Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration

• US 8,623,677 B2
• Filed: 04/25/2012
• Issued: 01/07/2014
• Est. Priority Date: 11/14/2007
• Status: Expired due to Fees

• Current Assignee: Stion Corporation
• Original Assignee: Stion Corporation
• Inventors: Lee, Howard W. H., Farris, Chester A. III
• Primary Examiner(s): Lee, Hsien Ming
• Application Number:
  US13/456,048
• Publication Number:
  US 20120270361A1
• Time in Patent Office: 622 Days
• Field of Search: 438/22, 438/29, 438/34, 438/46, 438/47, 438/57, 438/73, 438/74, 438/95, 257/40, 257/E33.001, 257/E25.005, 257/E51.018
• US Class Current: 438/22
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67213 comprising at least one ion or electron beam chamber coating by ion implantation C23C; ion or electron beam tubes H01J37/00
• CPC Class Codes: H01L 21/6723 comprising at least one plating chamber electroless plating apparatuses C23C, electroplating apparatuses C25D
• CPC Class Codes: Y10S 428/917 Electroluminescent

Abstract

A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control.

Claims

1. A method for manufacturing a thin film photovoltaic module comprising:

transferring a substrate into a first chamber of a multi-chamber system, the substrate being optically transparent and having a lateral dimension of at least 1.5 meters, wherein chambers of the multi-chamber system are mechanically coupled with one another;

forming an electrode layer overlying the substrate in the first chamber;

transferring the substrate to a second chamber of the multi-chamber system;

forming a copper (Cu)-bearing material layer overlying the electrode layer in the second chamber;

transferring the substrate to a third chamber of the multi-chamber system;

forming an indium (In) layer overlying the copper-bearing material layer in the third chamber thereby forming a Cu—

In composite film;

transferring the substrate comprising the Cu—

In composite film to a fourth chamber of the multi-chamber system;

subjecting the Cu—

In composite film to a thermal treatment process in the fourth chamber in an environment including sulfur-bearing species;

transforming the Cu—

In composite film to a copper-indium-disulfide material; and

forming a photovoltaic absorber layer for a thin film photovoltaic module using the copper-indium-disulfide material.

2. The method of claim 1 wherein the substrate comprises one of:

soda lime glass, quartz, fused silica, or plastic.

3. The method of claim 1 wherein the first chamber comprises two or more sputtering targets disposed in series and characterized by resistivity of about 100 ohm-cm to 10 ohm-cm.

4. The method of claim 3 wherein the two or more sputtering targets comprise a conductive material selected from a group consisting of molybdenum, tungsten, copper, chromium, aluminum, nickel, and platinum.

5. The method of claim 3 wherein the electrode layer comprises one or more sub-layers and is characterized by a total thickness of between 300 nm to 400 nm.

6. The method of claim 1 further comprising patterning the electrode layer prior to transferring the substrate to the second chamber, wherein the patterning comprises forming one or more electrode patterns using a laser ablation technique.

7. The method of claim 1 wherein the second chamber comprises a vacuum environment with a pressure of about 6.2 mTorr or lower.

8. The method of claim 1 wherein the copper-bearing material layer comprises a copper-gallium alloy.

9. The method of claim 1 wherein the third chamber comprises a sputtering target made of material comprising 99.999% pure indium.

10. The method of claim 1 wherein the indium layer is formed overlying the copper-bearing material layer using a DC sputtering technique.

11. The method of claim 1 wherein the fourth chamber comprises a plurality of heaters configured to perform a rapid thermal annealing of the substrate at a temperature of about 500 degrees Celsius.

12. The method of claim 1 wherein the sulfur-bearing species comprise a hydrogen sulfide gas, a sulfur vapor from a solid phase sulfide material, or a deposited sulfur layer overlying the indium layer.

13. The method of claim 1 wherein the thermal treatment process further comprises forming a copper sulfide cap layer over the copper-indium-disulfide material.

14. The method of claim 13 further comprising subjecting the substrate to a dip process for substantially removing the copper sulfide cap layer.

15. The method of claim 1 wherein forming the photovoltaic absorber layer comprises doping the substrate with sodium, boron, or aluminum.

16. A method comprising:

transferring a substrate into a first process chamber of a multi-chamber system, wherein chambers of the multi-chamber system are in process communication with one another such that environmental parameters may be maintained between chambers of the multi-chamber system;

forming a conductive layer over a surface of the substrate in the first chamber;

forming a copper layer over the conductive layer in a second chamber of the multi-chamber system;

forming an indium layer over the copper layer in a third chamber of the multi-chamber system thereby forming a copper-indium composite layer;

exposing the copper-indium composite layer to sulfur-bearing species at a first temperature in a fourth chamber of the multi-chamber system;

forming a copper-indium-sulfide layer; and

forming a cap layer over the copper-indium-sulfide layer.

17. The method of claim 16 further comprising doping the copper-indium-sulfide layer to form an absorber layer.

18. The method of claim 17 wherein the doping comprises exposing the copper-indium-sulfide layer to sodium, boron, or aluminum species.

19. The method of claim 16 further comprising:

transferring the substrate from a first load lock to the first process chamber; and

transferring the substrate to a second load lock from the fourth process chamber,

wherein the first load lock and the second load lock is part of the multi-chamber system.