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Rear-face illuminated solid state image sensors

  • US 8,624,342 B2
  • Filed: 11/05/2010
  • Issued: 01/07/2014
  • Est. Priority Date: 11/05/2010
  • Status: Active Grant
First Claim
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1. A microelectronic unit comprising:

  • a semiconductor element having a front surface and a rear surface remote from the front surface;

    a packaging layer attached to the front surface of the semiconductor element,wherein the semiconductor element includes a light detector disposed adjacent to the front surface and aligned with a portion of the rear surface to receive light through the rear surface portion, and a conductive contact at the front surface connected to the light detector, wherein the light detector includes a plurality of light detector elements arranged in an array, wherein the conductive contact is at least partially within the semiconductor element and has a first surface and a second surface remote from the first surface, wherein the conductive contact includes a thin region having a first thickness and thicker region having a second thickness that is thicker than the first thickness, wherein the conductive contact has a hole extending from the first surface through the conductive contact towards the second surface, the hole defining a wall surface extending within the conductive contact from the first surface towards the second surface; and

    a conductive interconnect extending through the packaging layer and the hole of the conductive contact from the first surface towards the second surface so as to contact the wall surface in at least the thicker region of the conductive contact, at least a portion of the conductive interconnect being exposed at a surface of the microelectronic unit.

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