Back-illuminated CMOS image sensors

• US 8,618,458 B2
• Filed: 11/07/2008
• Issued: 12/31/2013
• Est. Priority Date: 11/07/2008
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: McCarten, John P., Summa, Joseph R., Tivarus, Cristian A., Anderson, Todd J., Stevens, Eric G.
• Primary Examiner(s): Sohn, Seung C
• Assistant Examiner(s): Wyatt, Kevin
• Application Number:
  US12/266,764
• Publication Number:
  US 20100116971A1
• Time in Patent Office: 1,880 Days
• Field of Search: 250/208.1, 257/128, 257/460, 257/228, 257/447, 438/22, 438/48, 438/142
• US Class Current: 250/208.1
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/1463 Pixel isolation structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14689 MOS based technologies

Abstract

A back-illuminated image sensor includes a sensor layer disposed between an insulating layer and a circuit layer electrically connected to the sensor layer. An imaging area includes a plurality of photodetectors is formed in the sensor layer and a well that spans the imaging area. The well can be disposed between the backside of the sensor layer and the photodetectors, or the well can be a buried well formed adjacent to the backside of the sensor layer with a region including formed between the photodetectors and the buried well. One or more side wells can be formed laterally adjacent to each photodetector. The dopant in the well has a segregation coefficient that causes the dopant to accumulate on the sensor layer side of an interface between the sensor layer and the insulating layer.

Claims

1. A method for fabricating a back-illuminated image sensor that includes a sensor layer disposed between an insulating layer and a circuit layer electrically connected to the sensor layer, wherein a frontside of the sensor layer is adjacent to the circuit layer and a backside of the sensor layer is adjacent to the insulating layer, the back-illuminated image sensor further including an imaging area comprising a plurality of photodetectors disposed in the frontside of the sensor layer, the method comprising:

forming at least one shallow trench isolation (STI) region in the sensor layer, including thermal oxidation of the at least one STI region;

forming an implanted sensor layer by implanting the sensor layer with an n-type dopant from the frontside and through the sensor layer to form an n-type well in the sensor layer adjacent to the backside of the sensor layer, wherein implanting the sensor layer with the n-type dopant occurs after the thermal oxidation of the at least one STI region to reduce thermal diffusion of dopants in the n-type well; and

doping the implanted sensor layer with a p-type dopant to form the plurality of photodetectors doped with the p-type dopant in the frontside of the sensor layer.

2. The method of claim 1, wherein implanting the sensor layer with the n-type dopant to form the n-type well comprises implanting the sensor layer with an n-type dopant to form the n-type well in at least a portion of the sensor layer adjacent to the backside of the sensor layer.

3. The method of claim 2, wherein implanting the sensor layer with the n-type dopant to form the n-type well comprises chain implanting the sensor layer with the n-type dopant more than once to form a buried well in a portion of the sensor layer adjacent to the backside of the sensor layer.

4. The method of claim 3, further comprising the step of doping the sensor layer with an n-type dopant to form a first side well laterally adjacent to and on one side of each photodetector and a second side well laterally adjacent to and on the opposing side of each photodetector.

5. The method of claim 4, wherein the buried well and first and second side wells are formed such that a region doped with a p-type dopant is disposed between the buried well, each photodetector and the respective first and second side wells.

6. The method of claim 1, wherein forming the implanted sensor layer includes implanting the sensor layer with the n-type dopant such that the n-type well extends from the backside of the sensor layer to the frontside of the sensor layer, wherein the backside of the sensor layer forms an interface with the insulating layer.