FinFET design and method of fabricating same
First Claim
1. A device comprising:
- a semiconductor substrate;
a first fin structure comprising silicon or SiGe disposed over a layer of III-V semiconductor material having a high band gap energy and a lattice constant greater than that of Ge;
a second fin structure comprising silicon or SiGe disposed over a layer of III-V semiconductor material, SiGe, or SiC having a high band gap energy and a lattice constant equal to or smaller than that of Ge; and
a gate disposed over and arranged perpendicular to the first and second fin structures.
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Accused Products
Abstract
An integrated circuit device and method for manufacturing the same are disclosed. An exemplary device includes a semiconductor substrate having a substrate surface and a trench isolation structure disposed in the semiconductor substrate for isolating an NMOS region of the device and from a PMOS region of the device. The device further includes a first fin structure comprising silicon or SiGe disposed over a layer of III-V semiconductor material having a high band gap energy and a lattice constant greater than that of Ge; a second fin structure comprising silicon or SiGe disposed over a layer of III-V semiconductor material having a high band gap energy and a lattice constant smaller than that of Ge; and a gate structure disposed over and arranged perpendicular to the first and second fin structures.
183 Citations
18 Claims
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1. A device comprising:
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a semiconductor substrate; a first fin structure comprising silicon or SiGe disposed over a layer of III-V semiconductor material having a high band gap energy and a lattice constant greater than that of Ge; a second fin structure comprising silicon or SiGe disposed over a layer of III-V semiconductor material, SiGe, or SiC having a high band gap energy and a lattice constant equal to or smaller than that of Ge; and a gate disposed over and arranged perpendicular to the first and second fin structures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A device comprising:
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a semiconductor substrate having a substrate surface; a trench isolation structure disposed in the semiconductor substrate for isolating an NMOS region of the device and from a PMOS region of the device; a first fin structure disposed in the NMOS region and comprising silicon or SiGe disposed over a layer of III-V semiconductor material having a high band gap energy and a lattice constant greater than that of Ge; a second fin structure disposed in the PMOS region and comprising silicon or SiGe disposed over a layer of III-V semiconductor material, SiGe, or SiC having a high band gap energy and a lattice constant equal to or smaller than that of Ge; and a gate structure disposed over and arranged perpendicular to the first and second fin structures. - View Dependent Claims (10, 11, 12)
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13. A device comprising:
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a silicon substrate including an NMOS region and a PMOS region; a first fin structure in the NMOS region and comprising a first layer of silicon extending from the silicon substrate, a second layer of III-V semiconductor material having a high band gap energy and a lattice constant greater than that of Ge, and a third layer of semiconductor material; a second fin structure in the PMOS region and comprising a first layer of silicon extending from the silicon substrate, a second layer of semiconductor material having a high band gap energy and a lattice constant less than that of Ge, and a third layer of semiconductor material; and a gate disposed over and arranged perpendicular to the first and second fin structures. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification