Packages and methods for packaging microphone devices

• US 8,625,832 B2
• Filed: 10/27/2011
• Issued: 01/07/2014
• Est. Priority Date: 04/04/2011
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Lillelund, Christian
• Primary Examiner(s): Matar, Ahmad
• Assistant Examiner(s): Yu, Norman
• Application Number:
  US13/282,990
• Publication Number:
  US 20120250925A1
• Time in Patent Office: 803 Days
• Field of Search: 381/355, 381/369, 381/170, 381/174, 381/175
• US Class Current: 381/355
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/1531 the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/016 for microphones
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Packages for electronic amplification include a packaged microphone device that includes a housing and an acoustic transducer disposed therein. The housing includes an exterior top surface and an exterior bottom surface that includes electrical terminals disposed thereon. The package microphone device can include a flexible substrate having a top portion, a bottom portion and a flexible middle portion. The flexible middle portion is folded around the housing such that the top portion at least partially overlays and attaches to the exterior top surface of the housing and the bottom portion at least partially overlays and attaches to the exterior bottom surface of the housing.

Claims

1. A component assembly, comprising:

an acoustic transducer component with a housing and an acoustic transducer disposed therein, the housing including a rigid substrate with first and second surfaces opposite each other, wherein the housing has an exterior top surface, wherein the rigid substrate is disposed with its second surface as an exterior bottom surface of the housing, and wherein electrical terminals are disposed on the second surface of the rigid substrate; and

a flexible substrate having a first portion and a second portion and being flexible at least between the first and second portions, each portion with opposing sides, wherein the flexible substrate is folded around the acoustic transducer component with its first portion overlaying and attached to the exterior top surface and its second portion at least partially overlaying and attached to the exterior bottom surface, and wherein the flexible substrate is provided with first electrically conductive terminals exposed on the side of the first portion that faces away from the housing and second electrically conductive terminals exposed on the side of the second portion that faces towards the housing, at least one of the second electrically conductive terminals connecting to at least one of the electrical terminals of the rigid substrate.

2. The component assembly according to claim 1, wherein the component assembly has a sound port extending through its housing for passage of sound pressure between the exterior of the component assembly and the acoustic transducer.

3. The component assembly according to claim 2, wherein the component assembly has a sound port with an opening through its housing and a hole through the flexible substrate, where the opening of the sound port and the hole through the flexible substrate are aligned with each other for transmitting a sound pressure between the exterior of the component assembly and the acoustic transducer.

4. The component assembly according to claim 1, wherein an electrically conductive trace runs between a first side of the first portion and the opposing side of the second portion of the flexible substrate, and wherein the trace is routed through a vertical interconnect access (VIA).

5. The component assembly according to claim 1, further comprising a semiconductor die disposed on the second portion of the flexible substrate on a side of the second portion facing away from the housing.

6. The component assembly according to claim 5, wherein the semiconductor die is encapsulated in a glob top.

7. The component assembly according to claim 1, wherein the second portion of the flexible substrate has a smaller area than the second surface of the rigid substrate.

12. The component assembly according to claim 1, where the acoustic transducer is configured as a Micro Electro Mechanical Systems, MEMS, device.

13. The component assembly according to claim 1, where the acoustic transducer is configured as a condenser microphone or an electret condenser microphone.

8. A component assembly comprising:

an acoustic transducer component with a housing and an acoustic transducer disposed therein, the housing including a rigid substrate with first and second surfaces opposite each other, wherein the housing has an exterior top surface, wherein the rigid substrate is disposed with its second surface as an exterior bottom surface of the housing, and wherein electrical terminals are disposed on the second surface of the rigid substrate;

a flexible substrate having a first portion and a second portion and being flexible at least between the first and second portions, each portion with opposing sides, wherein the flexible substrate is folded around the acoustic transducer component with its first portion overlaying and attached to the exterior top surface and its second portion at least partially overlaying and attached to the exterior bottom surface, and wherein the flexible substrate is provided with electrically conductive traces exposed on the side of the first portion that faces away from the housing and connecting to at least one of the electrical terminals; and

a semiconductor die disposed within the housing, wherein the semiconductor die comprises a circuit with an analog portion configured to process analog signals and a digital portion configured to process digital signals, and wherein the electrical terminals disposed on the second surface of the rigid substrate comprise a first terminal connected to the analog portion and a second terminal connected to the digital portion.

