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Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

  • US 8,624,276 B2
  • Filed: 08/07/2012
  • Issued: 01/07/2014
  • Est. Priority Date: 10/19/2007
  • Status: Active Grant
First Claim
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1. A semiconductor light emitting device comprising:

  • a conductive substrate;

    a first electrode layer disposed on the conductive substrate;

    an insulating layer disposed on the first electrode layer;

    a second electrode layer disposed on the insulating layer, the second electrode layer including a first surface;

    a second conductivity type semiconductor layer disposed on the first surface of the second electrode layer;

    an active layer disposed on the second conductivity type semiconductor layer; and

    a first conductivity type semiconductor layer disposed on the active layer,wherein the first surface of the second electrode layer has an exposed area on which the first conductivity type layer, the active layer, and the second conductivity type layer are not disposed,the first electrode layer comprises at least one contact hole, the contact hole electrically connected to the first conductivity type semiconductor layer, the contact hole electrically insulated from the second conductivity type semiconductor layer and the active layer, and the contact hole extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer, andthe exposed area of the second electrode layer is disposed at a corner of the first surface of the second electrode layer.

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