Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film

• US 8,623,512 B2
• Filed: 12/16/2010
• Issued: 01/07/2014
• Est. Priority Date: 12/21/2009
• Status: Active Grant

• Current Assignee: Cheil Industries Incorporated
• Original Assignee: Cheil Industries Incorporated
• Inventors: Pyun, Ah Ram, Cho, Jae Hyun, Song, Ki Tae
• Primary Examiner(s): Feely, Michael J
• Application Number:
  US12/970,045
• Publication Number:
  US 20110152394A1
• Time in Patent Office: 1,118 Days
• Field of Search: 156/327, 156/330, 156/332, 156/335, 428/413, 428/414, 438/33, 438/68, 523/427, 525/107, 525/109, 525/117, 525/119, 525/523, 525/524, 525/529, 525/530, 525/531, 525/532, 525/533
• US Class Current: 428/413
• CPC Class Codes: C08G 59/621 Phenols
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: Y10T 428/31511 Of epoxy ether

Abstract

An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.

Claims

1. An adhesive composition for stealth dicing of a semiconductor, the adhesive composition comprising:

about 100 parts by weight of a polymer resin, the polymer resin having a glass transition temperature of about 5°

C. to about 35°

C.,

about 1 to about 20 parts by weight of an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin,

about 1 to about 20 parts by weight of a phenolic resin curing agent

about 10 to about 80 parts by weight of an inorganic filler,

about 0.1 to about 20 parts by weight of a curing catalyst, and

about 0.1 to about 10 parts by weight of a silane coupling agent,

wherein the adhesive composition provides an adhesive having an elastic modulus at 0°

C. of about 1,500 to about 2,500 MPa before curing and an elastic modulus at 175°

C. of about 1.5 to about 2.5 MPa after curing.

2. The adhesive composition as claimed in claim 1, wherein the liquid epoxy resin is present in an amount of about 5 to about 40% by weight, based on a total weight of the epoxy resin.

3. The adhesive composition as claimed in claim 1, wherein the polymer resin has a weight average molecular weight of about 50,000 to about 5,000,000 g/mol.

4. The adhesive composition as claimed in claim 1, wherein the polymer resin includes at least one of a polyester resin, a polyamide resin, a butadiene rubber, an acrylic rubber, a (meth)acrylate resin, a urethane resin, a polyphenylene ether resin, a polyetherimide resin, a phenoxy resin, a modified polyphenylene ether resin, and a (meth)acrylate copolymer containing epoxy groups.

5. The adhesive composition as claimed in claim 1, wherein the liquid epoxy resin includes at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, a tri- or higher functional epoxy resin, a rubber modified epoxy resin, a urethane modified epoxy resin, an acrylic modified epoxy resin, and a photosensitive epoxy resin.

6. The adhesive composition as claimed in claim 1, wherein the solid epoxy resin includes at least one of a bisphenol epoxy resin, a phenol novolac epoxy resin, an o-cresol novolac epoxy resin, a polyfunctional epoxy resin, an amino epoxy resin, a heterocyclic ring-containing epoxy resin, a substituted epoxy resin, a naphthol epoxy resin, and derivatives thereof.

7. The adhesive composition as claimed in claim 1, wherein the phenolic resin curing agent includes at least one of bisphenol resins, phenol novolac resins, bisphenol A novolac resins, phenolic resins, and mixtures thereof.

8. The adhesive composition as claimed in claim 1, wherein the inorganic filler includes at least one of gold powder, silver powder, copper powder, nickel, alumina, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum nitride, silica, boron nitride, titanium dioxide, a glass, iron oxide, and a ceramic.

9. The adhesive composition as claimed in claim 1, wherein the curing catalyst includes at least one of a melamine catalyst, an imidazole catalyst, and a triphenylphosphine catalyst.

10. The adhesive composition as claimed in claim 1, wherein the silane coupling agent includes at least one of:

an epoxy-containing silane including at least one of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxytrimethoxysilane, and 3-glycidoxypropyltriethoxysilane;

an amine-containing silane including at least one of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, and N-phenyl-3-aminopropyltrimethoxysilane;

a mercapto-containing silane including at least one of 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltriethoxysilane; and

an isocyanate-containing silane including 3-isocyanatopropyltriethoxysilane.

11. The adhesive composition as claimed in claim 1, further comprising about 20 to about 500 parts by weight of an organic solvent, based on 100 parts by weight of the polymer resin.

12. The adhesive composition as claimed in claim 1, further comprising about 0.01 to about 10 parts by weight of at least one ion scavenger, based on 100 parts by weight of the polymer resin, the ion scavenger including at least one of a triazine thiol compound, a zirconium compound, an antimony bismuth compound, and a magnesium aluminum compound.

13. The adhesive composition as claimed in claim 1, wherein:

the liquid epoxy resin has a melting point of about −

70°

C. to about 0°

C., and the solid epoxy resin has a softening point of about 30°

C. to about 100°

C.

14. An adhesive film for stealth dicing of a semiconductor formed from the adhesive composition as claimed in claim 1.

15. A semiconductor device comprising the adhesive film as claimed in claim 14 adhered to a silicon wafer.

16. The semiconductor device as claimed in claim 15, wherein less than about 5% of an area of the adhesive film is covered by attach voids or molding voids.