Power surface mount light emitting die package
DCFirst Claim
1. A light emitting die package, comprising:
- an electrically insulating substrate comprising a substantially planar top surface and a substantially planar bottom surface;
a plurality of traces disposed on the top surface of the substrate;
a light emitting diode (LED) mounted on the top surface of the substrate and proximate a center of the substrate, and the LED being connected to one or more traces of the plurality of traces; and
a thermal contact pad disposed on the bottom surface of the substrate.
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Accused Products
Abstract
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).
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Citations
19 Claims
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1. A light emitting die package, comprising:
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an electrically insulating substrate comprising a substantially planar top surface and a substantially planar bottom surface; a plurality of traces disposed on the top surface of the substrate; a light emitting diode (LED) mounted on the top surface of the substrate and proximate a center of the substrate, and the LED being connected to one or more traces of the plurality of traces; and a thermal contact pad disposed on the bottom surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A light emitting die package comprising:
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an electrically insulating substrate comprising a top surface, a bottom surface, and a substantially uniform thickness; a plurality of traces disposed on the top surface of the substrate; a light emitting diode (LED) mounted on the top surface of the substrate, proximate a center of the substrate, and the LED being connected to at least one trace of the plurality of traces; a thermal contact pad disposed on the bottom surface of the substrate; and a reflector coupled to the substrate and substantially surrounding the LED, the reflector defining a reflection surface. - View Dependent Claims (15, 16, 17)
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18. A light emitting die package, comprising:
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an electrically insulating substrate comprising a top surface and a bottom surface; a plurality of traces disposed on the top surface of the substrate; a light emitting diode (LED) mounted on the top surface of the substrate and connected to the plurality of traces; a thermal contact pad disposed on the bottom surface of the substrate; and a lens over the LED, the lens sitting on and adhering adheres to the encapsulant, the lens free to move as the encapsulant expands and contracts.
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19. A light emitting die package, comprising:
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an electrically insulating substrate comprising a top surface and a bottom surface; a plurality of traces disposed on the top surface of the substrate; a light emitting diode (LED) mounted on the top surface of the substrate and connected to the plurality of traces; a thermal contact pad disposed on the bottom surface of the substrate; and a lens over the LED, the lens sitting on and adhering adheres to the encapsulant and the lens being, free to move relative to the substrate.
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Specification