9. The component assembly according to claim 8, wherein the electrical terminals disposed on the second surface of the rigid surface further comprise a third terminal, and wherein the electrically conductive traces of the flexible substrate connect to the third terminal and exposes the third terminal on a side of the first portion of the flexible substrate that faces away from the housing.

10. The component assembly according to claim 9, wherein the component assembly further comprises a fourth electrical terminal electrically connected to the semiconductor die, the fourth terminal exposed on the portion of the second surface of the rigid substrate that is not covered by the flexible substrate, and wherein at least one electrical component is electrically connected to the fourth terminal.

11. The component assembly according to claim 10, wherein the component assembly further comprises a fifth electrical terminal electrically connected to the semiconductor die, the fifth terminal exposed on the portion of the flexible substrate that overlays the exterior bottom surface on the side opposite the one fixed to the exterior bottom surface, and wherein at least one electrical component is electrically connected to the fifth terminal.

14. A method of manufacturing a component assembly comprising:

providing an acoustic transducer component with a housing having an exterior top surface and an exterior bottom surface, wherein electrical terminals are disposed on the exterior bottom surface; and

subsequently, attaching to the acoustic transducer component a flexible substrate having a first portion and a second portion each with opposing sides, wherein the flexible substrate is folded around the acoustic transducer component with its first portion overlaying the exterior top surface and its second portion at least partially overlaying the exterior bottom surface, and wherein the flexible substrate is provided with first electrically conductive terminals exposed on the side of the first portion that faces away from the housing and second electrically conductive terminals exposed on the side of the second portion that faces towards the housing, at least one of the second electrically conductive terminals connecting to at least one of the electrical terminals of the housing.

15. The method of claim 14, wherein providing the acoustic transducer component includes providing a first semiconductor die within the housing.

16. The method of claim 15, further comprising mounting a second semiconductor die on the exterior bottom surface of the housing.

17. The method of claim 15, further comprising mounting a passive electronic component on the exterior bottom surface of the housing.

18. The method of claim 15, further comprising mounting a second semiconductor die on the second portion of the flexible substrate on a side of the second portion opposite the housing.

19. A component assembly, comprising:

a packaged microphone device including a housing and an acoustic transducer disposed therein, wherein the housing has an exterior top surface and an exterior bottom surface opposite the exterior top surface, and wherein the exterior bottom surface of the housing includes electrical terminals disposed thereon; and

a flexible substrate having a top portion, a bottom portion and a flexible middle portion, the flexible middle portion disposed between the top and bottom portions, wherein the flexible middle portion is folded around the housing such that the top portion at least partially overlays and attaches to the exterior top surface of the housing and the bottom portion at least partially overlays and attaches to the exterior bottom surface of the housing, and wherein the flexible substrate includes a first electrical terminal that faces away from the housing and a second electrical terminal that faces towards the housing, the second electrical terminal electrically connected to at least one of the electrical terminals of the housing.

20. The component assembly according to claim 19, wherein the housing includes a rigid substrate that includes a first surface and a second surface opposite the first, wherein the second surface of the rigid substrate defines the exterior bottom surface of the housing.

21. The component assembly according to claim 20, further comprising a sound port disposed on the top exterior surface of the housing.

22. The component assembly according to claim 21, wherein the first portion of the flexible substrate includes a hole aligned with the sound port.

23. The component assembly according to claim 20, further comprising a sound port disposed on the bottom exterior surface of the housing.

24. The component assembly according to claim 20, wherein the flexible middle portion of the flexible substrate has a width that is less than a width of the top and bottom portions.

