Integrated circuit including a buried wiring line
First Claim
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1. An integrated circuit comprising:
- a field effect transistor including a first active area and a gate electrode buried below a main surface of a semiconductor substrate;
a gate wiring line buried below the main surface, wherein a section of the gate wiring line forms the gate electrode;
a buried contact element in direct contact with the gate wiring line, wherein a top of the buried contact element is substantially flush with or recessed below the main surface; and
a second active area formed in the semiconductor substrate adjacent to and in direct contact with the buried contact element;
wherein the gate electrode is buried between a first and a second source/drain region of the field effect transistor that are formed within the first active area and adjacent to the main surface;
wherein the second active area comprises a further first and a further second source/drain region of a second field effect transistor; and
wherein the buried contact element is formed adjacent to and in direct contact with one of the further first or second source/drain regions.
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Abstract
Integrated circuits including a buried wiring lien. One embodiment provides a field effect transistor including a first active area and a gate electrode buried below a main surface of a semiconductor substrate. A gate wiring line may be buried below the main surface and a section of the gate wiring line may form the gate electrode. Above the gate wiring line, a buried contact structure is formed that is adjacent to and in direct contact with the first or a second active area.
6 Citations
21 Claims
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1. An integrated circuit comprising:
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a field effect transistor including a first active area and a gate electrode buried below a main surface of a semiconductor substrate; a gate wiring line buried below the main surface, wherein a section of the gate wiring line forms the gate electrode; a buried contact element in direct contact with the gate wiring line, wherein a top of the buried contact element is substantially flush with or recessed below the main surface; and a second active area formed in the semiconductor substrate adjacent to and in direct contact with the buried contact element; wherein the gate electrode is buried between a first and a second source/drain region of the field effect transistor that are formed within the first active area and adjacent to the main surface; wherein the second active area comprises a further first and a further second source/drain region of a second field effect transistor; and wherein the buried contact element is formed adjacent to and in direct contact with one of the further first or second source/drain regions. - View Dependent Claims (2, 3, 4)
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5. An integrated circuit comprising:
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a plurality of field effect transistors, each of them including a gate electrode buried below a main surface of a semiconductor substrate; an address line including and connecting the gate electrodes and completely buried below the main surface; a buried contact element adjacent to and in direct contact with the address line and buried below the main surface; and a driver circuit configured to drive the address line and comprising a combined active area that is adjacent to and in direct contact with the buried contact element. - View Dependent Claims (6, 7, 8, 9)
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10. An integrated circuit comprising an inverter circuit comprising:
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an n-FET; a p-FET, wherein a first source/drain region of the p-FET is in low resistance contact with a second source/drain region of the n-FET and wherein the first source/drain region of the p-FET and the second source/drain region of the n-FET adjoin to a main surface of a semiconductor substrate; and a buried contact element formed in a groove and buried below the main surface, the buried contact element being arranged between and being in direct contact with the first source/drain region of the p-FET and the second source/drain region of the n-FET, wherein a lower edge of the groove has a greater distance to the main surface than a lower edge of the first source/drain region of the p-FET and the second source/drain region of the n-FET. - View Dependent Claims (11, 12, 13)
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14. An integrated circuit comprising a ring oscillator circuit including a plurality of inverter circuits, wherein individual ones of the inverter circuits comprise:
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a buried contact element, at least a section of which is formed below a main surface of a semiconductor substrate and adjoins a first source/drain region of a p-FET that includes a first gate electrode and a second source/drain region of an n-FET that includes a second gate electrode, the first and the second source/drain regions formed below and directly adjacent to the main surface; and a buried output line, at least a section of which is buried below and in direct contact with the buried contact element, wherein the buried output lines of individual ones of the inverter circuits are connected with the first and second gate electrodes of one of the other inverter circuits. - View Dependent Claims (15, 16, 17)
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18. An integrated circuit comprising:
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a field effect transistor including a first active area of a plurality of active areas formed in a semiconductor substrate, the field effect transistor comprising a first and a second source/drain region, wherein the first and the second source/drain regions directly adjoin to a main surface of the semiconductor substrate, and a gate electrode that is buried below the main surface and between the first and the second source/drain regions; and a conductive buried contact element in contact with the gate electrode and adjoining at least one of the plurality of active areas, wherein the distance between the buried contact element and one of the source and drain regions is not greater than two times the distance between the source region and the drain region. - View Dependent Claims (19, 20, 21)
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Specification