Method of manufacturing an inductor for a microelectronic device

• US 8,621,744 B2
• Filed: 08/23/2011
• Issued: 01/07/2014
• Est. Priority Date: 06/11/2008
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Aleksov, Aleksandar, Camacho-Bragado, Gloria Alejandra
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US13/215,458
• Publication Number:
  US 20110302771A1
• Time in Patent Office: 868 Days
• Field of Search: 296/021, 29605-607, 298/29, 298/32, 205/119, 205/122, 216/62, 216/65, 216/66, 336/178, 336/200, 336/212, 336/221, 336/223, 336/225, 336/229, 336/232, 336/233
• US Class Current: 29/605
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 41/16 the magnetic material being applied in the form of particles, e.g. by serigraphy , to form thick magnetic films or precursors therefor H01F41/18 -H01F41/24 take precedence
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 23/498 Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers shape of the substrate H01L23/13
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

A method of manufacturing an inductor for a microelectronic device comprises providing a substrate (610), forming a first plurality of inductor windings (111, 211, 411, 620, 2030) over the substrate, forming a magnetic inductor core (112, 212, 412, 810) over the first plurality of inductor windings, and forming a second plurality of inductor windings (113, 213, 413, 1010) over the magnetic inductor core. In another embodiment, the method comprises forming the inductor on a sacrificial substrate (1610) such that the inductor can subsequently be mounted onto a carrier tape (1810). In yet another embodiment, a method of manufacturing a substrate for a microelectronic device comprises forming an inductor within a build-up layer (101, 102, 103, 104) of a substrate.

Claims

1. A method of manufacturing an inductor for a microelectronic device, the method comprising:

providing a substrate;

forming a first plurality of inductor windings over the substrate;

forming a magnetic inductor core over the first plurality of inductor windings; and

forming a second plurality of inductor windings over the magnetic inductor core,

wherein;

forming the first plurality of inductor windings comprises;

depositing a metallic seed layer on the substrate;

patterning the metallic seed layer in order to define a plating region on the metallic seed layer; and

plating an electrically conductive material onto the metallic seed layer such that the electrically conductive material is located only in the plating region.

2. The method of claim 1 wherein:

forming the second plurality of inductor windings comprises;

forming a metallic seed layer;

patterning the metallic seed layer in order to define a plating region on the metallic seed layer; and

plating an electrically conductive material onto the metallic seed layer such that the electrically conductive material is located only in the plating region.

4. The method of claim 1 or 3 wherein:

forming the magnetic inductor core comprises;

depositing a magnetic material;

patterning the magnetic material in order to define a core region; and

shaping the magnetic material such that it is confined to the core region.

5. The method of claim 4 wherein:

patterning the magnetic material comprises;

depositing a photoresist mask on the magnetic material; and

thermally treating the photoresist mask such that the photoresist mask assumes a rounded shape; and

shaping the magnetic material comprises;

conformally etching the magnetic material such that the magnetic material also assumes a rounded shape.

6. The method of claim 4 wherein:

patterning the magnetic material comprises;

depositing a photoresist mask on the magnetic material using an ink jet spraying procedure to deposit the photoresist mask with a rounded shape; and

shaping the magnetic material comprises;

conformally etching the magnetic material such that the magnetic material also assumes a rounded shape.

7. The method of claim 1 or 3 further comprising:

depositing a first electrically insulating material between the first plurality of inductor windings and the magnetic inductor core; and

depositing a second electrically insulating material between the magnetic inductor core and the second plurality of inductor windings.

8. The method of claim 7 further comprising:

patterning the second electrically insulating material.

3. A method of manufacturing an inductor for a microelectronic device, the method comprising:

providing a substrate;

forming a first plurality of inductor windings over the substrate;

forming a magnetic inductor core over the first plurality of inductor windings; and

forming a second plurality of inductor windings over the magnetic inductor core,

wherein;

forming the second plurality of inductor windings comprises;

forming a metallic seed layer;

patterning the metallic seed layer in order to define a plating region on the metallic seed layer; and

plating an electrically conductive material onto the metallic seed layer such that the electrically conductive material is located only in the plating region.

9. A method of manufacturing an inductor for a microelectronic device, the method comprising:

providing a substrate;

forming a first plurality of inductor windings over the substrate;

forming a magnetic inductor core over the first plurality of inductor windings; and

forming a second plurality of inductor windings over the magnetic inductor core,

wherein;

forming the magnetic inductor core comprises;

depositing a magnetic material;

patterning the magnetic material in order to define a core region; and

shaping the magnetic material such that it is confined to the core region;

patterning the magnetic material comprises;

depositing a photoresist mask on the magnetic material; and

thermally treating the photoresist mask such that the photoresist mask assumes a rounded shape; and

shaping the magnetic material comprises;

conformally etching the magnetic material such that the magnetic material also assumes a rounded shape.

10. A method of manufacturing an inductor for a microelectronic device, the method comprising:

providing a substrate;

forming a first plurality of inductor windings over the substrate;

forming a magnetic inductor core over the first plurality of inductor windings; and

forming a second plurality of inductor windings over the magnetic inductor core,

wherein;

forming the magnetic inductor core comprises;

depositing a magnetic material;

patterning the magnetic material in order to define a core region; and

shaping the magnetic material such that it is confined to the core region;

patterning the magnetic material comprises;

depositing a photoresist mask on the magnetic material using an ink jet spraying procedure to deposit the photoresist mask with a rounded shape; and

shaping the magnetic material comprises;

conformally etching the magnetic material such that the magnetic material also assumes a rounded shape.