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Solid-state imaging device and method for manufacturing solid-state imaging device, and electronic device

  • US 8,624,305 B2
  • Filed: 11/03/2010
  • Issued: 01/07/2014
  • Est. Priority Date: 11/17/2009
  • Status: Active Grant
First Claim
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1. A solid-state imaging device, comprising:

  • a plurality of photoelectric conversion portions layered above an imaging surface of a substrate, anda plurality of readout circuit portions layered above the imaging surface of the substrate, each readout circuit corresponding to one of the plurality of photoelectric conversion portions and located below the corresponding photoelectric conversion portion;

    wherein,each photoelectric conversion portion includes a photoelectric conversion film that receives incident light and produces a signal charge,for each photoelectric conversion portion, the photoelectric conversion film is in-between a first electrode and a second electrode,for each photoelectric conversion portion, the first electrode, the photoelectric conversion film, and the second electrode are sequentially layered upward on the imaging surface,each readout circuit portion includes a readout circuit that is electrically connected with the first electrode of its respective photoelectric conversion portion and reads out the signal charge produced by the photoelectric conversion portion, and a ground electrode that is grounded, andfor each readout circuit portion, the ground electrode is in-between the readout circuit and the first electrode on the imaging surface.

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