Methods for forming a pixel of a micro-chip light-emitting diode light source and a plurality of light-emitting diode pixels arranged in a two-dimensional array

• US 8,624,274 B2
• Filed: 08/22/2011
• Issued: 01/07/2014
• Est. Priority Date: 11/06/2007
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Hsueh, Han-Tsung, Yen, Hsi-Hsuan, Yeh, Wen-Yung, Chu, Mu-Tao
• Primary Examiner(s): ARMAND, MARC ANTHONY
• Application Number:
  US13/215,214
• Publication Number:
  US 20110300656A1
• Time in Patent Office: 869 Days
• Field of Search: 257/89, 257/E33.005, 257/13, 257/79, 257/103, 257/918, 257/E51.018, 257/E25.028, 438/35
• US Class Current: 257/89
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: Y10S 257/918 Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry

Abstract

A method for forming a pixel of an LED light source is provided. The method includes: forming a first layer on a first substrate; forming a second layer and a first light-emitting active layer on the first layer; forming a first intermediate layer on the second layer; forming a third layer on a second substrate; forming a fourth layer and a second light-emitting active layer on the third layer; placing the third layer, the fourth layer, and the second light-emitting active layer on the first intermediate layer, wherein the first light-emitting active layer and the second light-emitting active layer emit different colors of light. A method for forming a plurality of light-emitting diode pixels arranged in a two-dimensional array is also provided.

Claims

1. A method for forming a plurality of light-emitting diode pixels arranged in a two-dimensional array, the method comprising:

simultaneously forming a plurality of first layers arranged in a two-dimensional array on a first chip substrate by deposition technique;

forming a plurality of second layers and a plurality of first light-emitting active layers on the first layers correspondingly;

forming a plurality of first intermediate layers on the second layers;

forming a plurality of third layers arranged in a two-dimensional array on a second chip substrate;

forming a plurality of fourth layers and a plurality of second light-emitting active layers on the third layers correspondingly;

placing the third layers, the fourth layers, and the second light-emitting active layers on the first intermediate layers; and

forming a plurality of first, a plurality of second, a plurality of third, and a plurality of fourth electrodes coupled with the first, second, third and fourth layers, respectively,

wherein the first light-emitting active layer is driven by the first and second electrodes to emit one color of light, and the second light-emitting active layer is driven by the third and fourth electrodes to emit another color of light.

2. The method of claim 1, wherein each of the first intermediate layers comprises an adhesive.

3. The method of claim 1, wherein each of the first intermediate layers comprises conductive particles.

4. The method of claim 1 further comprising:

exposing portions of upper surfaces of the first layers;

exposing portions of upper surfaces of the third layers; and

forming the plurality of first electrodes on the exposed portions of the upper surfaces of the first layers, the plurality of second electrodes on portions of upper surfaces of the second layers, the plurality of third electrodes on the exposed portions of the upper surfaces of the third layers, and the plurality of fourth electrodes on portions of upper surfaces of the fourth layers.

5. A method for forming a pixel of a micro-chip light-emitting diode light source, the method comprising:

simultaneously forming a first lower layer, a second lower layer, and a third lower layer on a chip substrate by deposition technique;

forming a first light-emitting active layer, a second light-emitting active layer, and a third light-emitting active layer on the first, second, and third lower layers respectively by deposition technique, wherein at least a portion of an upper surface of each of the first, second, and third lower layers is left uncovered by the first, second, and third light-emitting active layers respectively, wherein the first light-emitting active layer, the second light-emitting active layer, and the third light-emitting active layer emit different colors of light;

forming a first upper layer, a second upper layer, and a third upper layer on the first, second, and third light-emitting active layers respectively by deposition technique;

forming a first electrode pad, a second electrode pad, and a third electrode pad on the exposed upper surfaces of the first, second, and third lower layers respectively; and

forming a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad on upper surfaces of the first, second, and third upper layers respectively,

wherein the first light-emitting active layer is driven by the first and second electrode pads to emit one color of light, the second light-emitting active layer is driven by the third and fourth electrode pads to emit another color of light, and the third light-emitting active layer is driven by the fifth and sixth electrode pads to emit the other color of light.

6. A method for forming a pixel of a micro-chip light-emitting diode light source, the method comprising:

forming a first lower layer on a chip substrate by deposition technique;

forming a first light-emitting active layer on the first lower layer by deposition technique;

forming a first upper layer on the first light-emitting active layer by deposition technique, wherein at least a portion of an upper surface of the first lower layer is left uncovered by the first light-emitting active layer and the first upper layer;

forming an intermediate layer on the first upper layer by deposition technique, wherein at least a portion of an upper surface of the first upper layer is left uncovered by the intermediate layer;

forming a second lower layer directly on the intermediate layer by deposition technique;

forming a second light-emitting active layer on the second lower layer by deposition technique;

forming a second upper layer on the second light-emitting active layer by deposition technique, wherein at least a portion of an upper surface of the second lower layer is left uncovered by the second light-emitting active layer and the second upper layer, wherein the first light-emitting active layer and the second light-emitting active layer emit different colors of light;

forming a first electrode pad and a second electrode pad on the exposed upper surfaces of the first and second lower layers respectively; and

forming a third electrode pad on the exposed upper surface of the first upper layer and forming a fourth electrode pad on an upper surface of the second upper layer.

7. The method of claim 6 further comprising;

forming a third lower layer directly on the intermediate layer by deposition technique;

forming a third light-emitting active layer on the third lower layer by deposition technique;

forming a third upper layer on the third light-emitting active layer by deposition technique, wherein at least a portion of an upper surface of the third lower layer is left uncovered by the third light-emitting active layer and the third upper layer, wherein the first light-emitting active layer, the second light-emitting active layer and the third light-emitting active layer emit different colors of light; and

forming a fifth electrode pad and a sixth electrode pad on the exposed upper surface of the third lower layer and an upper surface of the third upper layer respectively.