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Methods and apparatus of stacking DRAMs

  • US 8,619,452 B2
  • Filed: 09/01/2006
  • Issued: 12/31/2013
  • Est. Priority Date: 09/02/2005
  • Status: Active Grant
First Claim
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1. A memory device comprising:

  • a plurality of dynamic random access memory (“

    DRAM”

    ) integrated circuits stacked in a vertical direction; and

    a buffer integrated circuit for providing an interface between the plurality of DRAM integrated circuits and a memory bus by buffering at least one of address, control or data signals so as to isolate electrical loads of the plurality of DRAM integrated circuits from the memory bus, wherein the buffer integrated circuit is configured to perform conversion between signal timing of a first protocol at the memory bus and signal timing of a second protocol for accessing at least one of the plurality of DRAM integrated circuits,wherein the buffer integrated circuit is configured to track addresses of “

    m”

    previous reads and compare an address of a current read with the tracked addresses of the “

    m”

    previous reads.

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