Light emitting device package and method of manufacturing the same

• US 8,624,268 B2
• Filed: 07/23/2008
• Issued: 01/07/2014
• Est. Priority Date: 07/25/2007
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Cho, Bum Chul, Park, Jin Soo
• Primary Examiner(s): Lam, Cathy N
• Application Number:
  US12/668,996
• Publication Number:
  US 20100224903A1
• Time in Patent Office: 1,994 Days
• Field of Search: 257/E33.056, 257/E33.066, 257/98, 257/99, 257/100, 438/22, 438/25, 438/26, 438/27, 438/29
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.

Claims

1. A light emitting device package comprising:

a substrate having a recess on a top surface thereof and a plurality of first protrusions formed on at least one of a bottom and side surfaces of the recess;

an insulating layer on the substrate;

a metal layer on the insulating layer; and

a light emitting device that is installed on the recess and electrically connected to the metal layer,

wherein the metal layer includes a plurality of second protrusions corresponding to the plurality of first protrusions, and

wherein the metal layer further includes a top surface and a bottom surface opposite to each other, the top surface and the bottom surface each having a roughness structure.

2. The light emitting device package according to claim 1, wherein the plurality of first protrusions are formed on the bottom surface of the recess except for a portion where the light emitting device is installed.

3. The light emitting device package according to claim 1, wherein the insulating layer is formed along a surface of the substrate, the metal layer includes first and second metal layers that are electrically separated from each other, and the side surface of the recess is an inclined surface.

4. The light emitting device package according to claim 1, wherein the light emitting device has at least one electrode that is directly and electrically connected to the metal layer.

5. The light emitting device package according to claim 1, wherein the metal layer extends from the recess to a bottom surface of the substrate via a side surface of the substrate.

6. The light emitting device package according to claim 1, wherein the metal layer is disposed on the bottom surface of the recess of the substrate, a side surface of the substrate, and a bottom surface of the substrate.

7. A light emitting device package, comprising:

a substrate including a recess on a top surface thereof having a plurality of first protrusions;

a conductive layer configured to cover the plurality of first protrusions and including a plurality of second protrusions corresponding to the plurality of first protrusions; and

a light emitting device on the substrate and electrically connected to the conductive layer via at least one wire,

wherein the light emitting device is configured to emit light in at least a direction toward the plurality of second protrusions such that the plurality of second protrusions reflect light in an upward direction away from the substrate,

wherein the plurality of first protrusions are on an upper surface of the substrate at outside portions of the light emitting device, and

wherein the conductive layer includes a top surface and a bottom surface opposite to each other, the top surface and the bottom surface each having a roughness structure.

8. The light emitting device package according to claim 7, wherein the light emitting device is installed on a bottom surface of the recess, and

wherein the plurality of first protrusions are not underneath the light emitting device.

9. The light emitting device package according to claim 7, wherein a side surface of the recess is an inclined surface.

10. The light emitting device package according to claim 9, wherein the plurality of first protrusions are additionally on the inclined side surfaces of the recess.

11. The light emitting device package according to claim 7, wherein the conductive layer is disposed on the bottom surface of the recess of the substrate, a side surface of the substrate, and a bottom surface of the substrate.

12. The light emitting device package according to claim 7, wherein the conductive layer extends from the recess to a bottom surface of the substrate via a side surface of the substrate.

13. A light emitting device package comprising:

a substrate having a recess and including a non-metallic material;

a metal layer on the substrate; and

a light emitting device electrically connected to the metal layer and installed on the substrate,

wherein the metal layer includes at least two sections that are electrically separated from each other,

wherein the metal layer includes a plurality of protrusions formed thereon,

wherein the metal layer extends from the recess of the substrate to a bottom of the substrate via an outer side surface of the substrate, and

wherein the metal layer includes a top surface and a bottom surface opposite to each other, the top surface and the bottom surface each having a roughness structure.

14. The light emitting device package according to claim 13, wherein the metal layer is disposed on a bottom surface of the recess of the substrate.

15. The light emitting device package according to claim 13, wherein the light emitting device is disposed on a bottom surface of the recess, and

wherein a part of the metal layer is disposed between the light emitting device and the bottom surface of the recess.

16. The light emitting device package according to claim 13, wherein the metal layer comprises aluminum (Al) or silver (Ag).

17. The light emitting device package according to claim 13, wherein the metal layer further comprises a conductive metal, and

wherein the aluminum (Al) or silver (Ag) is disposed on the conductive metal.

18. The light emitting device package according to claim 13, further comprising:

a molding member in the recess.

19. The light emitting device package according to claim 18, wherein a top surface of the molding member has a concave shape, a convex shape or a planar shape.

20. The light emitting device package according to claim 18, wherein the molding member comprises phosphors that changes a color of light emitted from the light emitting device.