Top port with interposer MEMS microphone package and method

• US 8,618,619 B1
• Filed: 01/28/2011
• Issued: 12/31/2013
• Est. Priority Date: 01/28/2011
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Miks, Jeffrey Alan, Troche, Louis B. Jr.
• Primary Examiner(s): Luke, Daniel
• Assistant Examiner(s): Ahmad, Khaja
• Application Number:
  US13/016,343
• Time in Patent Office: 1,068 Days
• Field of Search: 381/361, 381/355, 257414-417, 257/E21.5, 257/E21.499, 438/48, 438/51
• US Class Current: 257/414
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A top port MEMS package includes a substrate and an interposer mounted to the substrate. The interposer includes an interposer aperture and an interposer channel fluidly coupled to the interposer aperture. A MEMS electronic component is mounted to the interposer above the interposer aperture. A top port lid includes a top port and a chimney structure fluidly coupling to the top port to the interposer channel. A front volume including the top port, the flue, the interposer channel, and the interposer aperture is acoustically sealed from a relatively large back volume defined by a lid cavity of the top port lid. By acoustically sealing the front volume from the back volume and further by maximizing the back volume, the noise to signal ratio is minimized thus maximizing the sensitivity of top port MEMS microphone package as well as the range of applications.

Claims

1. A top port Micro Electro Mechanical Systems (MEMS) package comprising:

a substrate comprising a first planar surface;

an interposer coupled to the substrate, the interposer comprising;

an interposer aperture defined by a cylindrical interposer aperture sidewall; and

an interposer channel fluidly coupled to the interposer aperture, the interposer aperture and the interposer channel being sealed by the first planar surface of the substrate, the interposer channel comprising an outlet port within the cylindrical interposer aperture sidewall;

a MEMS electronic component coupled to the interposer, the MEMS electronic component comprising an aperture fluidly coupled to the interposer aperture; and

a top port lid comprising a top port fluidly coupled to the interposer channel, the top port lid comprising a lid sidewall base attached to the first planar surface of the substrate.

2. The top port MEMS package of claim 1 wherein the interposer comprises a first surface and a second surface, the second surface being coupled to the substrate, the interposer aperture extending through the interposer between the first surface of the interposer and the second surface of the interposer.

3. The top port MEMS package of claim 2 wherein the interposer channel is formed in the second surface of the interposer and extends between the interposer aperture and a first side of the interposer.

4. The top port MEMS package of claim 3 wherein the interposer channel is defined by an interposer channel top and interposer channel sidewalls, the interposer channel top being between the first surface of the interposer and the second surface of the interposer, the interposer channel sidewalls extending between the second surface of the interposer and the interposer channel top.

10. The top port MEMS package of claim 1 wherein the top port lid comprises a chimney structure fluidly coupling the top port to the interposer channel.

11. The top port MEMS package of claim 10 wherein the chimney structure comprises a flue.

12. The top port MEMS package of claim 11 wherein the flue is cylindrical.

13. The top port MEMS package of claim 10 wherein the chimney structure comprises:

substrate sealing surfaces coupled to the substrate;

interposer side sealing surfaces coupled to a side of the interposer; and

an interposer upper surface sealing surface coupled to a first surface of the interposer.

14. The top port MEMS package of claim 13 wherein an inlet port of the interposer channel is located between a first interposer side sealing surface and a second interposer side sealing surface of the interposer side sealing surfaces.

15. The top port MEMS package of claim 1 wherein the interposer comprises a converter electronic component comprising a bond pad on a first surface thereof.

5. A top port Micro Electro Mechanical Systems (MEMS) package comprising:

a substrate comprising a first planar surface;

an interposer coupled to the substrate, the interposer comprising;

a first surface;

a second surface;

an interposer channel standoff formed on the second surface of the interposer, the second surface being coupled to the first planar surface of the substrate by the interposer channel standoff;

an interposer aperture extending through the interposer between the first surface of the interposer and the second surface of the interposer; and

an interposer channel fluidly coupled to the interposer aperture, the second surface of the interposer and the interposer channel standoff defining the interposer channel, the interposer aperture and the interposer channel being sealed by the first planar surface of the substrate;

a MEMS electronic component coupled to the interposer, the MEMS electronic component comprising an aperture fluidly coupled to the interposer aperture; and

a top port lid comprising a top port fluidly coupled to the interposer channel, the top port lid comprising a lid sidewall base attached to the first planar surface of the substrate.

6. The top port MEMS package of claim 5 wherein the interposer channel standoff comprises:

a first linear segment; and

a second linear segment parallel to the first linear segment, the first linear segment and the second linear segment extending from a first side to be adjacent to the interposer aperture.

7. The top port MEMS package of claim 6 wherein the interposer channel standoff further comprises:

a curved segment extending between the first segment and the second segment around the interposer aperture on the second surface of the interposer.

8. A top port Micro Electro Mechanical Systems (MEMS) package comprising:

a substrate comprising a first planar surface;

an interposer coupled to the substrate, the interposer comprising;

a first surface;

a second surface coupled to the substrate;

an interposer aperture extending through the interposer between the first surface of the interposer and the second surface of the interposer; and

an interposer channel fluidly coupled to the interposer aperture, wherein the interposer channel comprises an interposer slot defined by interposer slot sidewalls extending through the interposer between the first surface of the interposer and the second surface of the interposer, the interposer aperture and the interposer channel being sealed by the first planar surface of the substrate;

a MEMS electronic component coupled to the interposer, the MEMS electronic component comprising an aperture fluidly coupled to the interposer aperture; and

a top port lid comprising a top port fluidly coupled to the interposer channel, the top port lid comprising a lid sidewall base attached to the first planar surface of the substrate.

9. The top port MEMS package of claim 8 further comprising an interposer slot adhesive sealing the interposer slot at the first surface of the interposer.

16. A top port Micro Electro Mechanical Systems (MEMS) package comprising:

a converter electronic component comprising a first surface;

an interposer comprising a first surface and a second surface opposite the first surface of the interposer, the second surface of the interposer being coupled to the first surface of the converter electronic component, the interposer comprising;

an interposer aperture; and

an interposer channel fluidly coupled to the interposer aperture, the interposer aperture and the interposer channel being sealed by the first surface of the converter electronic component;

a MEMS electronic component coupled to the first surface of the interposer above the interposer aperture;

a top port lid comprising;

a top port; and

a chimney structure comprising a flue fluidly coupled to the top port, an outlet port of the flue being fluidly coupled to an inlet port of the interposer channel.

17. The top port MEMS package of claim 16 wherein the MEMS electronic component comprises a moveable diaphragm.

18. The top port MEMS package of claim 17 further comprising:

a front volume comprising an ambient environment, the flue, the interposer channel, the interposer aperture, an aperture of the MEMS electronic component, and the diaphragm; and

a back volume acoustically sealed from the front volume, the diaphragm separating the front volume from the back volume.

19. A method comprising:

forming an interposer aperture defined by a cylindrical interposer aperture sidewall and an interposer channel in an interposer, the interposer channel comprising an outlet port within the cylindrical interposer aperture sidewall;

coupling the interposer to a substrate comprising sealing the interposer aperture and the interposer channel by a first planar surface of the substrate;

coupling a Micro Electro Mechanical Systems (MEMS) electronic component to the interposer above the interposer aperture; and

attaching a lid sidewall base of a top port lid to the first planar surface of the substrate such that a top port of the top port lid is fluidly coupled to an inlet port of interposer channel.

20. The method of claim 19 wherein sound travels through the top port, through a flue of the top port lid, through the interposer channel, and through the interposer aperture to the MEMS electronic component.