25. The component assembly according to claim 19, further comprising a first die mounted within the housing and a second die mounted on a side of the second portion of the flexible substrate opposite the housing.

26. The component assembly according to claim 25, wherein the second die is encapsulated in a glob top.

27. The component assembly according to claim 26, wherein the first die is configured to process analog signals, and wherein the second is configured to process digital signals.

28. The component assembly according to claim 25, further comprising a passive electronic component mounted on the second portion of the flexible substrate on a side of the second portion opposite the housing.

29. The component assembly according to claim 19, further comprising a first die mounted within the housing and a second die mounted on the exterior bottom surface of the housing.

30. A component assembly, comprising:

a packaged microphone device including a housing and an acoustic transducer disposed therein, wherein the packaged microphone device has an exterior top surface and an exterior bottom surface opposite the exterior top surface, and wherein the exterior bottom surface of the packaged microphone device includes first electrical terminals disposed thereon, and wherein the housing includes a sound port therethrough; and

an electronic component mounted on the bottom surface of the packaged microphone device in electrical communication with the first electrical terminals; and

one or more second electrical terminals on the top surface or bottom surface of the packaged microphone device, the second electrical terminals configured to electrically couple to a system board, wherein the system board is different from the electronic component, and the second electrical terminals are different from the first electrical terminals.

31. The component assembly according to claim 30, further comprising a phone board including an aperture therethrough, wherein the exterior bottom surface of the packaged microphone device is mounted to the phone board such that at least a portion of the electronic component is disposed within the aperture.

32. The component assembly according to claim 30, wherein the housing includes a rigid substrate including a first surface and a second surface opposite the first, wherein the second surface of the rigid substrate defines the exterior bottom surface of the packaged microphone device.

33. The component assembly according to claim 32, further comprising a first die mounted within the housing on the first surface of the rigid substrate.

34. The component assembly according to claim 33, wherein the electronic component comprises a second die.

35. The component assembly according to claim 34, wherein the first die is configured to process analog signals, and wherein the second is configured to process digital signals.

36. The component assembly according to claim 30, wherein the electronic component comprises a passive component electrically connected to the acoustic transducer.

37. The component assembly according to claim 36, wherein the electronic component comprises a trimmable resistor, wherein a resistance of the trimmable resistor determines a sensitivity of the acoustic transducer.

41. The component assembly of claim 30, wherein the packaged microphone device further comprises a flexible substrate having a top portion, a bottom portion and a flexible middle portion, the flexible middle portion disposed between the top and bottom portions, wherein the flexible middle portion is folded around the housing such that the top portion at least partially overlays and attaches to a top side of the housing to define the exterior top surface and the bottom portion at least partially overlays and attaches to a bottom side of the housing to define the exterior bottom surface.

38. A component assembly comprising:

an acoustic transducer component with a housing and an acoustic transducer disposed therein, the housing including an exterior top surface and an exterior bottom surface opposite the exterior top surface, and wherein the housing includes a plurality of electrical terminals disposed on the exterior bottom surface of the housing; and

a conversion substrate including a first portion attached to the exterior top surface of the housing, wherein the first portion of the conversion substrate includes a first plurality of electrical pads disposed on a side of the conversion substrate opposite the housing, the conversion substrate including a second plurality of electrical pads disposed on a side of the conversion substrate facing the housing, wherein at least one of the second plurality of electrical pads is electrically connected to at least one of the plurality of electrical terminals of the housing.

39. The component assembly of claim 38, wherein the conversion substrate further includes a second portion and is flexible at least between the first and second portions, wherein the conversion substrate is folded around the acoustic transducer component such that the first portion attaches to the exterior top surface of the housing and the second portion attaches to the exterior bottom surface of the housing, and wherein the conversion substrate includes a trace electrically connected to at least one of the electrical terminals and to at least one of the electrical pads.

40. The component assembly of claim 38, further comprising a wire including a first end electrically connected to at least one of the electrical terminals and a second end electrically connected to at least one of the electrical pads.