Consumable adhesive layer for thin film photovoltaic material
First Claim
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1. A method for forming a thin film photovoltaic device, the method comprising:
- providing a substrate at a first station, the substrate comprising a surface region;
forming a first electrode layer on the surface region;
moving the substrate to a second station;
forming an adhesive layer over the first electrode layer at the second station;
forming a copper layer overlying the adhesive layer;
forming an indium layer over the copper layer to form a multilayered structure, the multilayered structure comprising the adhesive layer, the copper layer and the indium layer;
exposing the multilayered structure to an environment comprising sulfur bearing species;
forming a copper indium disulphide alloy material;
forming a cap layer comprising copper sulphide material overlying the copper indium disulphide alloy material;
removing a portion of the cap layer; and
forming a window layer overlying at least a portion of the copper indium disulphide alloy material.
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Abstract
A method for forming a thin film photovoltaic device may include providing a transparent substrate and forming a multi layered structure including at least a thin layer of indium material, copper material, and another layer of indium. A heat treatment may be performed that consumes substantially all of the thin layer of indium material into a portion of a copper indium disulfide alloy material. The method causes formation of a copper sulfide material overlying the copper indium disulfide alloy material during at least the thermal treatment process.
269 Citations
20 Claims
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1. A method for forming a thin film photovoltaic device, the method comprising:
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providing a substrate at a first station, the substrate comprising a surface region; forming a first electrode layer on the surface region; moving the substrate to a second station; forming an adhesive layer over the first electrode layer at the second station; forming a copper layer overlying the adhesive layer; forming an indium layer over the copper layer to form a multilayered structure, the multilayered structure comprising the adhesive layer, the copper layer and the indium layer; exposing the multilayered structure to an environment comprising sulfur bearing species; forming a copper indium disulphide alloy material; forming a cap layer comprising copper sulphide material overlying the copper indium disulphide alloy material; removing a portion of the cap layer; and forming a window layer overlying at least a portion of the copper indium disulphide alloy material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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providing a substrate at a first station, the substrate comprising a surface region; forming a first electrode layer on the surface region; moving the substrate to a second station; forming a first indium layer over the first electrode layer at the second station; forming a copper layer overlying the adhesive layer; forming a second indium layer over the copper layer to form a multilayered structure, the multilayered structure comprising the first indium layer, the copper layer and the second indium layer; exposing the multilayered structure to an environment comprising sulfur bearing species; consuming the first indium layer; forming a copper indium disulphide alloy material; forming a cap layer overlying the copper indium disulphide alloy material; removing a portion of the cap layer; and forming a window layer overlying at least a portion of the copper indium disulphide alloy material. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification