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Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same

  • US 8,623,686 B2
  • Filed: 03/14/2013
  • Issued: 01/07/2014
  • Est. Priority Date: 06/04/2003
  • Status: Active Grant
First Claim
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1. A method of manufacturing a microelectromechanical device, the method comprising:

  • forming a micromachined mechanical structure on top of a substrate;

    providing a sacrificial layer over the micromachined mechanical structure;

    disposing a first encapsulation layer over at least a portion of the sacrificial layer, at least a portion of the micromachined mechanical structure, and at least a portion of the substrate;

    forming a plurality of vents in the first encapsulation layer;

    removing the sacrificial layer through the plurality of vents to release at least a portion of the micromachined mechanical structure, thereby forming a chamber, wherein;

    a surface of the first encapsulation layer forms a wall of the chamber,at least a portion of the micromachined mechanical structure is disposed in the chamber, andafter the sacrificial layer is removed, no intervening layers reside between the micromachined mechanical structure and the first encapsulation layer; and

    disposing a second encapsulation layer over the first encapsulation layer to fill the plurality of vents, thereby sealing the chamber, wherein;

    no intervening layers reside between the first encapsulation layer and the second encapsulation layer, andthe first encapsulation layer and the second encapsulation layer comprise the same material.

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