 1, further comprising:

a second vacuum processing chamber configured in tandem with the first vacuum processing chamber, the second vacuum processing chamber coupled to the vacuum pump through a second pump port, wherein the second pump port is disposed in a sidewall of the second vacuum processing chamber with the radial distance between a longitudinal axis of the second chamber and the second pump port equal to approximately ½

an inner diameter of the second vacuum processing chamber.

6. The vacuum processing apparatus as in claim 5, wherein the second vacuum processing chamber further comprises:

a second flow equalizer disposed in the second vacuum processing chamber, the second flow equalizer movable in response to a second chamber pressure control signal to variably restrict gas conductance independently of the first flow equalizer.

7. The vacuum processing apparatus as in claim 1, further comprising a manometer on a gas source side of the top surface of the workpiece support to output a signal from which the workpiece pressure control signal is derived.

8. The vacuum processing apparatus as in claim 1, wherein the flow equalizer comprises a dielectric material selected from the group consisting of:

quartz, alumina and yttrium.

9. The vacuum processing apparatus as in claim 1, wherein the workpiece support is moveable, independent from the flow equalizer, along the longitudinal chamber axis.

10. A vacuum processing system, comprising:

a first vacuum processing chamber including a first workpiece support disposed therein, the first workpiece support having a top surface spanning a first radial distance from a longitudinal axis of the first chamber, and a lower surface opposite the top surface;

a second vacuum processing chamber including a second workpiece support disposed therein and having a top surface spanning a first radial distance from a longitudinal axis of the second chamber, and a lower surface opposite the top surface, wherein the second vacuum processing chamber is positioned adjacent to the first vacuum processing chamber and isolated from the first vacuum processing chamber by a shared interior chamber wall, and wherein a pump port shared by the first and second vacuum processing chambers is disposed in the shared interior chamber wall, to couple the first and second vacuum processing chambers to a shared vacuum pump;

a first movable flow equalizer disposed in the first vacuum processing chamber between the first workpiece support and the shared pump port; and

a second movable flow equalizer disposed in the second vacuum processing chamber between the second workpiece support and the shared pump port, wherein each of the first and second flow equalizers further comprise;

an annular top surface spanning a second radial distance from the longitudinal axis of the respective chamber wherein at least a portion of the annular top surface underlying the workpiece support and spaced apart from the workpiece support lower surface by a first gap in a direction parallel to said longitudinal axis, said first gap extending over a radial distance where the first and second radial distances overlap, the first gap modulated by the movement of the flow equalizer along the longitudinal chamber axis; and

a side surface concentrically surrounding a stem of the workpiece support along the longitudinal axis of the respective chamber, the stem extending a third radial distance that is less than the first radial distance, and the side surface disposed a radial distance from the stem to form a radial gap between the workpiece support and the flow equalizer which is smaller than a radial distance between the longitudinal axis of the respective chamber and the pump port, wherein the radial gap is fluidly coupled to the first gap to conduct gas from the first gap toward the pump port.

11. The vacuum processing system as in claim 10, wherein the first and second flow equalizers are movable independent from each other in response to a chamber-specific pressure control signal to variably restrict gas conductance downstream of the workpiece support and upstream of the shared pump port.

12. The vacuum processing apparatus as in claim 10, further comprising a gate valve disposed between the shared pump port and the shared vacuum pump, the gate valve moveable in response to a vacuum pump side pressure control signal derived from a pressure measured downstream of the flow equalizer.