Method of heating dispersion composition and method of forming glass pattern

• US 8,623,469 B2
• Filed: 10/19/2012
• Issued: 01/07/2014
• Est. Priority Date: 10/21/2011
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Shimomura, Akihisa, Miyairi, Hidekazu
• Primary Examiner(s): Gambetta, Kelly M
• Assistant Examiner(s): Agaj, Ina
• Application Number:
  US13/656,059
• Publication Number:
  US 20130101754A1
• Time in Patent Office: 445 Days
• Field of Search: None
• US Class Current: 427/554
• CPC Class Codes: B23K 26/0608 in the same heat affected zone [HAZ] B23K26/0613, B23K26/0619 take precedence
• CPC Class Codes: B23K 26/0736 into an oval shape, e.g. elliptic shape
• CPC Class Codes: B23K 26/0738 into a linear shape
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

Provided are a method of heating a composition which is applicable to a substrate provided with a material having low heat resistance and a method of forming a glass pattern which leads to reduction of cracks. A composition formed over a substrate is irradiated with a laser beam to bake the paste through local heating. Scan with the laser beam is performed so that there can be no difference in the laser beam irradiation period between the middle portion and the perimeter portion of the composition. Specifically, irradiation with the laser beam is performed so that the width of the beam spot overlapping with the composition in the scanning direction is substantially uniform.

Claims

1. A method of heating a dispersion composition, comprising the step of scanning a beam spot of a laser beam while irradiating a composition having a linear closed curve shape and comprising a dispersoid and a disperse medium having a lower boiling point or a lower decomposition temperature than the dispersoid, with the laser beam,

wherein a shape of the beam spot is a rectangle,

wherein the scanning is performed while a minor axis of the beam spot is tilted relative to the scanning direction,

wherein the scanning with the tilted laser beam is performed along the closed curve shape, and

wherein the beam spot is scanned while each of two opposite sides of the beam spot intersects with opposite edges of the composition.

2. The method of heating a dispersion composition, according to claim 1, wherein the dispersion composition is a frit paste comprising glass frits and a binder.

3. The method of heating a dispersion composition, according to claim 1, wherein a major axis of the beam spot is 1.3 or more times as long as the minor axis of the beam spot.

4. The method of heating a dispersion composition, according to claim 1, wherein the scanning is performed while an angle formed between the minor axis and each of the sides of the dispersion composition is kept at 45°

.

5. A method of heating a dispersion composition, comprising the step of scanning a beam spot of a laser beam while irradiating a composition having a closed curve shape and comprising a dispersoid and a disperse medium having a lower boiling point or a lower decomposition temperature than the dispersoid, with the laser beam,

wherein a shape of the beam spot is a rectangle having rounded corners,

wherein the scanning is performed while a minor axis of the beam spot is tilted relative to the scanning direction,

wherein the scanning with the tilted laser beam is performed along the closed curve shape, and

wherein the beam spot is scanned while each of two opposite sides of the beam spot intersects with opposite edges of the composition.

6. The method of heating a dispersion composition, according to claim 5, wherein the dispersion composition is a frit paste comprising glass frits and a binder.

7. The method of heating a dispersion composition, according to claim 5, wherein a major axis of the beam spot is 1.3 or more times as long as the minor axis of the beam spot.

8. The method of heating a dispersion composition, according to claim 5, wherein the scanning is performed while an angle formed between the minor axis and each of the sides of the dispersion composition is kept at 45°

.